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SMDSWLF.020 1OZ

Description
SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
CategoryTools and equipment   
File Size105KB,3 Pages
ManufacturerChip Quik
Environmental Compliance
Download Datasheet Parametric View All

SMDSWLF.020 1OZ Overview

SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.

SMDSWLF.020 1OZ Parametric

Parameter NameAttribute value
typebonding wire
componentSn96.5Ag3Cu0.5(96.5/3/0.5)
diameter0.020"(0.51mm)
melting point423 ~ 428°F(217 ~ 220°C)
Flux typeNo cleaning required
Wire gauge24 AWG,25 SWG
CraftsmanshipLead-free
formSpool, 1 oz (28.35g)
shelf lifenot applicable
Shelf life start date-
Storage/refrigeration temperature-
delivery information-
weight0.062 lbs (28.12g)
SMDSWLF.020 1OZ
Datasheet revision 1.6
www.chipquik.com
Solder Wire SAC305 No-Clean with 2.2% Flux Core 1oz Spool
Product Highlights
No-Clean Water-Washable
Synthetic Flux Core
The clear, non-corrosive, non-conductive residue is meant to be left on the board. Residues that do remain are water soluble
if you want to remove them. Clean with hot water at 60°C (140°F) minimum.
2.2% flux core
Halogen content: None
RoHS II and REACH compliant
Specifications
Alloy:
Wire Diameter:
Flux Type:
Flux Classification:
Melting Point:
Packaging:
Sn96.5/Ag3.0/Cu0.5
0.020” (0.5mm)
No-Clean Water-Washable Synthetic
ROL0
217-220°C (423-428°F)
1 oz spool
Test Results
Test J-STD-004 or other
requirements as stated
Copper Mirror
Corrosion
Quantitative Halides
Electrochemical Migration
Surface Insulation Resistance 85°C,
85% RH @ 168 Hours
Visual
Conflict Minerals Compliance
REACH Compliance
Test Requirement
IPC-TM-650: 2.3.32
IPC-TM-650: 2.6.15
IPC-TM-650: 2.3.28.1
IPC-TM-650: 2.6.14.1
IPC-TM-650: 2.6.3.7
IPC-TM-650: 3.4.2.5
Electronic Industry Citizenship
Coalition (EICC)
Articles 33 and 67 of Regulation (EC)
No 1907/2006
Result
L: No breakthrough
L: No corrosion
L: <0.5%
L: <1 decade drop (No-clean)
L: ≥100MΩ (No-clean)
Clear and free from precipitation
Compliant
Contains no substance >0.1% w/w that
is listed as a SVHC or restricted for
use in solder materials
Conforms to the following Industry Standards:
J-STD-004B, Amendment 1 (Solder Fluxes):
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):
RoHS 2 Directive 2011/65/EU:
Yes
Yes
Yes
1
© 1994-2018 Chip Quik® Inc.
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