583-4"X60YD datasheet, PDF - EEWORLD Datasheet

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583-4"X60YD: DescriptionTHERMAL BONDING FILM 4"X60YD; Categoryaccessories; File Size155KB，10 Pages; Manufacturer3M; Websitehttp://3M.com/esd; Environmental Compliance

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583-4"X60YD Overview

THERMAL BONDING FILM 4"X60YD

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Technical Data

March 2015

™

Thermal Bonding Film 583

Product Description

3M™ Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermoplastic bonding film. It can

be heat or solvent activated for bonding. This film can also be lightly crosslinked using a post heat exposure. This

crosslinking will provide additional heat and solvent resistance as well as somewhat higher shear strengths.

3M TBF 583 must be stored at or below 4°C (40°F) for maximum storage life.

Key Features

• Flexible

• Heat or solvent activation

• Can be die-cut

• Slight surface tack

• Heat crosslinkable option

• Lower temperature lamination of the nitrile phenolic film range

Typical Physical Properties

Note:

The following technical information and data should be considered representative or typical only and should not

be used for specification purposes.

Product

Base Resin

Adhesive Thickness

Tack

Color

Construction

3M™ Thermal Bonding Film 583

Nitrile phenolic

2 mil (0.05 mm)

Slight

Brown

2 mil adhesive

3 mil silicone paper liner

Before Crosslinking

Tensile (psi)

Elongation (%)

Modulus (psi)

2 Lb. Dead Load Overlap Shear Heat Resistance

• Tensile and elongation conducted on Sintech 5/GL at 0.2"/minute speed. ASTM D638.

• 2 lb. dead load overlap shear conducted in oven environment (reference ASTM D4502-85).

After Crosslinking

3,140

180

13,800

>149°C (300°F)

400

800

240

71°C (160°F)

™

Thermal Bonding Film 583

Application Equipment Suggestions

Note:

Appropriate application equipment can enhance bonding film performance. We suggest the following equipment

for the user’s evaluation in light of the user’s particular purpose and method of application.

The type of application equipment used to bond 3M™ Thermal Bonding Film 583 will depend on the application involved

and on the type of equipment available to the user. Thin films and flexible substrates can be bonded using a heated roll

laminator where heat and pressure can be varied to suit the application. Larger, thicker substrates can be bonded using

a heated static press or, in some cases, an autoclave. For applications where a shaped adhesive is to be transferred to

a flat or three-dimensional part, a hot shoe or thermode method may be appropriate.

It is recommended that whatever method of bonding is chosen by the user, the optimum bonding conditions

should be predetermined with substrates specific to user’s application.

Directions For Use – Heat Activation

To make a bond, remove the liner and place the adhesive film between the two substrates. The bond is then made through

heat and pressure using a heated press, a hot roll laminator, a hot shoe thermode method or similar equipment.

Alternatively, the adhesive can be first tacked (lightly bonded) to one of the substrates using low heat, the liner can

then be removed and second substrate placed to the exposed adhesive surface, and a bond made using heat and

pressure. Since 3M TBF 583 has a slight surface tack, in some cases it may be tacked to a substrate with pressure

only (no heat).

Suggested TACKING Conditions

38°C to 49°C (100°F to 120°F) bondline temperature

2-5 seconds dwell time

5-20 psi pressure

For optimum bonding, the heat, pressure and dwell time for using 3M TBF 583 will depend upon the type and thickness

of the substrates being bonded together.

A suggested starting point, however, is to use the bonding conditions described below.

Suggested BEGINNING Bonding Conditions

107°C to 149°C (225°F to 300°F) bondline temperature

2-5 seconds dwell time

15-20 psi pressure

(2)

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