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MB1-120-01-SM-S-02-SL

Description
Standard Card Edge Connector 1.00 mm Mini Edge Card Socket With Guides
CategoryThe connector    Card edge connector    Standard card edge connector   
File Size552KB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
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MB1-120-01-SM-S-02-SL Overview

Standard Card Edge Connector 1.00 mm Mini Edge Card Socket With Guides

MB1-120-01-SM-S-02-SL Parametric

Parameter NameAttribute value
MakerSAMTEC
Product CategoryStandard card edge connector
Shipping restrictionsMouser does not currently sell this product.
productSockets
Pitch1 mm
Installation styleMounting Peg
Installation angleRight Angle
Contact platingGold
seriesMB1
Current rating2.2 A
Shell materialLiquid Crystal Polymer (LCP)
Number of rows1 Row
EncapsulationTube
Termination typeSMD/SMT
Contact materialBeryllium Copper
Maximum operating temperature+ 125 C
Minimum operating temperature- 55 C
Factory packaging quantity21
F-219 SUPPLEMENT
MB1–130–01–F–S–01–SL–N
MB1–130–01–F–S–01–SL
(1.00 mm) .0394"
MB1 SERIES
MINI EDGE CARD SOCKET WITH GUIDES
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MB1
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Current Rating:
2.2 A per pin
(6 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(5.26 mm) .207" to
(6.10 mm) .240"
RoHS Compliant:
Yes
Mates with:
(0.80 mm) .031" PCB,
(1.60 mm) .062" PCB
Choice of two
card thicknesses
(5.44 mm)
.214"
(1.00 mm)
.03937" pitch
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (20-30)
(0.15 mm) .006" max (40-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
MB1
1
NO. OF
PINS
01
PLATING
OPTION
S
CARD
SLOT
Specify
CARD
SLOT
from
chart
CARD
SLOT
–01
–02
A
SL
OTHER
OPTION
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
20, 30, 40, 50
(No. of Positions + 2)
x (1.00) .03937 + (4.06) .160
(3.81)
.150
= Gold flash on contact,
Matte Tin on tail
–F
–L
= No Card
Guides
–N
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Other platings
(25.5)
1.004
(7.24)
.285
01
(1.00)
.03937
50
(0.36)
.014
(No. of Positions + 2)
x (1.00) .03937
(1.52)
.060
(1.27)
.050
DIA
(5.44)
.214
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
MATES WITH
BOARD THICKNESS
(0.97)
(0.80)
.038
.031
(1.83)
(1.60)
.072
.062
(7.24)
.285
–N OPTION
(1.27)
.050
(1.27)
.050
(0.15)
.006
(0.69)
.027
A
Notes:
Patented
Some sizes, styles and
options are non-standard,
non-returnable.
(2.36)
.093
Important Note:
Samtec recommends that pads on the mating board be Gold plated.
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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