Datasheet
USB Type-C Power Delivery Controller
BM92A12MWV-Z
General Description
BM92A12 is a full function USB Type-C Power Delivery
(PD) controller that supports USB Power Delivery using
base-band communication. It is compatible with USB
Type-C Specification and USB Power Delivery
specification.
BM92A12 includes support for the PD policy engine and
communicates with an Embedded Controller or the SoC
via host interface. It supports SOP, SOP’ and SOP’’
signaling, allowing it to communicate with cable marker
ICs, support alternate modes.
Key Specifications
VBUS Voltage Range:
4.75V to 20V
Power Sink Voltage Range:
4.75V to 20V
Power Source Voltage Range:
4.75V to 5.5V
Power Consumption at Sleep Power: 0.4mW(Typ)
Operating Temperature Range: -30°C to +105°C
W (Typ) x D (Typ) x H (Max)
5.00mm x 5.00mm x 1.00mm
Package
UQFN40V5050A
Features
USB Type-C Specification compatible
USB PD Specification compatible (BMC-PHY)
Connected the required initial voltage is 20V
Request current depends on the far-end device
Start of automatic power receiving without Ext-MCU
Two channel power path control using N-channel
MOSFET drivers with back flow prevention
Type-C cable orientation detection
Built-in VCONN Switch and VCONN controller
Direct VBUS powered operation
Initial Role is UFP mode (Supports DFP/DRP mode)
Supports Dead Battery operation
SMBus Interface for Host Communication
Consumer Applications
Laptop PCs, Tablet PCs
Applications
Typical Application Circuit
VBUS
Charger Power
GND
GND
GND
GND
GND
GND
VDDIO
GND
Hi-side
Switch
Power Supply
For Prov (5V)
VSVR
(3.1V½5.5V)
VDDIO
(1.7V½5.5V)
DSCHG
S2_DRV_G1
S2_DRV_SRC
S2_DRV_G2
S1_DRV_G1
S1_DRV_SRC
S1_DRV_G2
VSVR
VEX
VB
VCONN
VCONN_IN
SMDATA
SMCLK
VDDIO
GND
CC1
CC2
CC1
CC2
GPIO0（VIN_EN)
GPIO1（ALERT#)
GPO2/VDIV(BST_EN)
EC-I/F
USB Type-C
Receptacle
XCLPOFF1
XCLPOFF2
BM92A12MWV-Z
UQFN40V5050A
GPO3/FB(HSSWEN)
GPIO7
GPIO6
GPIO5
GPIO4
DBGMODDT
DBGRSTCK
VCCIN
VDDIO
LDO15DCAP
LDO15ACAP
LDO28CAP
IDSEL/ATST1
CSENSEN
CSENSEP
VSTR/ATST2
XRST
VCCIN
EPAD
GND
GND
GND
VCCIN
GND
VCCIN
GND
GND
GND
GND
Figure A. Typical Application Circuit
〇Product
structure : Silicon monolithic integrated circuit
.
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Contents
Contents ......................................................................................................................................................................................... 2
Notation
......................................................................................................................................................................................... 3
Reference
...................................................................................................................................................................................... 3
1.
Pin Configuration.................................................................................................................................................................. 4
2.
Pin Description ..................................................................................................................................................................... 5
3.
Block Diagram ...................................................................................................................................................................... 7
4.
Electrical Characteristics ...................................................................................................................................................... 8
4.1. Absolute Maximum Ratings ................................................................................................................................................. 8
(Note 4)
4.2. Thermal Resistance
..................................................................................................................................................... 8
4.3. Recommended Operating Conditions .................................................................................................................................. 9
4.4. Internal Memory Cell Characteristics ................................................................................................................................... 9
4.5. Circuit Power Characteristics ............................................................................................................................................... 9
4.6. Digital Pin DC Characteristics ............................................................................................................................................ 10
4.7. Power Supply Management ............................................................................................................................................... 11
4.7.1. Outline ............................................................................................................................................................................ 11
4.7.2. Electrical Characteristics ................................................................................................................................................ 12
4.8. CC_PHY ............................................................................................................................................................................ 13
4.8.1. Outline ............................................................................................................................................................................ 13
4.8.2. Electrical Characteristics ................................................................................................................................................ 15
4.9. Voltage Detection ............................................................................................................................................................... 16
4.9.1. Outline ............................................................................................................................................................................ 16
4.9.2. Electrical Characteristics ................................................................................................................................................ 16
4.10.
VBUS Discharge............................................................................................................................................................. 17
4.10.1.
Outline ........................................................................................................................................................................ 17
4.10.2.
Electrical Characteristics ............................................................................................................................................. 17
4.11.
Power FET Gate Driver (SINK & SOURCE) ................................................................................................................... 18
4.11.1.
Outline ........................................................................................................................................................................ 18
4.11.2.
Electrical Characteristics ............................................................................................................................................. 18
4.12.
Power On Sequence ...................................................................................................................................................... 19
4.12.1.
Reset Timing ............................................................................................................................................................... 20
4.13.
Power Off Sequence ...................................................................................................................................................... 21
4.14.
I/O Equivalence Circuit ................................................................................................................................................... 22
5.
Application Example........................................................................................................................................................... 26
5.1. Selection of Components Externally connected ................................................................................................................. 26
6.
Initial values of BM92A12................................................................................................................................................... 27
7.
Operational Notes .............................................................................................................................................................. 29
8.
Ordering Information .......................................................................................................................................................... 31
9.
Marking Diagrams .............................................................................................................................................................. 31
10.
Physical Dimension Tape and Reel Information ................................................................................................................. 32
11.
Revision History ................................................................................................................................................................. 33
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Notation
Category
Unit
Notation
V
A
Ω, Ohm
F
deg., degree
Hz
s (lower case)
min
b, bit
B, byte
Unit prefix
M, mega-, mebi-
M, mega-, million-
K, kilo-, kibi-
k, kilo-
m, milli-
μ, micro-
n, nano-
p, pico-
Numeric value
xxh, xxH
xxb
Description
Volt (Unit of voltage)
Ampere (Unit of current)
Ohm (Unit of resistance)
Farad (Unit of capacitance)
degree Celsius (Unit of Temperature)
Hertz (Unit of frequency)
second (Unit of time)
minute (Unit of time)
bit (Unit of digital data)
1 byte = 8 bits
2
20
6
= 1,048,576
(used with “bit” or “byte”)
(used with “Ω” or “Hz”)
10 = 1,000,000
2
10
3
= 1,024
(used with “bit” or “byte”)
(used with “Ω” or “Hz”)
10 = 1,000
10
10
10
10
-3
-6
-9
-12
Hexadecimal number.
“x”: any alphanumeric of 0 to 9 or A to F.
Binary number; “b” may be omitted.
“x”: a number, 0 or 1
“_” is used as a nibble (4-bit) delimiter.
(eg. “0011_0101b” = “35h”)
Address in a hexadecimal number.
“x”: any alphanumeric of 0 to 9 or A to F.
n-th single bit in the multi-bit data.
Bit range from bit[n] to bit[m].
High level (over V
IH
or V
OH
) of logic signal.
Low level (under V
IL
or V
OL
) of logic signal.
High impedance state of 3-state signal.
Address
Data
Signal level
#xxh
bit[n]
bit[n:m]
“H”, High
“L”, Low
“Z”, “Hi-Z”
Reference
Name
USB Type-C
USB PD
SMBus
Reference Document
“USB Type-C Specification Release 1.1”
“Power Delivery Specification Revision2.0 Version1.1”
“System Management Bus (SMBus) Specification Version 2.0”
Release Date
3.Apr.2015
7.May.2015
3.Aug.2000
Publisher
USB.org
USB.org
System Management
Implementers Forum
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1.
Pin Configuration
GPO2/VDIV(BST_EN)
GPO3/FB(HSSWEN)
S1_DRV_SRC
S2_DRV_SRC
22
S1_DRV_G2
S1_DRV_G1
S2_DRV_G2
30 29
28
27
26
25
24 23
CSENSEN
CSENSEP
XCLPOFF1
XCLPOFF2
CC1
VCONN_IN
CC2
LDO15DCAP
LDO28CAP
LDO15ACAP
S2_DRV_G1
21
20
19
18
VEX
GND
31
32
33
34
35
36
37
38
39
40
SMCLK
SMDATA
VDDIO
GPIO1(ALERT#)
GPIO0(VIN_EN)
DBGMODDT
DBGRSTCK
GPIO7
GPIO6
GPIO5
BM92A12MWV-Z
UQFN40V5050A
TOP View
17
16
15
14
13
(EPAD)
1
2
3
4
5
6
7
8
9
10
12
11
VCCIN
DSCHG
XRST
VSVR
VB
VSTR/ATST2
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IDSEL/ATST1
Figure 1-1 Pin configuration
GPIO4
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GND
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GND
BM92A12MWV-Z
2.
Pin Description
Table 2-1 Pin Description
PKG
PIN#
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
GND
VSTR/ATST2
IDSEL/ATST1
XRST
VCCIN
VSVR
DSCHG
GND
VB
GPIO4
GPIO5
GPIO6
GPIO7
DBGRSTCK
DBGMODDT
GPIO0
(VIN_EN)
GPIO1
(ALERT#)
VDDIO
SMDATA
SMCLK
S2_DRV_G1
S2_DRV_SRC
S2_DRV_G2
S1_DRV_G1
S1_DRV_SRC
S1_DRV_G2
Pin Name
BLOCK
GND
TEST/Debug
TEST/Debug
Interface
USB-PD
POWER
Interface
GND
POWER
Interface
Interface
Interface
Interface
TEST
TEST
Interface
Interface
POWER
Interface
Interface
FET Gate
Control
FET Gate
Control
FET Gate
Control
FET Gate
Control
FET Gate
Control
FET Gate
Control
O
I/O
I
IO
I
I
O
I
IO
I
I
I
I
I
I
IO
IO
I
(Note 1)
Type
GND
Analog
Analog
Digital
Analog
Power
Analog
GND
Power
Digital
Digital
Digital
Digital
Digital
Digital
Digital
Digital
Power
Digital
Digital
Analog
Analog
Analog
Analog
Analog
Analog
Digital
I/O Level
Ground
Description
VCCIN
VCCIN
Analog TEST/ Debug Pin2
SMBus ID (device address)
selection “H”:1Ah, “L”:18h
/Debug Pin1
Digital block Reset
Internal Power supply
(For internal use, need to
connect capacitor to GND
5V SVR INPUT and
SPDSRC_FET_SRC voltage
Discharge NMOS Drain
Ground
Power Source from VBUS
Mode fixation (Fix: L)
NC pin
NC pin
NC pin
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
Test for logic
Test for logic
VIN_EN signal
Alert signal
Interface Voltage
SMBus Data
SMBus Clock
Power Path FET Gate Control
SPDSNK_G1
Power Path FET BG/SRC
Voltage
SPDSNK_SRC
Power Path FET Gate Control
SPDSNK_G2
Power Path FET Gate Control
SPDSRC_G1
Power Path FET BG/SRC
Voltage
SPDSRC_SRC
Power Path FET Gate Control
SPDSRC_G2
I
IO
I
O
I
O
O
I
O
(Note 1)
N-ch Open Drain
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