ZMM5221B - ZMM5267B
500mW SURFACE MOUNT ZENER DIODE
SPICE MODEL: ZMM5235B ZMM5260B ZMM5262B
Features
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·
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500mW Power Dissipation
Outline Similar to JEDEC DO-213AA
Hemetic Glass Package
C
B
Mechanical Data
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Case: MiniMELF
Terminals: Solderable per MIL-STD-202,
Method 208
Polarity: Cathode Band
Marking: Cathode Band Only
Weight: 0.034 grams (approx.)
A
MiniMELF
Dim
A
B
C
Min
3.30
1.30
0.28
Max
3.70
1.60
0.50
All Dimensions in mm
Maximum Ratings and Electrical Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Forward Voltage
(Note 1)
(Note 1)
P
d
R
qJA
V
F
@ T
A
= 25°C unless otherwise specified
Value
500
300
1.5
-65 to +175
Unit
mW
°C /W
V
o
C
Symbol
@ I
F
= 200mA
Operating and Storage Temperature Range
T
j,
T
STG
Notes:
1. Valid provided that electrodes are kept at ambient temperature.
2. Tested with pulses, T
p
£
100ms.
DS30024 Rev. C-2
1 of 3
ZMM5221B-ZMM5267B
500
200
V
R
= 2.0V
T
j
= 25°C
P
d
, POWER DISSIPATION (mW)
400
C
j
, JUNCTION CAPACITANCE (pF)
0
40
80
120
160
200
150
300
100
200
50
100
0
0
0
5
10
15
20
25
T
A
, AMBIENT TEMPERATURE
Fig.1 Power Dissipation vs Ambient Temperature
V
Z
, ZENER VOLTAGE (V)
Fig. 2 Junction Capacitance vs Zener Voltage
1000
T
j
= 25°C
I
Z
= 1.0mA
100
5.0mA
10
10mA
1
0
5
10
15
20
25
V
Z
, ZENER VOLTAGE (V)
Fig. 3 Differential Zener Impedance
1000
r(t), NORMALIZED EFFECTIVE
TRANSIENT THERMAL RESISTANCE (
o
C/W)
100
P
(pk)
10
D = 0.5
0.2
0.1
0.05
0.02
0.01
t
1
t
2
1.0
0.1
1.0
10
100
1000
t
1
, SQUARE WAVE PULSE DURATION (seconds)
Fig. 4 Typical Normalized Transient Thermal Impedance Curves
DS30024 Rev. C-2
3 of 3
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