MicroLED
®
SMD LED, Single Color 0805 Package
2.0 mm x 1.25 mm x 0.7 mm
Certifications & Ratings
• RoHS compliant
599 Series
Features & Benefits
• Compatible with automatic placement equipment
• Packaged in 8 mm tape, 7" reel (4000 pcs/reel)
and 20 per strip
• Meets EIA-481-1 pkg. std.
Part Number Guide
RoHS Compliant
Dimensions
inches [mm]
.079 [2.0]
Tolerance
±0.2
mm unless otherwise noted
Package
5 9 9 - 0 1
Color
.039 [1.0]
X
1
2
3
4
6
8
9
X - 0 0 X F
Packaging Option
0
0
0
0
0
1
1
2
20 piece tape
7" reel
7
4000 pcs/reel
Red
Red-Orange
Orange
Yellow
1
.049
[1.25]
Polarity Mark
2
1
R 0.008
[R 0.20]
.03 [1.2]
2
.056 [1.4]
3°
.028 [0.7]
.012 [0.3]
1
Yellow-Green
+
–
Green
2
Blue
Tape
Tolerance
±0.1
mm unless otherwise noted
Soldering
.039
[1.0]
598 Series pkg 0805
.047
packg diagram scaled to 1:36
Feed Direction
.037
[0.94]
.079
[2.0]
.157
[4.0]
.061
[1.55]
[1.2]
Direction of
Light Emission
.069
[1.75]
.315
[8.0]
RF-AUB170TS-ED E2 RF-0046NP
2017-10-16.pdf
.207
[5.25]
Reflow Profile
Temp °C
250
0.126 [3.2]
Hand Soldering
Temperature: 300° C max.
Soldering time: 3 sec max.
(one time only)
.090
[2.28]
.056 [1.42]
Polarity Mark
time at peak 10 sec (max)
ramp up
3°C/sec (max)
time above 217 °C
60–150 sec
Top
of Tape
Tpeak = 260 °C
Reel
TL = 217 °C
200
Tsmax = 200 °C
Tolerance
±0.1
mm unless otherwise noted
150
5
p
.315 [8.0]
7.01
[178±1.0]
2.362
[60±1.0]
25
Tsmin=
150 °C
120 sec (max)
Pre-heat: ∆T: 150–200 °C
60 sec
(min)
R
2
ramp down
6 °C/sec (max)
598 Series pkg 0805
Time
packg diagram scaled to 1:36
RF-AUB170TS-ED E2 RF-0046NP
2017-10-16.pdf
.512
[13±0.5]
Total Time to Peak temp < 8 min.
∆T: 25–260 °C
Label
www.dialightsignalsandcomponents.com
60 sec
Electrical/Optical Characteristics
Dialight P/N
20-Piece Tape
599-0110-002F
599-0120-002F
599-0130-002F
599-0140-002F
599-0160-002F
599-0181-002F
599-0191-002F
7" Reel, 4000 pcs
599-0110-007F
599-0120-007F
599-0130-007F
599-0140-007F
599-0160-007F
599-0181-007F
599-0191-007F
Emitted Color
Material
Lens
Color
Luminous
Intensity
Min
15
90
AllnGaP
Non
Diffused
53
68
9
195
InGaN
68
105
Typ
29
138
95
112
43
340
Dominant
Wavelength
If = 20 ma
Min
625
620
600
585
562
520
465
Typ
633
625
605
590
569
525
470
Max
640
630
610
595
575
530
475
Forward
Voltage
Typ
2.1
2.1
2.1
2.1
2.1
3.2
3.2
Max
2.5
2.5
2.5
2.5
2.5
3.6
3.6
Thermal Reverse
Resistance Current
Viewing
Intensity
(°C / W)
Angle
(µA)
(°deg.)
Rth(j-s)
If=20 ma
(Ir) VR=5 V
Red
Red-Orange
Orange
Yellow
Yellow-Green
Green
Blue
140
450
10
Absolute Maximum Ratings @ Ts = 25 °C
Color
Power Dissipation (mW)
Forward Current (mA)
Reverse Voltage (V)
Operating Temp (°C)
Storage Temp (°C)
Peak Pulse Fw Current (mA)
Electrostatic Discharge
(HBM) (V)
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
10
20
30
Forward Voltage VF (V)
Forward Current (mA)
Forward Current vs.
Forward Voltage (Ta=25 °C)
30
black =
all other
colors
1.5
Green
Relative Intensity vs.
Forward Current (Ta=25 °C)
72
30
105
70
20
G - InGaN
B
B
O
Relative Intensity
Blue
1.0
black =
all other
colors
Yellow
Forward Current (mA)
20
Red,
R-O
5
-40 to +100
-40 to +100
60
2000
G - InGaN
1000
B
10
Y-G,
Red
0.5
Junction Temp (°C)
105
Maximum Forward Current vs.
Ambient Temperature
40
R/O
10
Relative Intensity vs.
Ambient Temperature
40°
Diagram Characteristics of Radiation
20°
0°
1.0
Forward Current (mA)
30
Relative Intensity
black =
all other
colors
Orange
1.0
black =
all other
colors
50°
0.8
0.6
70°
0.4
0.2
20
Blue
Red-Orange
10
0.5
0
20
40
60
80
100
120
0.1
-50
0
50
100
90°
0°
20°
40°
60°
80° 100°
Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
Dialight reserves the right to make changes at any time in order to supply the best product possible. The most current version of this document will always be available at:
www.dialightsignalsandcomponents.com
Warranty Statement:
Except for the warranty expressly provided for [herein/above/below], Dialight disclaims any and all other warranties, express or implied, including, without limitation, any warranties of merchantability, fitness
for a particular purpose, title, and noninfringement.
www.dialightsignalsandcomponents.com
Dialight_CBI_data_599-0805_Apr2018
Embedded System
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