RBD, RBF, RBH Series
Ultra Precision SMT Current Sense Resistor (Flip-Chip)
TCR, RESISTANCE RANGE, TOLERANCE,
RATED POWER
Type
TCR (ppm/°C)
–25°C to 125°C*
0±25 (J)
RBD
0±10 (C)
0±25 (J)
0±25 (J)
Resistance
Range
(Ω)
0.01 to 0.1
0.1 to 1
0.01 to 0.1
0.1 to 1
0.01 to 0.1
Resistance
Tolerance
(%)*
±1 (F) ±2 (G)
±5 (J)
±0.5 (D) ±1 (F)
±2 (G) ±5 (J)
±1 (F) ±2 (G)
±5 (J)
±0.5 (D) ±1 (F)
±2 (G) ±5 (J)
±0.5 (D) ±1 (F)
±2 (G) ±5 (J)
Rated
Power
(W)
at 70°C
RBH
0.5
RBF
RBD
RBF
0±10 (C)
0±25 (J)
0±10 (C)
0±25 (J)
1
COMPOSITION OF TYPE NUMBER
RBH
1.5
*Symbols parenthesized are for type number composition.
RBF J R1000 F L
POWER DERATING CURVE
Resistance value in ohm is expressed by a series of four
significant digits and an R designates the decimal point.
CONFIGURATION
(DIMENSIONS IN mm)
L
W
1
T
Type
L
W
L
1
L
2
L
1
L
2
W
1
T
Type
L
W
L
1
L
2
W
1
W
2
L
1
L
2
W
3
I: Current Sensing Terminal
V: VoltageTerminal
T
W
W
3.2±0.1
2.5±0.1
0.5±0.2
2.1±0.2
2.4±0.2
RBD
6.3±0.1
3.2±0.1
0.7±0.2
4.7±0.2
3.0±0.2
RBF
1.05 max.
Dimensions in mm
TEMPERATURE OF RESISTOR SURFACE
Temperature Measurement
(in still air)
T (°C)
80
70
Temperature Rise
60
50
40
30
20
RBD
RBF
RBH
Mounted on Aluminum Board
(100 mm x 40 mm x 2.0 mmt)
Mounting
Board
Center of
Element Surface
(Glazed Epoxy Board)
RBD
RBF
RBH
R
R
R
= 42.8°C/W
= 38.0°C/W
= 46.2°C/W
L
W
2
W
1
V
I
V
I
T
RBH
7.5±0.1
6.0±0.1
1.4±0.2
4.4±0.2
1.4±0.2
0.7±0.2
3.6±0.2
1.5 max.
Dimensions in mm
Mounted on Glazed Epoxy Board
(100 mm x 40 mm x 1.6 mmt)
CONSTRUCTION
5
4
2
1
6
3
1 Ceramic Substrate (High-Purity Alumina)
2 Heat-Resistant Bonding Layer
3 Bulk
®
Metal Foil
4 Metal Plating
5 Solder
6 Solder-Resist
W
3
10
0.5
1.0
Applied Power
1.5
(W)
Please use board made of metal for continuous use with 2W at 70°C.
Please keep the temperature of board less than 90°C when using the
glazed epoxy board.
www.alpha-elec.co.jp
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For any questions, contact
sales-alpha@alpha-elec.co.jp
Document No: 67011
Revision: 25-Apr-2016
RBD, RBF, RBH Series
PERFORMANCE
ALPHA
ALPHA Typical
Specification
Test Data
Maximum Rated Operating Temperature
70°C
Working Temperature Range
–65°C to +155°C
Thermal Shock
±0.1%
±0.03%
–65°C/30 min.
↔
+155°C/30 min., 5 cycles
Overload
±0.1%
±0.03%
Rated Voltage x 2.5, 5 sec.
Low Temperature Storage and Operation
–65°C, No Load, 24 hrs.→ Rated Voltage, 45 min.
±0.1%
±0.05%
Substrate Bending Test
±0.1%
±0.05%
Substrate Bent 3 mm, 60 sec.
Dielectric Withstanding Voltage
Atmo. Pres.: AC 200V, 1 min.
±0.05%
±0.01%
Insulation Resistance
DC 100V, 1 min.
over 10,000 MΩ over 10,000 MΩ
Resistance to Soldering Heat
260°C, 10 sec.
±0.1%
±0.03%
Moisture Resistance
+65°C to –10°C, 90% RH to 98% RH, Rated Voltage, 10 cycles (240 hrs.)
±0.1%
±0.03%
Parameters
Test Condition
Shock
Vibration, High Frequency
Life
Storage Life
High Temperature Exposure
100G, 6 ms, Sawtooth Wave, X, Y, Z, each 10 shocks
20G, 10 Hz to 2,000 Hz to 10 Hz, 20 min., X, Y, Z, each 2.5 hrs.
70°C, Rated Power, 1.5 hr. – ON, 0.5 hr. – OFF, 2,000 hrs
15°C to 35°C, 15% RH to 75% RH, No Load, 10,000 hrs.
155°C, No Load, 2,000 hrs.
±0.05%
±0.05%
±0.1%
±0.05%
±0.1%
±0.01%
±0.01%
±0.05%
±0.01%
±0.05%
TAPE AND REEL PACKAGE
(BASED ON EIA-481-1) (DIMENSIONS IN mm)
Tape Dimensions
Reel Dimensions
Reel Capacity | RBH: 1,000 pieces/reel | RBD, RBF: 4,000 pieces/reel
Type
RBD
RBF
RBH
A0
2.85
±0.1
3.4
±0.1
6.3
±0.1
B0
3.7
±0.1
6.7
±0.1
7.8
±0.1
W
8.0
±0.2
12.0
±0.2
16.0
±0.2
F
3.5
±0.05
5.5
±0.05
7.5
±0.1
E
1.75
±0.1
1.75
±0.1
1.75
±0.1
P1
4.0
±0.1
4.0
±0.1
8.0
±0.1
P2
2.0
±0.05
2.0
±0.05
2.0
±0.1
P0
4.0
±0.1
4.0
±0.1
4.0
±0.1
D0
Dia.1.5
+0.1-0
Dia.1.5
+0.1-0
Dia.1.5
+0.1-0
Type
RBD
RBF
RBH
A
N
B
C
D
2.0
±0.5
2.0
±0.5
2.0
±0.5
Dia.178 Dia.60 Dia.13 Dia.21
±2
min.
±0.5
±0.8
Dia.178 Dia.60 Dia.13 Dia.21
±2
min.
±0.5
±0.8
Dia.178 Dia.60 Dia.13 Dia.21
±2
min.
±0.5
±0.8
W1
8.4
+2.0-0
12.4
+2.0-0
17.0
±0.3
W2
14.4
max.
18.4
max.
19.4
±0.1
r
1.0
±0.5
1.0
±0.5
1.0
±0.5
PRECAUTION IN USING SMD CURRENT SENSE RESISTORS
1. Storage
Storage condition or environment may adversely affect solderability of
the exterior terminals. Do not store in high temperature and humidity.
The recommended storage environment is lower than 40°C, has less
than 70% RH humidity and is free from harmful gases such as sulphur
and chlorine.
2. Caution in Soldering
➊
Solder Reflow in Furnace
Recommended
• Peak Temperature: 250+0/-5°C
• Holding time: 10 sec. max.
• To cool gradually at room temperature.
➋
Dipping in Solder (Wave or Still)
Recommended
• Temp. of Solder: 260°C max.
• Length of Dipping: 10 sec.
➌
Other
Soldering iron is never recommended. Corrosion-free flux such
as rosin is recommended.
3. Cleaning
Use volatile cleaner such as methylalcohol or propylalcohol.
4. Circuit Board Design
➊
Solder Land Dimensions
The dimensions of solder land must be determined in conformity with
the size of resistors and with the soldering method. They are also
subject to the mounting machine and the material of the substrate.
See example at right.
RBD, RBF
RBH
D
E
C
B
A
C
B
Type
RBD
RBF
RBH
A
2.6 to 2.8
3.4 to 3.6
3.8 to 4.0
B
0.8
1.2
2.0
Dimensions in mm
C
D
2.0
4.5
4.0
0.5
➋
Circuit Design
It is recommended that the circuit be drawn so that current may
approach, cross and go away from the mounted resistor in one
direction as illustrated below. Thicker copper foil should be used
if possible.
Document No: 67011
Revision: 25-Apr-2016
For any questions, contact
sales-alpha@alpha-elec.co.jp
www.alpha-elec.co.jp
13
A
E
1.7
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Embedded System
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