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1N482B

Description
SILICON, SIGNAL DIODE
CategoryDiscrete semiconductor    diode   
File Size57KB,1 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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1N482B Overview

SILICON, SIGNAL DIODE

1N482B Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
package instructionO-LALF-W2
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
JEDEC-95 codeDO-35
JESD-30 codeO-LALF-W2
JESD-609 codee0
Number of components1
Number of terminals2
Maximum operating temperature200 °C
Minimum operating temperature-65 °C
Maximum output current0.2 A
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum power dissipation0.25 W
Certification statusNot Qualified
surface mountNO
Terminal surfaceTIN LEAD
Terminal formWIRE
Terminal locationAXIAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
High Conductance
Use Advantages
1N482B
thru
1N4150
1N486B
DO-35 Diodes
Used as a general purpose diode in power supplies, or in clipping and steering
applications. Operation at temperatures up to 200 degrees C, no derating.
Can be used in harsh environments where hermeticity and low cost are
important. Compatible with all major automatic pick and place mounting
equipment. May be used on ceramic boards along with high temperature IR
solder reflow.
Features
Humidity proof glass
Thermally matched system
No thermal fatigue
No applications restrictions
Sigma Bond™ plated contacts
100% guaranteed solderability
Problem free assembly
Six Sigma quality
LL-35 MiniMELF types available
Absolute Maximum Ratings
Average Forward Rectified Current at T
Ambient
= 25
o
C
Maximum Non-Repetitive Surge (8.3 mSecs. 1/2 sine)
Junction Temperature Range
Storage Temperature Range
Max. Average Power Dissipation
Characteristics
at T =
25
o
C
Peak
Inverse Voltage
(MIN.)
(PIV)
Maximum
Average Rectified
Current
(I
O
)
Maximum
Forward Voltage
Drop
(V
F
) @ 0.1A
D O -35 G lass P ack age
Lead Dia.
0.018-0.022"
0.458-0.558 mm
1.0"
25.4 m m
(M in.)
Leng th
0.120-.200"
3.05-5.08-
mm
Dia.
0.06-0.09"
1.53-2.28 mm
Symbol
I
AV
I
FSM
T
j
T
S
Pdiss
Value
0.65
2.0
-65 to +200
-55 to +200
250
Unit
Amp
Amps
o
o
C
C
mW
Maximum Leakage
Current
(I
R
) @ PIV
25
o
C
10
o
C
5
Minimum
Saturation
Voltage
(@0.1 mA)
Type
1N482B
1N483B
1N484B
1N485B
1N486B
Volts
30
60
125
175
225
Amps
0.2
0.2
0.2
0.2
0.2
Volts
1.0
1.0
1.0
1.0
1.0
µA
0.025
0.025
0.025
0.025
0.025
µA
5
5
5
5
5
Volts
40
80
150
200
250
LL-35 Glass miniMELF package available, substitute an LL prefix instead of "1N"..
6 Lake Street - Lawrence, MA 01841
Tel: 978-681-0392 - Fax: 978-681-9135

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Description SILICON, SIGNAL DIODE 0.15 A, 200 V, SILICON, SIGNAL DIODE POLYESTER FILM CAPACITORS
Is it lead-free? Contains lead Contains lead -
Is it Rohs certified? incompatible incompatible -
Maker Microsemi Microsemi -
package instruction O-LALF-W2 O-LELF-R2 -
Reach Compliance Code compliant compli -
ECCN code EAR99 EAR99 -
Shell connection ISOLATED ISOLATED -
Configuration SINGLE SINGLE -
Diode component materials SILICON SILICON -
Diode type RECTIFIER DIODE RECTIFIER DIODE -
JESD-30 code O-LALF-W2 O-LELF-R2 -
JESD-609 code e0 e0 -
Number of components 1 1 -
Number of terminals 2 2 -
Maximum operating temperature 200 °C 200 °C -
Minimum operating temperature -65 °C -65 °C -
Maximum output current 0.2 A 0.2 A -
Package body material GLASS GLASS -
Package shape ROUND ROUND -
Package form LONG FORM LONG FORM -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED -
Maximum power dissipation 0.25 W 0.25 W -
Certification status Not Qualified Not Qualified -
surface mount NO YES -
Terminal surface TIN LEAD TIN LEAD -
Terminal form WIRE WRAP AROUND -
Terminal location AXIAL END -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED -
Base Number Matches 1 1 -
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