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74VCXH16244MTDX

Description
IC BUF NON-INVERT 3.6V 48TSSOP
Categorysemiconductor    logic   
File Size157KB,10 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance
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74VCXH16244MTDX Overview

IC BUF NON-INVERT 3.6V 48TSSOP

74VCXH16244MTDX Parametric

Parameter NameAttribute value
logical typeBuffer, non-inverting
Number of components4
bits per component4
input type-
Output typeThree states
Current - output high, low24mA,24mA
Voltage - Power1.2 V ~ 3.6 V
Operating temperature-40°C ~ 85°C(TA)
Installation typesurface mount
Package/casing48-TFSOP (0.240", 6.10mm wide)
Supplier device packaging48-TSSOP
74VCXH16244 Low Voltage 16-Bit Buffer/Line Driver with Bushold
November 1999
Revised June 2005
74VCXH16244
Low Voltage 16-Bit Buffer/Line Driver with Bushold
General Description
The VCXH16244 contains sixteen non-inverting buffers
with 3-STATE outputs to be employed as a memory and
address driver, clock driver, or bus oriented transmitter/
receiver. The device is nibble (4-bit) controlled. Each nibble
has separate 3-STATE control inputs which can be shorted
together for full 16-bit operation.
The VCXH16244 data inputs include active bushold cir-
cuitry, eliminating the need for external pull-up resistors to
hold unused or floating data inputs at a valid logic level.
The 74VCXH16244 is designed for low voltage (1.2V to
3.6V) V
CC
applications with output capability up to 3.6V.
The 74VCXH16244 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
s
1.2V to 3.6V V
CC
supply operation
s
3.6V tolerant control inputs and outputs
s
Bushold on data inputs eliminating the need for external
pull-up/pull-down resistors
s
t
PD
2.5 ns max for 3.0V to 3.6V V
CC
s
Static Drive (I
OH
/I
OL
)
r
24 mA @ 3.0V V
CC
s
Uses patented noise/EMI reduction circuitry
s
Latch-up performance exceeds 300 mA
s
ESD performance:
Human body model
!
2000V
Machine model
!
200V
s
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Order Number
74VCXH16244G
(Note 1)(Note 2)
74VCXH16244MTD
(Note 2)
Package Number
BGA54A
(Preliminary)
MTD48
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 1:
Ordering Code “G” indicates Tray.
Note 2:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
© 2005 Fairchild Semiconductor Corporation
DS500230
www.fairchildsemi.com

74VCXH16244MTDX Related Products

74VCXH16244MTDX 74VCXH16244MTD
Description IC BUF NON-INVERT 3.6V 48TSSOP IC BUF NON-INVERT 3.6V 48TSSOP
logical type Buffer, non-inverting Buffer, non-inverting
Number of components 4 4
bits per component 4 4
Output type Three states Three states
Current - output high, low 24mA,24mA 24mA,24mA
Voltage - Power 1.2 V ~ 3.6 V 1.2 V ~ 3.6 V
Operating temperature -40°C ~ 85°C(TA) -40°C ~ 85°C(TA)
Installation type surface mount surface mount
Package/casing 48-TFSOP (0.240", 6.10mm wide) 48-TFSOP (0.240", 6.10mm wide)
Supplier device packaging 48-TSSOP 48-TSSOP
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