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509

Description
PROTO BOARD COPPER CLAD 6" X 6"
CategoryDevelopment board/suite/development tools   
File Size230KB,4 Pages
ManufacturerMG Chemicals
Websitehttps://www.mgchemicals.com
Environmental Compliance
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509 Overview

PROTO BOARD COPPER CLAD 6" X 6"

509 Parametric

Parameter NameAttribute value
Prototype board typeCopper clad, uncoated
size/dimensions6.00" x 6.00"(152.4mm x 152.4mm)
Board thickness0.062"(1.57mm) 1/16"
MaterialSingle clad copper FR4, 1 oz.
Copper Clad Boards
500 Series Technical Data Sheet
500 Series
Description
The
500 Series Copper Clad Boards
are made of a laminate consisting of continuous woven glass cloth
impregnated with epoxy resin. The boards are made of FR4 which is a flame retardant version of G-10
material.
Applications & Usages
The boards are ideal for prototyping and small production runs. It is used by PCB manufacturers, design
engineers, hobbyists, and students.
Benefits and Features
Complies with UL
(file number E214381)
and IPC-4101C/21
DICY (dicyandiamide) Cured System
Easy to cut with no specialized equipment required
UV blocking
Available in 1 oz (1.37 mil, 35 µm) and ½ oz (0.67 mil, 17 µm) copper cladding
Comes in 1/16" (1.60 mm) and 1/32" (0.80 mm) laminate thicknesses
Properties
Physical Properties
Moisture Absorption
Flammability
Thermal Properties
Glass Transition Temperature (T
g
)
CTE prior T
g
, z-axis
CTE after T
g
, z-axis
Total Expansion (50-260 °C), z-axis
Time to Delamination T260
Time to Delamination T288
Thermal Degradation via TGA
Thermal Stress @288 °C
Maximum Operating Temp. (MOT)
Method
IPC-TM-650 2.6.2.1
UL-94
Method
IPC-TM-650 2.4.25
IPC-TM-650 2.4.24
"
"
IPC-TM-650 2.4.24.1
"
ASTM D 3850
IPC-TM-650 2.4.13.1
UL 94
Specification
<0.80%
94V-0
Specification
>110
>10 s
Value
0.25%
V0
Value
140 °C
50 ppm/°C
250 ppm/°C
3.75%
20 min
2 min
310 °C
300 s
130 °C
Page
1
of
4
Date: 16 March 2017 / Ver. 2.01
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