MLX90316LDC-BCS-000-SP datasheet, PDF

Datasheet> All Categories > The sensor> MLX90316LDC-BCS-000-SP

MLX90316LDC-BCS-000-SP: DescriptionIC SENSOR INTERFACE ROTARY 8SOIC; CategoryThe sensor; File Size858KB，48 Pages; ManufacturerMelexis Technologies NV; Environmental Compliance

Download Datasheet Parametric View All

MLX90316LDC-BCS-000-SP Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	MLX90316LDC-BCS-000-SP	-	-	View	Buy Now

MLX90316LDC-BCS-000-SP Overview

IC SENSOR INTERFACE ROTARY 8SOIC

MLX90316LDC-BCS-000-SP Parametric

Parameter Name	Attribute value
for measurement	rotation position
technology	Hall Effect
Angle of rotation - electrical, mechanical	0° ~ 360°, continuous
linear range	-
output	Analog voltage
output signal	-
Actuator type	External magnet, not included
linearity	±1°
Resistor tolerance	-
Voltage - Power	4.5 V ~ 5.5 V
Installation type	surface mount
Terminal type	SMD (SMT) connector
Operating temperature	-40°C ~ 150°C

Preview

Download Datasheet

View All

MLX90316 Rotary Position Sensor IC

Datasheet

Features and Benefits



Absolute Rotary Position Sensor IC

Simple & Robust Magnetic Design

Tria⊗is® Hall Technology

Programmable Angular Range up to 360

Degrees

Programmable Linear Transfer Characteristic

Selectable Analog (Ratiometric), PWM, Serial

Protocol

12 bit Angular Resolution - 10 bit Angular

Thermal Accuracy

40 bit ID Number

Single Die – SOIC-8 Package RoHS Compliant

Dual Die (Full Redundant) – TSSOP-16 Package

RoHS Compliant

Description

The MLX90316 is a Tria⊗is® Rotary Position

Sensor providing the absolute angular position of

a small dipole magnet rotating above the device

surface (end-of-shaft magnet).

Thanks to an Integrated Magneto-Concentrator

(IMC) on its surface, the monolithic device senses,

in a contactless fashion, the horizontal component

of the applied magnetic flux density.

This unique sensing principle applied to a rotary

position sensor results into an impressive

robustness of the angular position over the

mechanical (airgap, off-axis) tolerances.

The rotation of this horizontal component is

sensed over a wide range (up to 360 Deg. -

complete revolution) and processed by the on-

chip DSP (Digital Signal Processing) to ultimately

report the absolute angular position of the

magnet either as a ratiometric analog output or as

PWM (Pulse-Width Modulation) signal or as a 14-

bit data accessible through a 3-pin SPI (serial

interface) channel.

The output transfer characteristic is fully

programmable (e.g. offset, gain, clamping levels,

linearity, thermal drift, filtering, range...) to match

any specific requirement through end-of-line

calibration. The Melexis programming unit PTC-04

communicates and calibrates the device

exclusively through the connector terminals (V

-O

DIG

SOIC-8

TSSOP-16

Applications



Absolute Rotary Position Sensor

Steering Wheel Position Sensor

Pedal Position Sensor

Motor-shaft Position Sensor

Throttle Position Sensor

Float-Level Sensor

Ride Height Position Sensor

Non-Contacting Potentiometer

Prot.

3V3

Reg

DSP

MUX

Triaxis

RAM

EEPROM

Output Stage

12 bit Analog

OUT1

MOSI/MISO

OUT2

SCLK

Switch Out

/SS

ADC

µC

12 bit PWM

SPI

ROM - Firmware

MLX90316 Rotary Position Sensor IC

Datasheet

Contents

Features and Benefits................................................................................................................................... 1

Applications .................................................................................................................................................. 1

Description ................................................................................................................................................... 1

1. Ordering Information ............................................................................................................................... 5

2. Functional Diagram .................................................................................................................................. 6

3. Glossary of Terms ..................................................................................................................................... 7

4. Pinout ....................................................................................................................................................... 8

5. Absolute Maximum Ratings ...................................................................................................................... 9

6. Electrical Specification ............................................................................................................................ 10

7. Isolation Specification............................................................................................................................. 12

8. Timing Specification................................................................................................................................ 12

9. Accuracy Specification ............................................................................................................................ 13

10. Magnetic Specification ......................................................................................................................... 14

11. CPU & Memory Specification ............................................................................................................... 14

12. End-User Programmable Items ............................................................................................................ 15

13. Description of End-User Programmable Items ..................................................................................... 17

13.1. Output Mode ............................................................................................................................... 17

13.1.1. Analog Output Mode ............................................................................................................. 17

13.1.2. PWM Output Mode ............................................................................................................... 18

13.1.3. Serial Protocol Output Mode ................................................................................................. 18

13.1.4. Switch Out .............................................................................................................................. 19

13.2. Output Transfer Characteristic .................................................................................................... 19

13.2.1. CLOCKWISE Parameter .......................................................................................................... 20

13.2.2. Discontinuity Point (or Zero Degree Point) ........................................................................... 20

13.2.3. LNR Parameters ..................................................................................................................... 21

13.2.4. CLAMPING Parameters .......................................................................................................... 21

13.2.5. DEADZONE Parameter ........................................................................................................... 22

13.2.6. Output 2 (MLX90316xDC-BCS ONLY) .................................................................................... 22

13.3. Identification ................................................................................................................................ 23

13.4. Sensor Front-End ......................................................................................................................... 23

13.4.1. HIGHSPEED Parameter........................................................................................................... 23

REVISION 011 – AUGUST 17, 2017

Page 2 of 48

MLX90316 Rotary Position Sensor IC

Datasheet

13.4.2. ARGC, AUTO_RG, RoughGain and FORCECRA75 Parameters ............................................... 24

13.4.3. RGThresL, RGThresH Parameters .......................................................................................... 24

13.5. FILTER ........................................................................................................................................... 25

13.5.1. Hysteresis Filter ...................................................................................................................... 25

13.5.2. FIR Filters ................................................................................................................................ 25

13.5.3. IIR Filters ................................................................................................................................. 27

13.6. Programmable Diagnostic Settings.............................................................................................. 28

13.6.1. RESONFAULT Parameter ........................................................................................................ 28

13.6.2. EEHAMHOLE Parameter ........................................................................................................ 28

13.7. Lock .............................................................................................................................................. 28

13.7.1. MLXLOCK Parameter .............................................................................................................. 28

13.7.2. LOCK Parameter ..................................................................................................................... 28

14. Self Diagnostic ...................................................................................................................................... 29

15. Serial Protocol ...................................................................................................................................... 32

15.1. Introduction ................................................................................................................................. 32

15.2. SERIAL PROTOCOL Mode ............................................................................................................. 32

15.3. MOSI (Master Out Slave In) ......................................................................................................... 32

15.4. MISO (Master In Slave Out) ......................................................................................................... 32

15.5. /SS (Slave Select) .......................................................................................................................... 32

15.6. Master Start-Up ........................................................................................................................... 32

15.7. Slave Start-Up .............................................................................................................................. 33

15.8. Timing ........................................................................................................................................... 33

15.9. Slave Reset ................................................................................................................................... 34

15.10. Frame Layer ............................................................................................................................... 34

15.10.1. Command Device Mechanism ............................................................................................. 34

15.10.2. Data Frame Structure .......................................................................................................... 34

15.10.3. Timing ................................................................................................................................... 35

15.10.4. Data Structure ...................................................................................................................... 35

15.10.5. Angle Calculation ................................................................................................................. 36

15.10.6. Error Handling ...................................................................................................................... 36

16. Recommended Application Diagrams .................................................................................................. 37

16.1. Analog Output Wiring in SOIC-8 Package .................................................................................... 37

16.2. Analog Output Wiring in TSSOP-16 Package ............................................................................... 38

REVISION 011 – AUGUST 17, 2017

Page 3 of 48

MLX90316 Rotary Position Sensor IC

Datasheet

16.3. PWM Low Side Output Wiring ..................................................................................................... 38

16.4. Serial Protocol .............................................................................................................................. 39

16.4.1. SPI Version – Single Die .......................................................................................................... 39

16.4.2. SPI Version – Dual Die ............................................................................................................ 40

16.4.3. Non SPI Version (Standard Version) ...................................................................................... 41

17. Standard information regarding manufacturability of Melexis products with different soldering

processes ............................................................................................................................................... 42

18. ESD Precautions.................................................................................................................................... 42

19. Package Information............................................................................................................................. 43

19.1. SOIC-8 - Package Dimensions ...................................................................................................... 43

19.2. SOIC-8 - Pinout and Marking ....................................................................................................... 43

19.3. SOIC-8 - IMC Positionning ............................................................................................................ 44

19.4. TSSOP-16 - Package Dimensions ................................................................................................. 45

19.5. TSSOP-16 - Pinout and Marking................................................................................................... 46

19.6. TSSOP-16 - IMC Positionning ....................................................................................................... 46

20. Disclaimer ............................................................................................................................................. 48

21. Contact ................................................................................................................................................. 48

REVISION 011 – AUGUST 17, 2017

Page 4 of 48

Recommended Resources

Technical Analysis of Semiconductor Wide Bandgap

Headphone amplifier circuit diagram based on NE5532

Bipolar long-distance measurement signal forwarding circuit

Music IC as a delay light controller circuit

TA7252P audio IC circuit diagram

Programmable current source circuit diagram

Ultrasonic Distance Measuring UR-V10 Instruction Manual: [align=left][color=#000000][/color] [/align][align=left][color=#000000][/color] [/align][align=left][color=#000000][ /color] [/align][align=left][color=#000000][/color] [/align][align=left][color=#000...; 覃先生 51mcu

Sorry for bothering you all, I'm stuck on the problem of sending SMS back to the MCU through the module.: The microcontroller serial port is connected to the sim100 module. I can send text messages normally by sending instructions to sim100 through the microcontroller serial port. However, when I use the ...; hurry145 Embedded System

Please advise on the issue of LPC1114 driving SD card: LPC1114, the board from ZLG, uses P0.3 - CS P0.6 - SCK P0.8 - MISO P0.9 - MOSI I used TKstudioThe SSP part can drive 595, no problem, but it cannot drive SD card. The SD driver part is ZLG's SD card d...; ldqmoon NXP MCU

EEWORLD大学堂----From 0 to 1: Raspberry Pi and the Internet of Things: From 0 to 1: Raspberry Pi and the Internet of Things：https://training.eeworld.com.cn/course/6038An Internet-Of-Things course for everyone - accessible yet serious, to take you from absolute beginner t...; 桂花蒸 MCU

Electrical short circuit drying method in transformer maintenance: [:P] When repairing burnt faults of electrical equipment such as transformers, motors, and generators, the electrical short-circuit drying method often requires rewinding part or all of the windings. ...; fighting Analog electronics

Things that make you angry: [font=微软雅黑][size=4]Dry weather in winter, spicy food (such as hot pot), heating, smog... make people who live in the north all year round often have some physical discomfort symptoms - sore throat, re...; lightxixi Talking

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components