product has no designed protection against radioactive rays
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TSZ02201-0232AH500640-1-2
19.Jan.2018 Rev.002
BM92A56MWV-Z
Contents
General Description ........................................................................................................................................................................ 1
W (Typ) x D(Typ) x H(Max) ..................................................................................................................................... 1
Circuit Power Characteristics .......................................................................................................................................... 8
3.
Digital Pin DC Characteristics ......................................................................................................................................... 9
4.
Power Supply Management .......................................................................................................................................... 10
Voltage Detection .......................................................................................................................................................... 14
Power FET Gate Driver ................................................................................................................................................. 15
Power On Sequence (Non Dead Battery Operation)..................................................................................................... 16
2.
Power On Sequence (Dead Battery Operation) ............................................................................................................ 16
Power Off Sequence ..................................................................................................................................................... 17
Application Example ..................................................................................................................................................................... 18
Selection of Components Externally Connected ........................................................................................................................... 18
Reverse Connection of Power Supply........................................................................................................................... 23
2.
Power Supply Lines ...................................................................................................................................................... 23
3.
Ground Voltage ............................................................................................................................................................. 23
Inrush Current ............................................................................................................................................................... 23
7.
Operation Under Strong Electromagnetic Field ............................................................................................................. 23
8.
Testing on Application Boards ....................................................................................................................................... 23
9.
Inter-pin Short and Mounting Errors .............................................................................................................................. 24
11. Regarding the Input Pin of the IC .................................................................................................................................. 24
13. Area of Safe Operation (ASO) ...................................................................................................................................... 24
14. Over Current Protection Circuit (OCP) .......................................................................................................................... 24
Ordering Information ..................................................................................................................................................................... 25
Physical Dimension and Packing Information ............................................................................................................................... 26
Revision History ............................................................................................................................................................................ 27
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