Tape and Packing
Product
Transistor / MOSFET
Package HSMT8
Type TB
1. Components description (Only for reference)
3.3
(8)
(7)
(6)
(5)
0.8
3.3
3.0
1pin mark
(1)
(2)
(3)
(4)
0.2
Unit
：
mm
1.75±0.1
2. Taping dimensions
Φ1.5
+0.1
-0
4.0±0.1
2.0±0.05
8.0±0.1
0.3±0.05
9.2±0.1
12.0
+0.3
-0.1
5.5±0.05
3.7±0.1
3.7±0.1
Φ1.5 Min.
1.1±0.1
Unit
：
mm
Note) Feed holes might be cover with the adhesive tape, but nothing will affect for using by that.
3. Tape and packing specification
3-1. Direction of tape winding
1pin on the reel side. The direction shall be one in a reel.
3-2. Cumulative pitch tolerance
The cumulative pitch tolerance of the mold for producing the carrier tape shall be within ±0.2mm
per 10pitches.
3-3. The minimum radius to bend the carrier tape
Carrier tape shall be flexible enough to protect from no component and damage under a minimum
radius of 30mm. However it shall be defined only inside of carrier tape．
3-4. The material of carrier tape
Special carbon paints are coated both sides of polystyrene.
3-5. Failure Rate
Incidence
Continuous missing
Discontinuous missing
0%
Max.0.1%／reel
Remark
Except
leader and trail portion
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2016.1 - Rev.A
HSMT8 Tape Packing:TB
10. Taping Peeling Strength
Peeling strength : 0.1N½1.3N
（If
products have stored over our recommended storage condition.）
【Test
condition
（Based
on JIS C 0806-3）】
Pull direction at angle from 165°to 180°and pull the seal tape with the speed of 300mm/min±10mm/min.
Seal tape
165°½ 180°
Pull Direction
Emboss Carrier
11. Recommended storage condition
Recommended storage condition :
Temperature 5℃ - 40℃, Humidity 30%RH - 80%RH
Recommended storage time period :
Five years after production
Notes） It is strongly recommended to confirm solderability before using products of which storage time
is exceeding recommended storage time period.
12. Package
3kpcs
×
5 reel = 15kpcs
15kpcs
×
2 inner box = 30kpcs
(Unit : mm)
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2016.1 - Rev.A
Notice
Notes
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifica-
tions :
3) Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
7) The Products specified in this document are not designed to be radiation tolerant.
8) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
9) Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
11) ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
12) Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
13) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
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