3M
™
Thermally Conductive Acrylic Interface Pads
5589H and 5590H
For applications requiring gap filling and non-silicone construction
Cooler
Reliable
More
Devices
Used to transfer heat from hot surfaces
or devices to cooler surface region of
assembled devices.
•
Excellent conformability, gap filling property
that provides excellent heat flow
•
Excellent environmental durability
•
Range of thermal performance to 100°C
Designed with filled acrylic polymer to be used for
non-silicone applications.
Available in 240 mm × 20 meter rolls for improved
converting processing.
Lower cost solution than Silicone Thermal Interface Pads.
For
3
3M
™
Thermally Conductive Acrylic Interface Pads
Selection Guide
Description
Product
Base
Material
Type
5589H*
Soft Pad
Filled
Acrylic
Polymer
Product
Thick-
ness
mil (mm)
Adhesion/Shore 00
Softness
Thermal
Performance
Dielectric
Properties
Dielectric
Strength
KV/mm (Film
version tested)
21
UL
Potential Operating
Volume
Resistivity Flammability Temperature Range***
(°C)
(ohm/cm)
Rating
3.4 X 10
UL VO
Short Term
(Hours-Days): 110°C
Long Term
(Weeks-Months): 80°C
Short Term
(Hours-Days): 110°C
Long Term
(Weeks-Months): 80°C
Adhesion Character- Conductivity Imped-
Filler Liner ization /// Shore 00
(W/m-K
ance****
°C-in
2
/W
Type Type Testing based on TM
3M ASTM
6mm Thickness
D5470 TM) (°C-cm
2
/W)
No added adhesive
1.33 (8.6)
layer. Pad is tacky and
40(1.0)
2.0
Ceramic PET
1.67 (10.8)
conformable /// Asker
60(1.5)
C=16
12
Note: *1) 3M Pad 5589H has a very low tack surface and a medium tack surface.
5590H*
Soft Pad
Filled
Acrylic
Polymer
No added adhesive
20(0.5)
layer. Pad is tacky and
40(1.0) Ceramic PET
conformable /// Asker
60(1.5)
C=30
3.0
0.46 (3.0)
0.70 (4.5)
0.95 (6.1)
33
2.7 X 10
12
UL VO
Note: *1) 3M Pad 5590H has a very low tack surface and a medium tack surface.
***End use application testing will determine final temperature range based on final design and other environmental conditions. Suggested Temperature range is based on a UL-746 Test Method
or a 3M Test Method.
Chip Temperature
(°C)
Application Note
If user needs to have pad adhesively held in place,
3M
™
Adhesive Transfer Tape 9461P is a 1 mil high
temperature acrylic transfer adhesive that bonds well to
the 3M
™
Thermally Conductive Acrylic Interface Pad and
to many metal surfaces used for dissipating
the heat.
Effect of Thermal Interface Impedance
and Device Power on Chip Temperature
110
100
90
80
70
60
50
40
30
20
10
0
0
0.25
0.5
20W
10W
2W
Impedance
(C-in /W)
2
0.75
1
1.25
1.5
1.75
2
Important Notice:
Before using this product, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated
with such use.
Warranty; Limited Remedy; Limited Liability:
3M’s product warranty is stated in its Product Literature available upon request. 3M MAKES NO OTHER WARRANTIES INCLUDING,
BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. If this product is defective within the warranty period stated
above, your exclusive remedy shall be, at 3M’s option, to replace or repair the 3M product or refund the purchase price of the 3M product. Except where prohibited by law,
3M will not be liable for any indirect, special, incidental or consequential loss or damage arising from this 3M product, regardless of the legal theory asserted.
3
Electronics Markets Materials Division
3M Center, Building 225-3S-06
St. Paul, MN 55144-1000
www.3M.com/electronics
1-800-251-8634
Please recycle. Printed in USA.
© 3M 2009. All rights reserved.
Issued: 9/09 6994 (HB)
60-5002-0428-8
3M is trademark of 3M Company.
Used under license by 3M
subsidiaries and affiliates.
Microcontroller MCU
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