EEWORLDEEWORLDEEWORLD

Part Number

Search

ICA-632-ATT

Description
IC and device socket.100" Screw Machine DIP Socket
CategoryThe connector    socket   
File Size612KB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric View All

ICA-632-ATT Online Shopping

Suppliers Part Number Price MOQ In stock  
ICA-632-ATT - - View Buy Now

ICA-632-ATT Overview

IC and device socket.100" Screw Machine DIP Socket

ICA-632-ATT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Reach Compliance Codenot_compliant
ECCN codeEAR99
Contact to complete cooperationTIN OVER NICKEL
Contact completed and terminatedTin (Sn) - with Nickel (Ni) barrier
Contact materialBERYLLIUM COPPER ALLOY
Device slot typeIC SOCKET
Type of equipment usedDIP32
JESD-609 codee3
Number of contacts32
Base Number Matches1
F-211-1 SUPPLEMENT
ICA–320–SGT
(2,54mm) .100"
ICA SERIES
ICA–624–ZEGG
AUTOMATED INSERTION DIP SOCKETS
Mates with:
APA
ICA
ROW SPACING &
NO. OF CONTACTS
STYLE
OPTION
PLATING
OPTION
(Leave Blank for
Standard Version)
OPTION
Specify from chart below
• Side & end stackable
• Great for auto insertion
• Open body design
(2,54) .100 X No. of Spaces
Row
Spacing
+(2,41)
.095
except
–H is
+ (2,54)
.100
(2,54) .100 X No. of Positions
(2,54)
.100
GG
No. of
Contacts
08
14
16
18
20
22
24
28
22
24
28
32
40
48
= 30µ" (0,76µm)
Gold contact,
10µ" (0,25µm)
Gold Shell
Row
Space
(7,64) .300
(10,16) .400
or
(15,24) .600
*–322
has no cross bar on one end.
(2,54)
.100
–308
–314
–316
–318
–320
.300 (7,62)
–322
*
–324
–328
–422
.400 (10,16)
–624
–628
–632
.600 (15,24)
–640
–648
= .360 (9,14)
Option
Tail
Requires Style
–W or –ZW
Specify desired
= .260 (6,60)
suffix for shorter
Wire-Wrap tail.
Tail
–2
Wire-Wrap
–3
GT
= 30µ" (0,76µm)
Gold contact,
Tin Shell
Requires Style
–S or –ZS
–L
= Locking
Socket
Requires GT
Plating Option
ST
= 10µ" (0,25µm)
Gold contact,
Tin shell (Styles –S
& –ZS only)
SPECIFICATIONS
For complete specifications
see www.samtec.com?ICA
Insulator Material:
Black Glass Filled
Polyester
except -328 is LCP
Contact:
BeCu
Shell:
Brass
Plating:
Au or Sn over 50µ" Ni
Flammability Rating:
UL 94V-O
Insulation Resistance:
5000 MΩ min
Temperature Range:
-55°C to +105°C with Tin
-55°C to +125°C with Gold.
Withstanding Voltage:
1000 VRMS
Current Rating:
1A
Contact Resistance:
10mΩ max
Lead Size Range:
.015" (0,38mm) to .022"
(0,56mm) DIA and most IC leads
Insertion Force:
(Single contact only)
Standard = 9 oz avg, 16 oz max;
Low Insertion Force =
2.5 oz avg, 5.5 oz max
Withdrawal Force:
(Single contact only)
Standard = 2.5 oz avg, 1.5 oz
min; Low Insertion Force =
2.0 oz avg, 0.35 oz min
Lead-Free Solderable:
Wave only
RoHS Compliant:
Yes
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
–S, –ZS, –ZA
= Printed Circuit
-ZS & -ZA = Low Insertion Force
–W, –ZW
= Wire-Wrap
ZW = Low Insertion Force
–ZE
= Elevated
Low Insertion Force
(1,32)
.052
DIA
Y
(4,90)
.193
Z
(12,95)
.510
(1,32)
.052
DIA
(1,32)
.052
DIA
(0,89)
.035
DIA
(13,77)
.542
X
LEAD STYLE
X
DIA
(0,51)
.020
(0,51)
.020
Y
TAIL
(3,18)
.125
(4,57)
.180
Z
(7,62)
.300
(8,89)
.350
–S or –ZS
–ZA
Locking lead
available with –S
and –ZS.
See OPTION.
(0,64)
.025
SQ
(8,86)
.349
(4,32)
.170
Shorter wire-wrap tail
lengths available.
See OPTION.
(3,43)
.136
(0,51)
.020
Insertion Depth = .095" (2,41) to .145" (3,68):
Style S Component Part No. = SC-1P1
Style ZS Component Part No. = EZ-1P1
Style ZA Component Part No. = EZ-6P1
Option L Component Part No. = SC-1L1 or EZ-1L1
–L Option
Insertion Depth = .125" (3,18) to .157" (3,99)
Style W Component Part No. = SC-1W1(1)
Style ZW Component Part No. = EZ-1W1(1)
Style W-2 Component Part No. = SC-1W1(2)
Style ZW-2 Component Part No. = EZ-1W1(2)
Style W-3 Component Part No. = SC-1W1(3)
Style ZW-3 Component Part No. = EZ-1W1(3)
Insertion Depth = .125" (3,18) to .170" (4,32)
Style ZE Component Part No. = EZ-2P3
WWW.SAMTEC.COM
40 Years of Mobile Base Station History
[align=left][color=rgb(51, 51, 51)][font=-apple-system-font, BlinkMacSystemFont, "][size=17px]Since the birth of mobile communication networks in the late 1970s, mobile base stations have been with ma...
btty038 RF/Wirelessly
【RT-Thread Reading Notes】Network Framework
[size=4][md]For embedded network communication, I rarely come into contact with it. This time I studied the last chapter of this book - Network Framework, and now I summarize it as follows. ## TCP/IP ...
jj1989 Embedded System
DIY MINI amplifier 3w output
The LM4871 is a mono bridge audio power amplifier that can provide 1.5W to 3W continuous average power when powered by 5V .Board parameters: Amplifier chip: LM4871 Output power: 1.5-3W, dual channel O...
zhangkai0215 MCU
MSP430 rotary flow meter scanning interface and USB integration
MSP430 MCUs integrate analog and digital peripherals to meet your sensing and monitoring needs. Integrated peripherals include ADC, DAC, op amps, timers, SPI, UART, I2C, USB, and LCD drivers MSP430 Ca...
fish001 Microcontroller MCU
SEED-EXP430F5529 USB Experiment Board and Related Materials
[b]To help netizens learn about MSP430F5529, here are some materials[/b] [b]SEED-EXP430F5529 USB Experiment Board Manual[/b][b]Including circuit diagrams, etc.[/b] [b] [/b]...
dontium Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1788  408  683  2424  1168  37  9  14  49  24 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号