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CDM4-600LR TR13

Description
MOSFET N-CH 4A 600V DPAK
Categorysemiconductor    Discrete semiconductor   
File Size1005KB,4 Pages
ManufacturerCentral Semiconductor
Environmental Compliance
Download Datasheet Parametric View All

CDM4-600LR TR13 Overview

MOSFET N-CH 4A 600V DPAK

CDM4-600LR TR13 Parametric

Parameter NameAttribute value
FET typeN channel
technologyMOSFET (metal oxide)
Drain-source voltage (Vdss)600V
Current - Continuous Drain (Id) at 25°C4A(Tc)
Drive voltage (maximum Rds On, minimum Rds On)10V
Rds On (maximum value) when different Id, Vgs950 milliohms @ 2A, 10V
Vgs (th) (maximum value) when different Id4V @ 250µA
Gate charge (Qg) at different Vgs (maximum value)11.59nC @ 10V
Vgs (maximum value)30V
Input capacitance (Ciss) at different Vds (maximum value)328pF @ 100V
FET function-
Power dissipation (maximum)38W(Tc)
Operating temperature-55°C ~ 150°C(TJ)
Installation typesurface mount
Supplier device packagingDPAK
Package/casingTO-252-3, DPak (2 leads + tab), SC-63
CDM4-600LR
SURFACE MOUNT SILICON
N-CHANNEL
LR POWER MOSFET
4.0 AMP, 600 VOLT
w w w. c e n t r a l s e m i . c o m
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CDM4-600LR is a
600 Volt N-Channel MOSFET designed for high voltage,
fast switching applications such as Power Factor
Correction (PFC), lighting and power inverters. This
UltraMOS
TM
MOSFET combines high voltage capability
with ultra low rDS(ON), low threshold voltage, and low
gate charge for optimal efficiency.
MARKING: FULL PART NUMBER
DPAK CASE
APPLICATIONS:
Power Factor Correction
Alternative energy inverters
Solid State Lighting (SSL)
FEATURES:
High voltage capability (VDS=600V)
Low gate charge (Qgs=2.04nC TYP)
Ultra low rDS(ON) (0.65Ω TYP)
MAXIMUM RATINGS:
(TC=25°C unless otherwise noted)
SYMBOL
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
Continuous Drain Current (Steady State)
ID
Maximum Pulsed Drain Current, tp=10μs
IDM
Continuous Source Current (Body Diode)
IS
Maximum Pulsed Source Current (Body Diode)
ISM
Single Pulse Avalanche Energy (Note 1)
EAS
Power Dissipation
PD
Operating and Storage Junction Temperature
Thermal Resistance
Thermal Resistance
Note 1: L=30mH, IAS=3.5A, VDD=100V, RG=25Ω, Initial TJ=25°C
600
30
4.0
13.5
4.0
13.5
197
38
-55 to +150
3.29
110
UNITS
V
V
A
A
A
A
mJ
W
°C
°C/W
°C/W
TJ, Tstg
Θ
JC
Θ
JA
ELECTRICAL CHARACTERISTICS:
(TC=25°C unless otherwise noted)
SYMBOL
TEST CONDITIONS
MIN
TYP
I
GSSF, IGSSR VGS=30V, VDS=0
IDSS
VDS=600V, VGS=0
0.065
BVDSS
VGS=0, ID=250μA
600
VGS(th)
VSD
rDS(ON)
Crss
Ciss
Coss
VGS=VDS, ID=250μA
VGS=0, IS=4.0A
VGS=10V, ID=2.0A
VDS=100V, VGS=0, f=1.0MHz
VDS=100V, VGS=0, f=1.0MHz
VDS=100V, VGS=0, f=1.0MHz
2.0
3.25
0.86
0.65
1.31
328
26
MAX
100
1.0
4.0
1.4
0.95
UNITS
nA
μA
V
V
V
Ω
pF
pF
pF
R2 (10-August 2015)

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