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5962-9669002HXX

Description
Flash, 128KX8, 120ns, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32
Categorystorage    storage   
File Size625KB,9 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9669002HXX Overview

Flash, 128KX8, 120ns, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32

5962-9669002HXX Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1820276466
Parts packaging codeSOJ
package instruction0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32
Contacts32
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time120 ns
JESD-30 codeR-CDSO-J32
JESD-609 codee4
memory density1048576 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeSOJ
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formJ BEND
Terminal locationDUAL
typeNOR TYPE
width11.23 mm
WMF128K8-XXX5
128Kx8 MONOLITHIC NOR FLASH (SMD 5962-96690**)
FEATURES

Access Times of 50*, 60, 70, 90, 120, 150ns

Packaging
• 32 lead, Hermetic Ceramic, 0.400" SOJ (Package 101)
• 32 pin, Hermetic Ceramic, 0.600" DIP (Package 300)
• 32 lead, Flatpack (Package 220)
• 32 lead, Formed Flatpack (Package 221)
• 32 pin, Rectangular Ceramic Leadless Chip Carrier
(Package 601)

100,000 Erase/Program Cycles Minimum

Sector Erase Architecture
• 8 equal size sectors of 16KBytes each
• Any combination of sectors can be concurrently erased.
Also supports full chip erase

Organized as 128Kx8

Commercial, Industrial and Military Temperature Ranges

5 Volt Programming

Low Power CMOS

Embedded Erase and Program Algorithms

TTL Compatible Inputs and CMOS Outputs

Page Program Operation and Internal Program Control
Time.
This product is subject to change without notice.
Note: For programming information and waveforms refer to Flash Programming 1M5 Application
Note AN0036.
* The access time of 50ns is available in Industrial and Commercial temperature ranges only.
** For reference only. See table page 8.
PIN CONFIGURATION FOR WMF128K8-XXX5
32 DIP
32 CSOJ
32 Flatpack
PIN CONFIGURATION FOR WMF128K8-XCLX5
32 CLCC
Top View
WE#
A12
A15
A16
V
CC
NC
NC
Top View
NC
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
WE#
NC
A14
A13
A8
A9
A11
OE#
A10
CS#
I/O7
I/O6
I/O5
I/O4
I/O3
4 3 2 1 32 31 30
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
5
29
6
28
7
27
8
26
9
25
10
24
11
23
12
22
13
21
14 15 16 17 18 19 20
I/O1
I/O2
V
SS
I/O3
I/O4
I/O5
I/O6
A14
A13
A8
A9
A11
OE#
A10
CS#
I/O7
PIN DESCRIPTION
A0-16
I/O0-7
CS#
OE#
WE#
V
CC
V
SS
Address Inputs
Data Input/Output
Chip Select
Output Enable
Write Enable
+5.0V Power
Ground
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012
Rev. 8
© 2012 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
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