ATBTLC1000XR/ZR
Ultra-Low Power BLE ATBTLC1000-XR1100A SiP/
ATBTLC1000-ZR110CA Module Datasheet
Introduction
The Microchip ATBTLC1000-XR1100A is an ultra-low power Bluetooth low energy System in a Package
(SiP) with Integrated MCU, Transceiver, Modem, MAC, PA, Transmit/Receive (T/R) Switch, and Power
Management Unit (PMU). It can be used as a Bluetooth Low Energy link controller or data pump with
external host MCU. The host interface between MCU and ATBTLC1000-XR1100A is a UART with
hardware flow control.
The Bluetooth SIG qualified protocol stack is stored in a dedicated ROM. The firmware includes L2CAP
service layer protocols, Security Manager, Attribute protocol (ATT), Generic Attribute Profile (GATT), and
the Generic Access Profile (GAP). Additionally, example applications are available for application profiles
such as proximity, thermometer, heart rate, blood pressure and many other SIG-defined profiles.
The ATBTLC1000-XR1100A provides a compact footprint and various embedded features such as a 26
MHz crystal oscillator. It provides the right solution for the customer, whose BLE design requires full
features, using low power consumption and minimal PCB space.
The ATBTLC1000-ZR110CA is a fully certified module that contains the ATBTLC1000-XR1100A and all
external circuitry required including a ceramic high-gain antenna. The user needs to place the module
into their PCB design, provide power, a 32.768 kHz Real Time Clock or crystal, and an I/O path for
interfacing with the host MCU.
Microchip BluSDK offers a comprehensive set of tools including reference applications for several
Bluetooth SIG-defined profiles and a custom profile. The BluSDK will help the user to quickly evaluate,
design and develop BLE products with the ATBTLC1000-XR1100A and ATBTLC1000-ZR110CA.
The ATBTLC1000-XR1100A and associated ATBTLC1000-ZR110CA module have passed the Bluetooth
SIG certification for interoperability with the Bluetooth Low Energy 4.2 specification.
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Features
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2.4 GHz Transceiver and Modem:
– -91.5 dBm receiver sensitivity
– -55 dBm to +3.5 dBm programmable TX output power
– Integrated T/R switch
– Single wire antenna connection (ATBTLC1000-XR1100A)
– Incorporated chip antenna (ATBTLC1000-ZR110CA)
Processor Features:
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– ARM Cortex M0 32-bit processor
– Serial Wire Debug (SWD) interface
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2018 Microchip Technology Inc.
Datasheet Complete
DS60001505B-page 1
ATBTLC1000XR/ZR
– Four-channel Direct Memory Access (DMA) controller
– Brown-out Detector and Power-on Reset (POR)
– Watchdog timer
Memory:
– 128 KB embedded Random Access Memory (RAM)
– 128 KB embedded ROM
Hardware Security Accelerators:
–
•
Advanced Encryption Standard (AES)-128
– Secure Hash Algorithm (SHA)-256
Peripherals:
–
22 digital and 4 mixed-signal General Purpose Input Outputs (GPIOs) with 96 kOhm internal
programmable pull up or down resistors and retention capability, and one wake-up GPIO with 96
kOhm internal pull up resistor
(1)
Two Serial Peripheral Interface (SPI) Master/Slave
(1)
Two Inter-Integrated Circuit (I
2
C) Master/Slave
Two UART
(1)
Three-axis quadrature decoder
(1)
Four Pulse Width Modulation (PWM) channels
(1)
Three General Purpose Timers and one Wake-up Timer
(1)
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•
–
–
–
–
–
–
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•
– 2-channel 11-bit Analog-to-Digital Converter (ADC)
(1)
Host Interface:
– Host MCU can control through UART with hardware flow control
– Only two microcontroller GPIO lines necessary
– One interrupt pin from ATBTLC1000, which can be used for host wake-up
Clock:
– Integrated 26 MHz RC oscillator
– Integrated 2 MHz RC oscillator
– 26 MHz crystal oscillator (XO)
– 32.768 kHz Real Time Clock crystal oscillator (RTC XO)
Ultra-Low Power:
– 1.88 µA sleep current
– 4.78 mA peak TX current
(2)
– 5.66 mA peak RX current
– 15.8 µA average advertisement current
(3)
Integrated Power Management:
– 1.8V to 4.3V battery voltage range
– Fully integrated Buck DC/DC converter
Temperature Range:
– -40°C to 85°C
Package:
– 49-pin FLGA SiP package 5.50 mm x4.50 mm
– 35-pin module package 10.541 mm x7.503 mm
BT SIG QDID:
73346
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©
2018 Microchip Technology Inc.
Datasheet Complete
DS60001505B-page 2
ATBTLC1000XR/ZR
Note:
1. Usage of this feature is not supported by the BluSDK. The datasheet will be updated once the support
for this feature is added in BluSDK.
2. TX output power - 0 dBm
3. Advertisement channels - 3 ; Advertising interval - 1 second ; Advertising event type - Connectable
undirected; Advertisement data payload size - 31 octets
©
2018 Microchip Technology Inc.
Datasheet Complete
DS60001505B-page 3
ATBTLC1000XR/ZR
Table of Contents
Introduction......................................................................................................................1
Features.......................................................................................................................... 1
1. Ordering Information..................................................................................................7
2. Package Information..................................................................................................8
3. Block Diagram........................................................................................................... 9
4. Pinout Information................................................................................................... 10
5. Device States.......................................................................................................... 15
5.1.
5.2.
5.3.
Description of Device States...................................................................................................... 15
Power-up/Power-down Sequence..............................................................................................15
Digital and Mixed-Signal I/O Pin Behavior during Power-Up Sequences.................................. 16
6. Host Microcontroller Interface..................................................................................18
7. Clocking...................................................................................................................20
7.1.
7.2.
7.3.
7.4.
Overview.................................................................................................................................... 20
26 MHz Crystal Oscillator (XO).................................................................................................. 20
32.768 kHz RTC Crystal Oscillator (RTC XO)............................................................................21
2 MHz Integrated RC Oscillator..................................................................................................26
8. CPU and Memory Subsystem................................................................................. 27
8.1.
8.2.
8.3.
ARM Subsystem.........................................................................................................................27
Memory Subsystem....................................................................................................................30
Non-Volatile Memory.................................................................................................................. 30
9. Bluetooth Low Energy Subsystem...........................................................................33
9.1.
9.2.
9.3.
BLE Core....................................................................................................................................33
BLE Radio.................................................................................................................................. 33
Microchip BluSDK...................................................................................................................... 34
10. External Interfaces...................................................................................................35
10.1.
10.2.
10.3.
10.4.
10.5.
10.6.
10.7.
10.8.
10.9.
Overview.................................................................................................................................... 35
I
2
C Master/Slave Interface......................................................................................................... 39
SPI Master/Slave Interface.........................................................................................................39
UART Interface...........................................................................................................................41
GPIOs.........................................................................................................................................41
Analog to Digital Converter........................................................................................................ 42
Software Programmable Timer and Pulse Width Modulator...................................................... 44
Clock Output...............................................................................................................................45
Three-axis Quadrature Decoder.................................................................................................46
©
2018 Microchip Technology Inc.
Datasheet Complete
DS60001505B-page 4
ATBTLC1000XR/ZR
11. Electrical Characteristics......................................................................................... 47
11.1.
11.2.
11.3.
11.4.
11.5.
11.6.
11.7.
11.8.
11.9.
Absolute Maximum Ratings........................................................................................................47
Recommended Operating Conditions........................................................................................ 47
DC Characteristics..................................................................................................................... 47
Current Consumption in Various Device States......................................................................... 49
Receiver Performance................................................................................................................50
Transmitter Performance............................................................................................................51
ADC Characteristics................................................................................................................... 52
ADC Typical Characteristics.......................................................................................................53
Timing Characteristics................................................................................................................ 55
12. Package Outline Drawings...................................................................................... 60
12.1. ATBTLC1000-XR1100A Package Outline Drawing.................................................................... 60
12.2. ATBTLC1000-ZR110CA Module Package Outline Drawing.......................................................61
13. ATBTLC1000 Schematics....................................................................................... 63
13.1.
13.2.
13.3.
13.4.
ATBTLC1000-XR1100A Reference Schematic.......................................................................... 63
ATBTLC1000-XR1100A Reference Schematic Bill of Materials (BOM)..................................... 63
ATBTLC1000-ZR110CA Reference Schematic..........................................................................65
ATBTLC1000-ZR110CA Reference Bill of Materials(BOM)........................................................65
14. ATBTLC1000-XR1100A Design Considerations......................................................67
14.1. Layout Recommendation........................................................................................................... 67
15. ATBTLC1000-ZR110CA Design Considerations..................................................... 69
15.1. Placement and Routing Guidelines............................................................................................ 69
15.2. Interferers................................................................................................................................... 70
16. Reflow Profile Information....................................................................................... 71
16.1.
16.2.
16.3.
16.4.
16.5.
Storage Condition.......................................................................................................................71
Stencil Design............................................................................................................................ 71
Soldering and Reflow Conditions............................................................................................... 71
Baking Conditions...................................................................................................................... 71
Module Assembly Considerations.............................................................................................. 72
17. ATBTLC1000-ZR110CA Module Regulatory Approval............................................ 73
17.1. United States..............................................................................................................................73
17.2. Canada.......................................................................................................................................74
17.3. Europe........................................................................................................................................76
18. Reference Documents and Support........................................................................ 78
18.1. Reference Documents................................................................................................................78
19. Document Revision History..................................................................................... 79
The Microchip Web Site................................................................................................ 81
Customer Change Notification Service..........................................................................81
©
2018 Microchip Technology Inc.
Datasheet Complete
DS60001505B-page 5
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