EEWORLDEEWORLDEEWORLD

Part Number

Search

FW-08-05-G-D-405-130-A-P-TR

Description
.050'' BOARD SPACERS
CategoryThe connector   
File Size852KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric View All

FW-08-05-G-D-405-130-A-P-TR Overview

.050'' BOARD SPACERS

FW-08-05-G-D-405-130-A-P-TR Parametric

Parameter NameAttribute value
Number of pins16
spacing0.050"(1.27mm)
Number of rows2
spacing0.050"(1.27mm)
Length - Overall Pin0.535"(13.589mm)
Length - Post (Mating)0.130"(3.302mm)
Length - overlap height0.405"(10.287mm)
Length - solder tail-
Installation typesurface mount
Terminationwelding
Contact Plating - Post (Mating)gold
Contact Plating Thickness - Post (Mating)10.0µin (0.25µm)
colorblack
F-219
FW–20–05–F–D–610–065
FW–12–05–G–D–530–101
(1.27 mm) .050"
FW-SM SERIES
SMT MICRO BOARD STACKER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?FW-SM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over 50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
RoHS Compliant:
Yes
Board Mates:
CLP, FLE
Cable Mates:
FFSD
Low-profile or
skyscraper styles
APPLICATIONS
Variable
board spacing
MATED
HEIGHT
FW
CLP
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-30)
(0.15 mm) .006" max (31-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
MATED
CLP HEIGHT*
(8.13)
FW-XX-03-X-X-233-065
.320
–02
(9.91)
FW-XX-03-X-X-303-065
.390
*Processing conditions will affect mated height.
LEAD STYLE
FW
(1.27 mm x 1.27 mm)
.050" x .050" micro pitch
Surface
mount
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
FW
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
D
STACKER
HEIGHT
POST
HEIGHT
OPTION
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Smaller stack heights
02 thru 50
= Gold flash on post,
Matte Tin on tail
–F
–L
–“XXX”
= Stacker
Height
(in inches)
= Post Height
(in inches)
(1.65 mm)
.065"
minimum
Example:
–065
= (1.65 mm)
.065"
–“XXX”
LEAD STACKER
STYLE HEIGHT
–03
–05
STACKER
HEIGHT
(5.46) (8.51) (7.11) (10.16)
.215 to .335
.280 to .400
(8.64) (15.49) (10.29) (17.15)
.340 to .610
.405 to .675
= 10 µ" (0.25 µm)
Gold on post,
Matte Tin on tail
Example:
–250
= (6.35 mm)
.250"
= End Shroud
(–075 post height only.
Mate only with CLP)
(5.46 mm) .215" to
(15.49 mm) .610"
stacker height only
9 pins/row min.
= End Shroud
with Guide Post
(–075 post height only.
Mate only with CLP.)
(5.46 mm) .215"
to (15.49 mm) .610"
stacker height only)
9 pins/row min.
= Alignment Pin
(3 positions min.)
(5.46 mm) .215" to
(15.75 mm) .620"
stacker height only
= Pick & Place Pad
(5 positions min.)
= Tape & Reel
(Max overall height =
Post+Stacker Height+
Pad+Alignment Pin =
.700 (17.78))
–ES
02
No. of positions x
(1.27) .050
= 10 µ" (0.25 µm)
Gold on post,
Gold flash on tail
100
–G
–EP
(3.42)
.135
(1.27)
.050
01
(1.19)
.047
(1.27) .050
(0.41) .016 SQ
99
(4.76)
.188
POST HEIGHT
(1.65) .065
MIN
(4.27)
.168
(0.76)
.030
(3.45)
.136
x
(5.08)
.200
(4.06)
.160
–A
–ES
(3.05)
.120
(1.91)
.075
DIA
–P
(0.86)
.034
Notes:
For added mechanical stability,
Samtec recommends
mechanical board spacers be
used in applications with gold or
selective gold plated connectors.
Contact ipg@samtec.com for
more information.
This Series is non-standard,
non-returnable.
–P
STACKER
HEIGHT
(2.51)
.099
(2.92)
.115
–TR
–EP
Due to technical progress, all designs, specifications and components are subject to change without notice.
(0.89)
.035
DIA
–A
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Microcontroller peripheral circuit design and C language programming video tutorial content directory V2
[i=s] This post was last edited by paulhyde on 2014-9-15 09:08 [/i] Contents of the video tutorial on microcontroller peripheral circuit design and C language programming V2. If you think it is good, ...
200730241235 Electronics Design Contest
Highly Integrated Power Management Unit for Portable Applications
This article introduces a new packaging technology for power management chips and a highly integrated power management solution with multiple built-in power management and communication interfaces. It...
siliu234 Power technology
LPC1500 Experience + HID Application
[i=s] This post was last edited by WoAiXiaoXiao on 2014-7-2 13:03 [/i] I posted a post before. I got an LPC1549 development board last time. Now there is an event, so I reposted the original post. I h...
我爱下载 NXP MCU
IPTV accelerates broadband Internet
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 20:03[/i]...
newlooking Mobile and portable
Solution to the abnormal display of LaunchPad_Temp_GUI.exe in WIN7
Let me first explain the operating system used by the original poster: WIN7 Ultimate (according to the original poster's analysis, LaunchPad_Temp_GUI.exe may not be compatible with WIN7). It has been ...
feiling208 Microcontroller MCU
Regarding similar model driver issues, such as STM8L052
[i=s]This post was last edited by weizhongc on 2015-10-14 16:08[/i] On stm32 or stm8, st has done a very good job. There are many choices for each MCU. However, the peripheral resources in the same se...
weizhongc stm32/stm8

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2659  1045  1212  1205  1247  54  22  25  26  39 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号