ATS-11F-62-C1-R0 datasheet, PDF

Datasheet> All Categories > Thermal management products> ATS-11F-62-C1-R0

ATS-11F-62-C1-R0: DescriptionHEATSINK 40X40X15MM L-TAB; CategoryThermal management products; File Size119KB，1 Pages; ManufacturerERP; Environmental Compliance

Download Datasheet Parametric View All

ATS-11F-62-C1-R0 Overview

HEATSINK 40X40X15MM L-TAB

ATS-11F-62-C1-R0 Parametric

Parameter Name	Attribute value
type	top installation
cooling package	Classification (BGA, LGA, CPU, ASIC...)
Joining method	Push your feet
shape	square, fins
length	1.575"（40.00mm）
width	1.575"（40.00mm）
diameter	-
Height from base (fin height)	0.590"（15.00mm）
Power dissipation at different temperature rises	-
Thermal resistance at different forced airflows	16.45°C/W @ 100 LFM
Thermal resistance under natural conditions	-
Material	aluminum
Material plating	blue anodized

Preview

Download Datasheet

View All

pushPIN™ Heat Sink Assembly

ATS Part#:

ATS-11F-62-C1-R0

Description:

pushPIN™ HS ASMBLY,FINE-PITCH,STRAIGHT, HOLE PATTERN:LEFT-TABBED,BLUE,NO TIM

Heat Sink Type:

pushPIN™ Heat Sink Assembly

Heat Sink Attachment:

pushPIN™ / Spring Kit

Features & Benefits

Quick Attachment – Push pins feature a flexible barb at the end designed to

engage with pre-drilled holes in a PCB.

Compression Springs add the necessary force to hold the assembly together

for secure attachment. Select from over 21 different springs to achieve

precise force required.

Push Pin Material available in brass or plastic in 10 sizes ranging from 9-

20mm in length. Stainless steel hardware kit available for more secure

attachment. Visit www.qats.com for available options.

Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine

pitch HS designed for high velocity air flows and 98 course pitch HS

designed for low velocity air flow conditions.

Pre-assembled with phase-changing material for increased thermal

performance. Double-sided thermal tape and no TIM options available to

meet application-specific requirements.

Lightweight, aluminum HS extruded from AL6063 provide optimal heat

transfer with a blue anodized finish.

All components are RoHS and REACH compliant.

Industry standard hole pattern. Recommended through hole size is 3.175mm

For Illustration Purposes ONLY.

Bill of Material

Heat Sink:

ATS-FPX040040015-62-C1-R0

Push Pin:

Springs:

ATS-PP-06

ATS-PPS-11

Qty

Thermal Performance

100

AIR VELOCITY - LFM (m/s)

(0.5)

Thermal Resistance

°C/W

Unducted Flow

Ducted Flow

16.45

2.56

200

(1.0)

6.14

1.62

300

(1.5)

3.44

1.31

400

(2.0)

2.42

1.15

500

(2.5)

1.94

1.04

600

(3.0)

1.66

0.96

700

(3.5)

1.48

Fin

Pitch

FINE-PITCH

Fin

Type

STRAIGHT

Hole

Pattern

LEFT-

TABBED

0.90

Product Detail

P/N

ATS-11F-62-C1-R0

Dimensions

NOTES:

Push Pin

ATS-PP-06

Spring

ATS-PPS-11

TIM

NO TIM

Finish

BLUE ANODIZED

1) Dimension A is the length of the heat sink in the direction of the flow.

2) Dimension B is the width of the heat sink perpendicular to the flow direction.

3) Dimension C is the heat sink height from the bottom of the base to the top of the fin

field.

4) Dimension E is the distance between holes perpendicular to the direction of flow.

5) Dimension F is the distance between holes in the direction of flow.

6) Thermal performance data are provided for reference only. Actual performance may

vary by application.

7) ATS reserves the right tp update or change its products without notice to improve the

design or performance.

8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.

9) Contact ATS to learn about custom options available.

For Illustration Purposes ONLY.

For further technical information, please contact Advanced Thermal Solutions, Inc.

89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM R2-0917

Recommended Resources

desk lamp remote control circuit

Integrated circuit alarm circuit

Active bandpass filter circuit diagram

32.768KHZ reference clock circuit diagram 1

555 automatic exposure timer circuit (1)

845E computer motherboard circuit diagram_67

, how to define the bool type: How do I define the bool type in an mso430 program written on Iar? I always get an error when I define it. Do I need to call any header file? I am a newbie, so I hope all the experts can give me some ...; xy598646744 Microcontroller MCU

About the use of memcpy function: /*Function name: memcpy Function: Copy n bytes from source to target destin Usage : void *memcpy(void *destin, void *source, unsigned n); */Some sources say that it copies n characters or elements fro...; jiangwei0802 MCU

Ask about the e2prom problem of external storage device: 24c04 can store 512 bytes. If it is full, is there a return message? Or does the programmer have to calculate when it is full? Thank you~~...; tpcore Embedded System

EEWORLD University Hall----Live Replay: Wireless Technology Changes Smart Life: Live broadcast replay: Wireless technology changes smart life : https://training.eeworld.com.cn/course/5761...; hi5 Integrated technical exchanges

Trouble with eboot startup!: Dear friends! After a few days of hard work, I finally got the result of eboot problem! I want to upgrade my BSP to Samsung official one? My nboot is compiled by ads. Now the function FMD_ReadSector(d...; ladeng Embedded System

CH554 Change system clock: CH554 can change the system clock. The lower three bits of the CLOCK_CFG register can control the system's internal clock division coefficient, thereby changing the system's operating frequency. For s...; dcexpert MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components