EEWORLDEEWORLDEEWORLD

Part Number

Search

KC2520K22.5792C10E00

Description
OSC XO 22.5792MHZ CMOS SMD
CategoryPassive components   
File Size171KB,3 Pages
ManufacturerKyocera
Environmental Compliance
Download Datasheet Parametric View All

KC2520K22.5792C10E00 Overview

OSC XO 22.5792MHZ CMOS SMD

KC2520K22.5792C10E00 Parametric

Parameter NameAttribute value
typeXO (Standard)
frequency22.5792MHz
FunctionStandby (power off)
outputCMOS
Voltage - Power1.6 V ~ 3.63 V
frequency stability±50ppm
Operating temperature-10°C ~ 70°C
Current - Power (maximum)3.5mA
grade-
Installation typesurface mount
Package/casing4-SMD, no leads
size/dimensions0.098" long x 0.079" wide (2.50mm x 2.00mm)
Height - Installation (maximum)0.032"(0.80mm)
Current - Power (disabled) (maximum)5µA
Handling Notes for Clock Oscillators
1. Shock & Drop • Vibration
Do not inflict excessive shock and mechanical vibration that
exceeds the norm, such as hitting or mistakenly dropping,
when transporting and mounting on a board. There are cases
when pieces of crystal break, and pieces that are used become
damaged, and become inoperable. When a shock or vibration
that exceeds the norm has been inflicted, make sure to check the
characteristics.
2. Cleaning
Since a crystal piece can be broken by resonance when a crystal
device is cleaned by ultrasonic cleaning, be careful when carrying
out ultrasonic cleaning.
3. Soldering conditions
To maintain the product reliability, please follow recommended conditions.
Standard soldering iron conditions
Clock Oscillators
Soldering iron
Time
280
°
C to 340
°
C
3
+
1/
0 sec. max.
Reflow conditions (Example)
0
Peak: 260
10
C
10 sec. max.
Temperature ( C)
180
0
10
C
230 C min.
40 sec. max.
120 sec. max.
Time (sec.)
Clock Oscillators
Recommended reflow Conditions vary depending upon products.
Please check with the respective specification for details.
4. Mounting Precautions
The lead of the device and the pattern of the board is soldered on the surface. Since extreme deformation of the board tears off the pattern,
tears off the lead metal, cracks the solder and damages the sealed part of the device and there are cases in which performance deteriorates
and operation fails, use it within the stipulated bending conditions. Due to the small cracks in the board resulting from mounting, please pay
sufficient attention when attaching a device at the position where the warping of the board is great.
When using an automatic loading machine, as far as possible, select a type that has a small impact and use it while confirming that there is
no damage.
Surface mount devices are NOT flow soldering compatible.
5. Storage Condition
Since the long hour high temperature and low temperature storage, as well as the storage at high humidity are causes of deterioration in
frequency accuracy and solderability.
Parts should be stored in temperature range of
5 to
+
40
°
C, humidity 40 to 60% RH, and avoid direct sunlight. Then use within 6 months.
As of March 2018
How to use the serial port to send data to adjust the PWM duty cycle
I need the program. It is not easy to adjust it by myself....
yidaoyizu Microcontroller MCU
Easy to get started with C language for microcontrollers
Easy to get started with C language for microcontrollers...
zhengda06 MCU
I want to buy a power supply. Does anyone have any recommendations?
I feel that the power supply in the company is not enough, so I am going to buy a power supply recently. My initial ideal is to buy a programmable linear regulated DC power supply with output short ci...
han0097 Power technology
stm8 simulation help
Is STVD good for emulating stm8s? How to use it? Is there any information to provide?...
刘笑笑 stm32/stm8
SinlinxA33 SD card programming
[b]Tools:[/b] [b] Burning software: PhoenixCard[/b] [b] Card reader[/b] [b] Image file[/b] [b] Follow the instructions[/b][b]Wait for burning to complete[/b][b][color=#5E7384]This content was original...
babyking Embedded System
Main causes of surface mount capacitor failure
What are the main causes of mechanical cracks in ceramic chip capacitors (MLCCs)? There are two main causes of mechanical cracks. The first is an extrusion crack, which occurs during the operation of ...
qwqwqw2088 Analogue and Mixed Signal

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 98  1218  1714  2634  81  2  25  35  54  19 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号