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FIN1019MTCX

Description
IC DRVR/RCVR3.3V LVDS HS 14TSSOP
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size1MB,14 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance
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FIN1019MTCX Overview

IC DRVR/RCVR3.3V LVDS HS 14TSSOP

FIN1019MTCX Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerON Semiconductor
package instructionTSSOP-14
Manufacturer packaging code948G
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time1 week
Samacsys Confidence4
Samacsys StatusReleased
Samacsys PartID741811
Samacsys Pin Count14
Samacsys Part CategoryIntegrated Circuit
Samacsys Package CategorySmall Outline Packages
Samacsys Footprint Name14-Lead, Thin Shrink Small Outline Package (TSSOP))_1
Samacsys Released Date2017-10-26 09:25:22
Is SamacsysN
Differential outputYES
Number of drives1
High level input current maximum value0.00002 A
Input propertiesDIFFERENTIAL
Interface integrated circuit typeLINE TRANSCEIVER
Interface standardsEIA-644; TIA-644
JESD-30 codeR-PDSO-G14
JESD-609 codee4
length5 mm
Humidity sensitivity level1
Number of functions1
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Minimum output swing0.25 V
Maximum output low current0.008 A
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum receive delay2.5 ns
Number of receiver bits1
Maximum seat height1.2 mm
Maximum slew rate12.5 mA
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
maximum transmission delay1.5 ns
width4.4 mm
Base Number Matches1
FIN1019 3.3V LVDS High Speed Differential Driver/Receiver
April 2001
Revised September 2001
FIN1019
3.3V LVDS High Speed Differential Driver/Receiver
General Description
This driver and receiver pair are designed for high speed
interconnects utilizing Low Voltage Differential Signaling
(LVDS) technology. The driver translates LVTTL signals to
LVDS levels with a typical differential output swing of
350mV and the receiver translates LVDS signals, with a
typical differential input threshold of 100mV, into LVTTL
levels. LVDS technology provides low EMI at ultra low
power dissipation even at high frequencies. This device is
ideal for high speed clock or data transfer.
Features
s
Greater than 400Mbs data rate
s
3.3V power supply operation
s
0.5ns maximum differential pulse skew
s
2.5ns maximum propagation delay
s
Low power dissipation
s
Power-Off protection
s
100mV receiver input sensitivity
s
Fail safe protection open-circuit, shorted and terminated
conditions
s
Meets or exceeds the TIA/EIA-644 LVDS standard
s
Flow-through pinout simplifies PCB layout
s
14-Lead SOIC and TSSOP packages save space
Ordering Code:
Order Number
FIN1019M
FIN1019MTC
Package Number
M14A
MTC14
Package Description
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Function Table
Inputs
R
IN+
L
H
X
D
IN
L
H
X
Open
Circuit or Z
H
=
HIGH Logic Level
Z
=
High Impedance
Connection Diagram
Outputs
RE
L
L
H
L
DE
H
H
L
H
D
OUT+
L
H
Z
L
R
OUT
L
H
Z
H
D
OUT−
H
L
Z
H
R
IN−
H
L
X
Fail Safe Condition
Pin Descriptions
Pin Name
D
IN
D
OUT+
D
OUT−
DE
R
IN+
R
IN−
R
OUT
RE
V
CC
GND
NC
Description
LVTTL Data Input
Non-inverting LVDS Output
Inverting LVDS Output
Driver Enable (LVTTL, Active HIGH)
Non-Inverting LVDS Input
Inverting LVDS Input
LVTTL Receiver Output
Receiver Enable (LVTTL, Active LOW)
Power Supply
Ground
No Connect
L
=
LOW Logic Level
X
=
Don’t Care
Fail Safe
=
Open, Shorted, Terminated
© 2001 Fairchild Semiconductor Corporation
DS500506
www.fairchildsemi.com

FIN1019MTCX Related Products

FIN1019MTCX
Description IC DRVR/RCVR3.3V LVDS HS 14TSSOP
Brand Name ON Semiconductor
Is it lead-free? Lead free
Is it Rohs certified? conform to
Maker ON Semiconductor
package instruction TSSOP-14
Manufacturer packaging code 948G
Reach Compliance Code compliant
ECCN code EAR99
Factory Lead Time 1 week
Samacsys Confidence 4
Samacsys Status Released
Samacsys PartID 741811
Samacsys Pin Count 14
Samacsys Part Category Integrated Circuit
Samacsys Package Category Small Outline Packages
Samacsys Footprint Name 14-Lead, Thin Shrink Small Outline Package (TSSOP))_1
Samacsys Released Date 2017-10-26 09:25:22
Is Samacsys N
Differential output YES
Number of drives 1
High level input current maximum value 0.00002 A
Input properties DIFFERENTIAL
Interface integrated circuit type LINE TRANSCEIVER
Interface standards EIA-644; TIA-644
JESD-30 code R-PDSO-G14
JESD-609 code e4
length 5 mm
Humidity sensitivity level 1
Number of functions 1
Number of terminals 14
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Minimum output swing 0.25 V
Maximum output low current 0.008 A
Package body material PLASTIC/EPOXY
encapsulated code TSSOP
Encapsulate equivalent code TSSOP14,.25
Package shape RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED
power supply 3.3 V
Certification status Not Qualified
Maximum receive delay 2.5 ns
Number of receiver bits 1
Maximum seat height 1.2 mm
Maximum slew rate 12.5 mA
Maximum supply voltage 3.6 V
Minimum supply voltage 3 V
Nominal supply voltage 3.3 V
surface mount YES
Temperature level INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING
Terminal pitch 0.65 mm
Terminal location DUAL
Maximum time at peak reflow temperature NOT SPECIFIED
maximum transmission delay 1.5 ns
width 4.4 mm
Base Number Matches 1
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