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SMCJ1.5KE250CA-TP

Description
TVS DIODE 214V 344V DO214AB
CategoryCircuit protection   
File Size321KB,5 Pages
ManufacturerMicro Commercial Co
Environmental Compliance
Download Datasheet Parametric View All

SMCJ1.5KE250CA-TP Overview

TVS DIODE 214V 344V DO214AB

SMCJ1.5KE250CA-TP Parametric

Parameter NameAttribute value
typeZina
two-way channel1
Voltage - Reverse OFF (Typical)214V
Voltage - Breakdown (minimum)237V
电压 - 箝位(最大值)@ Ipp344V
Current - Peak Pulse (10/1000µs)4.4A
Power - Peak Pulse1500W(1.5kW)
Power line protectionnone
applicationUniversal
Capacitance at different frequencies-
Operating temperature-55°C ~ 175°C(TJ)
Installation typesurface mount
Package/casingDO-214AB,SMC
Supplier device packagingDO-214AB(SMC)
MCC
Features
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
SMCJ1.5KE6.8(C)A
THRU
SMCJ1.5KE550(C)A
Transient
Voltage Suppressor
6.8 to 550 Volts
1500 Watt
DO-214AB
(SMC) (LEAD
FRAME)
G
For surface mount applicationsin in or der to optimize
board space
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Low profile package
Fast response time: typical less than 1.0ps from 0 volts to
V
BR
minimum
Halogen
free available upon request by adding suffix "-HF"
Low inductance
Excellent clamping capability
UL Recognized File # E480232
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals: solderable per MIL-STD-750, Method 2026
Polarity: Color band denotesposit ive end (cathode)
except Bidirectional
Maximum soldering temperature: 260 C for 10 seconds
o
H
D
A
C
Maximum Ratings @ 25 C Unless Otherwise Specified
Peak Pulse Current on
I
PP
See Table 1 Note:
2
10/1000us waveform
Peak Pulse Power
P
PP
1500W
Note:
2
3
Dissipation
Operation And Storage T
J
, T
STG
-55
o
C to
Temperature Range
+175
o
C
Typical Thermal
R
thJL
15
o
C/W
Resistance Junction
to Lead
Typical Thermal
R
thJA
75
O
C/W
Resistance Junction
to Ambient
o
E
B
F
DIMENSIONS
INCHES
MIN
.079
.108
.002
.006
.030
..305
.260
.220
MM
MIN
2.00
2.75
0.051
0.152
0.76
7.75
6.60
5.59
DIM
A
B
C
D
E
F
G
H
MAX
.103
.128
.008
.012
.060
.320
.280
.245
MAX
2.62
3.25
0.203
0.305
1.52
8.13
7.11
6.22
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.190
0.125”
NOTES:
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
0.070”
2.
3.
Non-repetitive current pulse, per Fig.3 and derated above
o
T
A
=25 C per Fig.2.
2
Mounted on 8.0mm copper pads to each terminal.
www.mccsemi.com
Revision:
G
1 of 5
2015/12/30
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