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FAN48632UC33X

Description
IC CONV GSM PA 16CSP
CategoryAnalog mixed-signal IC    The signal circuit   
File Size1MB,15 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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FAN48632UC33X Overview

IC CONV GSM PA 16CSP

FAN48632UC33X Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
MakerON Semiconductor
package instructionVFBGA, BGA16,4X4,16
Manufacturer packaging code567SY
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time5 weeks
Analog Integrated Circuits - Other TypesANALOG CIRCUIT
control modeCURRENT-MODE
JESD-30 codeS-PBGA-B16
JESD-609 codee1
length1.78 mm
Humidity sensitivity level1
Number of functions1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Maximum output current1.5 A
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA16,4X4,16
Package shapeSQUARE
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height0.625 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.35 V
Nominal supply voltage (Vsup)3 V
surface mountYES
Maximum switching frequency3000 kHz
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.4 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width1.78 mm
Base Number Matches1
Is Now Part of
To learn more about ON Semiconductor, please visit our website at
www.onsemi.com
Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor
product management systems do not have the ability to manage part nomenclature that utilizes an underscore
(_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain
device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated
device numbers. The most current and up-to-date ordering information can be found at
www.onsemi.com.
Please
email any questions regarding the system integration to
Fairchild_questions@onsemi.com.
ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number
of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right
to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON
Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out
of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor
is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

FAN48632UC33X Related Products

FAN48632UC33X FAN48632BUC33X FAN48632UC35X
Description IC CONV GSM PA 16CSP IC CONV GSM PA 16CSP IC CONV GSM PA 16CSP
Brand Name ON Semiconductor ON Semiconductor ON Semiconductor
Is it lead-free? Lead free Lead free Lead free
package instruction VFBGA, BGA16,4X4,16 VFBGA, BGA16,4X4,16 WLCSP-16
Manufacturer packaging code 567SY 567SY 567SY
Reach Compliance Code compliant compliant compliant
ECCN code EAR99 EAR99 EAR99
Factory Lead Time 5 weeks 19 weeks 17 weeks
Analog Integrated Circuits - Other Types ANALOG CIRCUIT ANALOG CIRCUIT ANALOG CIRCUIT
control mode CURRENT-MODE CURRENT-MODE CURRENT-MODE
JESD-30 code S-PBGA-B16 S-PBGA-B16 S-PBGA-B16
JESD-609 code e1 e1 e1
length 1.78 mm 1.78 mm 1.78 mm
Humidity sensitivity level 1 1 1
Number of functions 1 1 1
Number of terminals 16 16 16
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Maximum output current 1.5 A 1.5 A 1.5 A
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA VFBGA VFBGA
Encapsulate equivalent code BGA16,4X4,16 BGA16,4X4,16 BGA16,4X4,16
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED 260
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 0.625 mm 0.625 mm 0.625 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.35 V 2.35 V 2.35 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V
surface mount YES YES YES
Maximum switching frequency 3000 kHz 3000 kHz 3000 kHz
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL
Terminal pitch 0.4 mm 0.4 mm 0.4 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED 30
width 1.78 mm 1.78 mm 1.78 mm
Base Number Matches 1 1 1
Maker ON Semiconductor - ON Semiconductor
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