NXP Semiconductors
Product specification
VHF variable capacitance diode
FEATURES
Excellent linearity
Small plastic SMD package
C25: 4.6 pF; ratio: 5.5.
APPLICATIONS
Electronic tuning in VHF television
tuners, band A up to 160 MHz.
3
handbook, halfpage
2
BBY40
1
2
n.c.
3
MAM170
1
DESCRIPTION
The BBY40 is a variable capacitance
diode, fabricated in planar
technology, and encapsulated in the
SOT23 small plastic SMD package.
Marking code:
S2.
Fig.1 Simplified outline (SOT23), pin configuration and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
V
R
I
F
T
stg
T
j
continuous reverse voltage
continuous forward current
storage temperature
operating junction temperature
PARAMETER
55
55
MIN.
MAX.
30
20
+150
+125
V
mA
C
C
UNIT
ELECTRICAL CHARACTERISTICS
T
j
= 25
C;
unless otherwise specified.
SYMBOL
I
R
r
s
C
d
C
d
3V
------------------
-
C
d
25V
Note
1. V
R
is the value at which C
d
= 25 pF.
PARAMETER
reverse current
diode series resistance
diode capacitance
capacitance ratio
CONDITIONS
V
R
= 28 V; see Fig.3
V
R
= 28 V; T
j
= 85
C;
see Fig.3
f = 200 MHz; note 1
V
R
= 3 V; f = 1 MHz; see Figs 2 and 4
f = 1 MHz
MIN.
26
5
TYP.
MAX.
10
200
0.7
32
6
6.5
UNIT
nA
nA
pF
pF
V
R
= 25 V; f = 1 MHz; see Figs 2 and 4 4.3
1996 May 03
2
NXP Semiconductors
Product specification
VHF variable capacitance diode
DATA SHEET STATUS
DOCUMENT
STATUS
(1)
Objective data sheet
Preliminary data sheet
Product data sheet
Notes
1. Please consult the most recently issued document before initiating or completing a design.
PRODUCT
STATUS
(2)
Development
Qualification
Production
DEFINITION
BBY40
This document contains data from the objective specification for product
development.
This document contains data from the preliminary specification.
This document contains the product specification.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DEFINITIONS
Product specification
The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
DISCLAIMERS
Limited warranty and liability
Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the
Terms and conditions of commercial
sale
of NXP Semiconductors.
Right to make changes
NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use
NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications
Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
1996 May 03
5
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