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QFS-078-04.25-L-D-A-GP

Description
Board-to-Board and Mezzanine Connectors 0.635 mm Q2 High-Speed ​​Rugged Ground Plane Socket Strip
CategoryThe connector    The connector   
File Size1MB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric View All

QFS-078-04.25-L-D-A-GP Overview

Board-to-Board and Mezzanine Connectors 0.635 mm Q2 High-Speed ​​Rugged Ground Plane Socket Strip

QFS-078-04.25-L-D-A-GP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
Factory Lead Time3 weeks
Other featuresPICK&PLACE PAD
body width0.32 inch
subject depth0.293 inch
body length3.01 inch
Body/casing typeSOCKET
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationNOT SPECIFIED
Contact completed and terminatedTin (Sn) - with Nickel (Ni) barrier
Contact point genderFEMALE
Contact materialNOT SPECIFIED
contact modeRECTANGULAR
Contact styleCENTRONIC
Filter functionNO
Insulator colorBLACK
insulator materialLIQUID CRYSTAL POLYMER (LCP)
JESD-609 codee3
Plug contact pitch0.025 inch
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation option 1LOCKING
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number2
Number of rows loaded2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
PCB contact patternRECTANGULAR
Plating thickness10u inch
polarization keyPOLARIZED HOUSING
Rated current (signal)2.6 A
GuidelineUL
reliabilityCOMMERCIAL
Termination typeSURFACE MOUNT
Total number of contacts156
UL Flammability Code94V-0
Base Number Matches1
F-219
QFS–026–04.25–L–D–A
QFS–026–04.25–L–D–A–GP
QFS–032–04.25–L–D–DP–A
(0.635 mm) .025"
QFS SERIES
RUGGED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QFS
Insulator Material:
Liquid Crystal Polymer
Contact & Ground
Plane Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
(Tin on Ground Plane Tail)
Current Rating:
Contact:
2.6 A per pin
(2 pins powered)
Ground Plane:
15.7 A per ground plane
(1 ground plane powered)
Voltage Rating:
300 VAC mated with QMS
Operating Temp:
-55 °C to +125 °C
RoHS Compliant:
Yes
Board Mates:
QMS
Cable Mates:
6QCD
Standoffs:
SO, JSOM
Increased insertion
depth for rugged applications
Integral metal plane
for power or ground
(1.60 mm)
.063"
NOMINAL
WIPE
POWER/SIGNAL
APPLICATION
ALSO
AVAILABLE
(MOQ Required)
HIGH-SPEED CHANNEL PERFORMANCE
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
QMS-DP/QFS-DP @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (026-078)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
25
G b p s
• Other platings
• Without PCB
Alignment Pins
• Hot Pluggable
• 4 banks
(104 -SE, 64 -DP)
QFS
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
TYPE
A
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
(52 total pins per bank = –D)
–026, –052, –078
–016, –032, –048
(16 pairs per bank = –D–DP)
(–04.25 lead style only)
= 10 µ" (0.25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
–L
= Single-Ended
–D
= Differential Pair
(–04.25 lead style only)
–D–DP
= Guide
Holes
( –04.25
lead style
only)
–GP
GP = No. of Banks x (21.34) .840 + (12.45) .490
No. of Banks x (21.34) .840 + (1.02) .040
(0.635)
(21.34) .840
.025
02
(8.13)
.320
01
STANDARDS
• SUMIT
• PCI/104-Express
• PCI/104-Express
OneBank
Visit www.samtec.com/standards
for more information.
(–06.25 lead style only)
= 10 µ" (0.25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
–SL
APPLICATION
STACK
HEIGHT
(0.10)
.004
(0.44)
.017
(0.89)
.035
–D
A
(1.02) .040 DIA
–D–DP
(8.13)
.320
Requires Standoff
SO-1524-03-01-01-L or
JSOM-1524-02 for 15.24 mm
or SO-2215-02-01-01-L for 22 mm
board spacing. Connectors designed
to not fully seat when mated.
MATED HEIGHT*
LEAD
STYLE
A
(7.44) .293
(9.42) .371
QMS LEAD STYLE
INDUSTRY
STANDARD
SUMIT
PCI/104-Express
PCI/104-Express
PCI/104-Express
PCI/104-Express
PCI/104-Express
INTERCONNECTS
TERMINAL
ASP-129637-01
ASP-129637-03
ASP-129637-13
ASP-142781-01
ASP-142781-02
ASP-142781-03
SOCKET
ASP-129646-01
ASP-129646-03
ASP-129646-22
ASP-129646-01
ASP-129646-02
ASP-129646-03
–05.75 –06.75 –09.75
10 mm
12 mm
11 mm
13 mm
14 mm
16 mm
STACK
BANKS HEIGHT
1
3
1
1
2
3
15.24 mm
15.24 mm
15.24 mm
22 mm
22 mm
22 mm
–04.25
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
–06.25
*Processing conditions will affect mated height.
See SO Series for board space tolerances.
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

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