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5363-2MMX50M

Description
ACF 2.0MMX50M 0.079"X165'
Categoryaccessories   
File Size149KB,5 Pages
Manufacturer3M
Websitehttp://3M.com/esd
Environmental Compliance
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5363-2MMX50M Overview

ACF 2.0MMX50M 0.079"X165'

Technical Data
November 2013
3M
Anisotropic Conductive Film 5363
Product Description
3M™ Anisotropic Conductive Film (ACF) 5363 is a
heat-bondable, electrically conductive adhesive film.
The unbonded film is non-tacky at room temperature
and consists of a thermoset-thermoplastic adhesive
matrix randomly loaded with conductive particles. These
particles allow inter-connection of circuit lines through
the adhesive thickness, but are spaced far enough
apart for the product to be electrically insulating in the
plane of the adhesive. Application of heat and pressure
causes the adhesive to flow and to bring the circuit pads
into contact by trapping the conductive particles. The
adhesive rapidly cures at modest bonding temperature.
The 3M ACF 5363 may be used to bond a flexible printed
circuit to another flexible printed circuit or to a printed
circuit board.
Typical Physical Properties and
Performance Characteristics
Note:
The following technical information and data should
be considered representative or typical only and
should not be used for specification purposes.
Design Requirements
Property
Minimum Space Between
Conductors
Minimum Pitch
Minimum Pad Area
Value
100
(4)
200
(8)
0.15
(240)
Units
micron
(mil)
micron
(mil)
sq. mm
(sq. mil)
Ambient Physical Properties
Property
(1)
Interconnect
Resistance
Peel Strength
(4)
Test Substrates
Flex-to-
PC board
(2)
Flex-to-
PC board
(2)
Value
Test Method
< 20 mOhms 3M TM-2314
(3)
> 700 gf/cm 3M TM-2313
(5)
Construction
General Properties
Property
Adhesive Type
Particle Type
Particle Size
Liner Type
Adhesive Thickness
Liner Thickness
Value
(1)
Thermosetting Type
Gold-Coated Nickel
10 micron
Polyester Film with Silicone Release
40 micron
50 micron
(4)
(5)
(2)
(3)
For a given application, values may differ depending on particular substrate
material or type of circuitry.
Measured for gold/nickel/copper polyimide flex circuits bonded to printed
circuit board. Contact overlap area was 0.15 sq. mm. Pad pitch was 200
microns.
3M internal test method TM-2314 based on test method IPC 650 – Section
2.6.24. The flex has the shorting strap located near the bond-line to
approximate a 4-wire test structure and eliminate most extraneous
resistance in the measurement due to the circuit lines.
Results listed for minimum bonding conditions of 160°C x 5 sec. Higher
values are possible with increase in bonding temperature or time.
3M internal test method TM-2313 based on test method IPC 650 –
Section 2.4.9.1.
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