DPAM-15-07.0-S-8-2-A-TR datasheet, PDF

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DPAM-15-07.0-S-8-2-A-TR: DescriptionBoard-to-Board & Mezzanine Connectors .085" X .100" DP Array Differential Pair Array Terminal; CategoryThe connector Surface plate and sandwich connector; File Size506KB，2 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/; Environmental Compliance

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DPAM-15-07.0-S-8-2-A-TR Overview

Board-to-Board & Mezzanine Connectors .085" X .100" DP Array Differential Pair Array Terminal

DPAM-15-07.0-S-8-2-A-TR Parametric

Parameter Name	Attribute value
Maker	SAMTEC
Product Category	Board-to-Board and Mezzanine Connectors
Shipping restrictions	Mouser does not currently sell this product.
series	DPAM
Encapsulation	Reel
Factory packaging quantity	150

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F-214

DPAM–23–07.0–S–8–2–A

DPAF–23–03.0–S–8–2–A

(2,16 mm) .085"

DPAM, DPAF SERIES

HIGH DENSITY DIFFERENTIAL PAIR ARRAY

DPAM Mates with:

DPAF

DPAF Mates with:

DPAM

PAIRS

PER ROW

07.0

PLATING

OPTION

NO. OF

ROWS

SOLDER

TYPE

OPTION

SPECIFICATIONS

For complete speciﬁcations and

recommended PCB layouts see

www.samtec.com?DPAM or

www.samtec.com?DPAF

Insulator Material:

Black LCP

Contact Material:

Copper Alloy

Plating:

Au over 50µ" (1,27 µm) Ni

Current Rating (2x3):

2.9 A per pin

Operating Temp Range:

-55°C to +125°C

Contact Resistance:

10.4mΩ

Working Voltage:

300 VAC

Mated Cycles:

100 Cycles

RoHS Compliant:

Yes

Lead-Free Solderable:

Yes

– 04, –06

– 08, –15, –23

–8

–S

=30µ" (0,76 µm)

Gold on contact area,

Tin on solder tail

=Eight

Pair

Rows

–2

= Lead-Free

Tin Alloy

96.5% Sn/

3% Ag/.5% Cu

Solder Crimp

–K

=(20,00 mm) 0.80"

DIA Polyimide

ﬁlm Pick &

Place Pad

–3

=Three

Pair

Rows

(2,54)

.100

–TR

=Tape & Reel

Perimeter

Grounds (TYP)

–GP

=Guide Post

(–23 only)

(2,54)

.100

NO OF

ROWS

–8

–3

(24,59) .968

(11,89) .468

02 01 G2 03 04

Signal Pairs (TYP)

No. of positions x (2,16) .085 + (4,34) .171

(6,66)

.262

(2,16) .085

(1,27)

.050

(1,08) .0425

(1,27)

.050

DIA

(0,13)

.005

RECOGNITIONS

For complete scope of

recognitions see

www.samtec.com/quality

No. of positions x (2,16) .085 + (2,95) .116

DPAM/DPAF

Rated @ 3dB Insertion Loss*

10 mm Stack Height

Single-Ended Signaling

8 GHz / 16 Gbps

Differential Pair Signaling

7 GHz / 14 Gbps

*Performance data includes effects of a non-optimized PCB.

Complete test data available at www.samtec.com?DPAM,

www.samtec.com?DPAF or contact sig@samtec.com

cols

roto rted

Supp

note

Download app ppnote

com/a

www.samtec.

@ samtec.co

Contact SIG n protocols

for questions

Fibre Chann

Rapid I/O

PCI Express

SATA

™

InfiniBand

XAUI

et I/O)

MGT (Rock

s at

DPAF

PAIRS

PER ROW

03.0

PLATING

OPTION

NO. OF

ROWS

SOLDER

TYPE

OPTION

– 04, – 06, – 08,

–15, –23

–S

=30µ" (0,76 µm)

Gold on contact area,

Tin on solder tail

–8

=Eight

Pair Rows

–2

= Lead-Free Tin Alloy

96.5% Sn/ 3%Ag/

.5% Cu

Solder Crimp

–K

=(20,00 mm)

0.80" DIA

Polyimide

ﬁlm

Pick &

Place Pad

–3

=Three

Pair Rows

Signal

Pairs

(TYP)

No. of positions x (2,16) .085 + (4,34) .171

NO OF

ROWS

–8

–3

(23,32)

.918

(10,62)

.418

SIZE

–04 x –3

–06 x –3

–04 x –8

–06 x –8

–08 x –8

–15 x –8

–23 x –8

–08 x –3

–15 x –3

–23 x –3

USABLE PAIRS

PER ARRAY*

6 Pairs

12 Pairs

16 Pairs

32 Pairs

48 Pairs

–TR

=Tape

& Reel

ALSO AVAILABLE

(MOQ Required)

• Tin-Lead Solder Charge

• Other platings

Contact Samtec.

Note:

Patented

Note:

Some sizes, styles and

options are non-standard,

non-returnable.

(1,52)

.060

(1,27) .050

(2,54)

.100

Perimeter Grounds (TYP)

(6,45)

.254

(2,16) .085

Solder crimped on tail

(1,08) .0425

No. of positions x (2,16) .085 + (2,95) .116

(1,27)

.050

DIA

(0,13)

.005

DPAF

DPAM MATED

LEAD HEIGHT*

STYLE

–03.0

10 mm

–07.0

*Processing

conditions will

affect mated height.

(1,27)

.050

104 Pairs

168 Pairs

18 Pairs

39 Pairs

63 Pairs

*Assumes ﬁrst and last pair in

each row are grounded

WWW.SAMTEC.COM

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