DataSheeT – enpirion® power solutions
EN6347QI 4A PowerSoC
Step-Down DC-DC Switching Converter with Integrated Inductor
DESCRIPTION
The EN6347QI is an Intel® Enpirion® Power System on
a Chip (PowerSoC) DC-DC converter. It integrates the
inductor, MOSFET switches, small-signal circuits and
compensation in an advanced 4mm x 7mm x 1.85mm
38-pin QFN package.
The EN6347QI is specifically designed to meet the
precise voltage and fast transient requirements of
present and future high-performance, low-power
processor, DSP, FPGA, memory boards and system
level applications in distributed power architectures.
The device’s advanced circuit techniques, high
switching frequency, and proprietary integrated
inductor technology deliver high-quality, ultra
compact, non-isolated DC-DC conversion.
Intel Enpirion Power Solutions significantly help in
system design and productivity by offering greatly
simplified board design, layout and manufacturing
requirements. In addition, a reduction in the number
of components required for the complete power
solution helps to enable an overall system cost
saving.
All Enpirion products are RoHS compliant and lead-
free manufacturing environment compatible.
FEATURES
•
Integrated Inductor, MOSFETs, Controller
•
1.5% V
OUT
Accuracy (Over Load and Temperature)
•
Up to 4A Continuous Operating Current
•
3 MHz Operating Frequency with Ext Clock Sync
•
High Efficiency (Up to 95%)
•
Frequency Synchronization to External Clock
•
Input Voltage Range (2.5V to 6.6V)
•
Programmable Light Load Mode
•
Output Enable Pin and Power OK
•
Programmable Soft-Start
•
Thermal Shutdown, Over-Current, Short Circuit,
and Under-Voltage Protection
•
RoHS Compliant, MSL Level 3, 260°C Reflow
APPLICATIONS
•
Point of Load Regulation for Low-Power, ASICs
Multi-Core and Communication Processors, DSPs,
FPGAs and Distributed Power Architectures
•
Low Voltage, Distributed Power Architectures
•
High Efficiency 12V Intermediate Bus
Architectures
•
Blade Servers, RAID Storage, Industrial Automation,
Embedded Computing, Wireless Communications
•
Beat Frequency/Noise Sensitive Applications
V
IN
EN6347QI
PVIN
ENABLE
AVIN
PGND
VOUT
R
A
V
OUT
C
A
Efficiency vs. Output Current
100
90
80
22µF
1206
VFB
PGND
EFFICIENCY (%)
70
60
50
40
30
20
10
0
0.01
CONDITIONS
V
IN
= 5V
VOUT = 3.3V LLM
VOUT = 3.3V PWM
47µF
1206
R
B
C
SS
LLM/
SS
AGND SYNC
75mm
2
0.1
1
10
OUTPUT CURRENT (A)
Figure 1. Simplified Applications Circuit
Page 1
05991
Figure 2. Highest Efficiency in Smallest Solution Size
May 15, 2019
Rev L
Datasheet | Intel® Enpirion® Power Solutions: EN6347QI
ORDERING INFORMATION
Part Number
EN6347QI
EVB-EN6347QI
Package Markings
EN6347
EN6347
T
J
Rating
-40°C to +125°C
Package Description
38-pin (4mm x 7mm x 1.85mm) QFN
QFN Evaluation Board
Packing and Marking Information:
https://www.intel.com/support/quality-and-reliability/packing.html
PIN FUNCTIONS
NC(SW)
RLLM
38
36
35
34
33
32
31
30
29
28
27
37
26
LLM / SYNC
25
NC(SW)
NC(SW)
NC(SW)
VFB
SS
ENABLE
NC(SW)
AGND
AVIN
POK
NC(SW)
NC(SW)
NC
NC
VOUT
VOUT
1
NC
NC
NC
NC
PVIN
PVIN
KEEP OUT
17
18
2
3
4
5
6
12
10
11
13
14
KEEP OUT
39
PGND
24
23
22
21
20
15
16
NC(SW)
PGND
PGND
PGND
PGND
PGND
PGND
VOUT
VOUT
VOUT
VOUT
VOUT
Figure 3. Pin Diagram (Top View)
NOTE A:
NC pins are not to be electrically connected to each other or to any external signal, ground or voltage. However,
they must be soldered to the PCB. Failure to follow this guideline may result in part malfunction or damage.
NOTE B:
Shaded area highlights exposed metal below the package that is not to be mechanically or electrically connected
to the PCB. Refer to Figure 11 for details.
NOTE C:
White ‘dot’ on top left is pin 1 indicator on top of the device package.
Page 2
05991
May 15, 2019
Rev L
PVIN
19
7
8
9
Datasheet | Intel® Enpirion® Power Solutions: EN6347QI
PIN DESCRIPTIONS
PIN
1,2, 12,
34-38
3,4,
22-25
5- 11
NAME
NC(SW)
TYPE
-
FUNCTION
NO CONNECT – These pins are internally connected to the common
switching node of the internal MOSFETs. They are not to be electrically
connected to any external signal, ground, or voltage. Failure to follow this
guideline may result in damage to the device.
NO CONNECT – These pins may be internally connected. Do not connect
to each other or to any other electrical signal. Failure to follow this
guideline may result in device damage.
Regulated converter output. Connect to the load and place output filter
capacitor(s) between these pins and PGND pins. Refer to the
Layout
Recommendation
section.
Input/Output power ground. Connect to the ground electrode of the input
and output filter capacitors. See VOUT and PVIN pin descriptions for more
details.
Input power supply. Connect to input power supply. Decouple with input
capacitor to PGND pin. Refer to the
Layout Recommendation
section.
Dual function pin providing LLM Enable and External Clock
Synchronization (see Application Section). At static Logic HIGH, device will
allow automatic engagement of light load mode. At static logic LOW, the
device is forced into PWM only. A clocked input to this pin will synchronize
the internal switching frequency to the external signal. If this pin is left
floating, it will pull to a static logic high, enabling LLM.
Input Enable. Applying logic high enables the output and initiates a soft-
start. Applying logic low discharges the output through a soft-shutdown.
Power OK is an open drain transistor used for power system state
indication. POK is logic high when VOUT is within -10% of VOUT nominal.
Programmable LLM engage resistor to AGND allows for adjustment of load
current at which Light-Load Mode engages. Can be left open for PWM only
operation.
A soft-start capacitor is connected between this pin and AGND. The value
of the capacitor controls the soft-start interval. Refer to
Soft-Start
Operation
in the Functional Description section for more details.
External Feedback Input. The feedback loop is closed through this pin. A
voltage divider at VOUT is used to set the output voltage. The midpoint of
the divider is connected to VFB. A phase lead capacitor from this pin to
VOUT is also required to stabilize the loop.
Ground for internal control circuits. Connect to the power ground plane
with a via right next to the pin.
Input power supply for the controller. Connect to input voltage at a quiet
point. Refer to the
Layout Recommendation
section.
NC
-
VOUT
Power
13-18
19-21
PGND
PVIN
Ground
Power
26
LLM/SYNC
Analog
27
28
29
ENABLE
POK
RLLM
Analog
Digital
Analog
30
SS
Analog
31
VFB
Analog
32
33
AGND
AVIN
Power
Power
Page 3
05991
May 15, 2019
Rev L
Datasheet | Intel® Enpirion® Power Solutions: EN6347QI
PIN
39
NAME
PGND
TYPE
Ground
FUNCTION
Power ground thermal pad. Not a perimeter pin. Connect thermal pad to
the system GND plane for heat-sinking purposes. Refer to the
Layout
Recommendation
section.
ABSOLUTE MAXIMUM RATINGS
CAUTION:
Absolute Maximum ratings are stress ratings only. Functional operation beyond the recommended
operating conditions is not implied. Stress beyond the absolute maximum ratings may impair device
life. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
Absolute Maximum Pin Ratings
PARAMETER
PVIN, AVIN, VOUT
ENABLE, POK, LLM/SYNC, PG
VFB, SS, RLLM, VDDB
SYMBOL
MIN
-0.3
-0.3
-0.3
MAX
7.0
V
IN
+0.3
2.5
UNITS
V
V
V
Absolute Maximum Thermal Ratings
PARAMETER
Maximum Operating Junction
Temperature
Storage Temperature Range
Reflow Peak Body Temperature
(10 Sec) MSL3 JEDEC J-STD-020A
-65
CONDITION
MIN
MAX
+150
+150
+260
UNITS
°C
°C
°C
Absolute Maximum ESD Ratings
PARAMETER
HBM (Human Body Model)
CDM (Charged Device Model)
CONDITION
MIN
±2000
±500
MAX
UNITS
V
V
Page 4
05991
May 15, 2019
Rev L
Datasheet | Intel® Enpirion® Power Solutions: EN6347QI
RECOMMENDED OPERATING CONDITIONS
PARAMETER
Input Voltage Range
Output Voltage Range
Output Current Range
Operating Ambient Temperature Range
Operating Junction Temperature
SYMBOL
V
IN
V
OUT
I
OUT
T
A
T
J
-40
-40
MIN
2.5
0.75
MAX
6.6
V
IN
– V
DO
(1)
4
+85
+125
UNITS
V
V
A
°C
°C
THERMAL CHARACTERISTICS
PARAMETER
Thermal Shutdown
Thermal Shutdown Hysteresis
Thermal Resistance: Junction to Ambient (0 LFM)
(2)
Thermal Resistance: Junction to Case (0 LFM)
SYMBOL
T
SD
T
SDHYS
θ
JA
θ
JC
TYPICAL
160
35
30
3
UNITS
°C
°C
°C/W
°C/W
(1)
V
DO
(dropout voltage) is defined as (I
LOAD
x Droput Resistance). Please refer to Electrical Characteristics Table.
(2)
Based on 2oz. external copper layers and proper thermal design in line with EIJ/JEDEC JESD51-7 standard for high
thermal conductivity boards.
Page 5
05991
May 15, 2019
Rev L
京公网安备 11010802033920号
EEWORLD
