S70GL02GT
2-Gbit (256-MB) 3.0 V Flash Memory
General Description
The Cypress S70GL02GT 2-Gigabit MirrorBit
®
Flash memory device is fabricated on 45-nm MirrorBit
®
Eclipse™ process
technology. This device offers a fast page access time of 25 ns with a corresponding random access time of 110 ns. It features a
Write Buffer that allows a maximum of 256 words/512 bytes to be programmed in one operation, resulting in faster effective
programming time than standard single byte/word programming algorithms. This makes the device an ideal product for today’s
embedded applications that require higher density, better performance and lower power consumption.
This document contains information for the S70GL02GT device, which is a dual-die stack of two S29GL01GT dies.
For detailed specifications, refer to the discrete die datasheet provided in the below table.
Document
S29GL01GT, S29GL512T Datasheet
Cypress Document Number
002-00247
Distinctive Characteristics
CMOS 3.0-V Core with Versatile I/O™
Two 1024 Megabit (S29GL01GT) in a single 64-ball fortified-
BGA package (see the
S29GL01GT datasheet
for full
specifications)
45 nm MirrorBit Eclipse process technology
Single supply (V
CC
) for read/program/erase (2.7 V to 3.6 V)
Versatile I/O feature
– Wide I/O voltage (V
IO
): 1.65 V to V
CC
×8 and ×16 data bus
16-word/32-byte page read buffer
512-byte programming buffer
– Programming in page multiples, up to a maximum of
512 bytes
Sector erase
– Uniform 128-KB sectors
– S70GL02GT: 2048 sectors
Suspend and Resume commands for Program and Erase
operations
Status Register, Data Polling, and Ready/Busy pin methods
to determine device status
Advanced Sector Protection (ASP)
– Volatile and nonvolatile protection methods for each sector
Separate 1024-bye One Time Program (OTP) array with two
lockable regions
– Each device supports Common Flash Interface (CFI)
WP# input
– Protects the last sector of the device, regardless of sector
protection settings
Temperature range/grade
– Industrial (–40 °C to +85 °C)
– Industrial Plus (–40 °C to +105 °C)
– Automotive, AEC-Q100 Grade 3 (–40 °C to +85 °C)
– Automotive, AEC-Q100 Grade 2 (–40 °C to +105 °C)
100,000 Program-Erase cycles
20-year data retention
Packaging options
– 64-ball LSH fortified BGA, 13 mm × 11 mm
Cypress Semiconductor Corporation
Document Number: 002-13915 Rev. *E
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised February 13, 2018
S70GL02GT
Performance Characteristics
Max Read Access Times (ns)
Parameter
Random Access Time (t
ACC
)
Page Access Time (t
PACC
)
CE# Access Time (t
CE
)
OE# Access Time (t
OE
)
110
20
110
25
2 Gb
120
30
120
35
Note
Access times are dependent on V
IO
operating ranges. See
Ordering Information on page 4
for further details.
Typical Program and Erase Rates
Operation
Buffer Programming (512 bytes)
Sector Erase (128 KB)
40
°C to +85 °C
1.114 MBps
245 KBps
40
°C to +105 °C
1.14 MBps
245 KBps
Maximum Current Consumption
Operation
Active Read at 5 MHz, 30 pF
Program
Erase
Standby
40
°C to +85 °C
60 mA
100 mA
100 mA
200 µA
40
°C to +105 °C
60 mA
100 mA
100 mA
400 µA
Document Number: 002-13915 Rev. *E
Page 2 of 22
S70GL02GT
Contents
1.
1.1
2.
3.
3.1
3.2
4.
5.
6.
7.
8.
Ordering Information
................................................... 4
Recommended Combinations........................................ 4
Input/Output Descriptions
and Logic Symbol
........................................................ 6
Block Diagram..............................................................
7
Special Handling Instructions
for BGA Package ........................................................... 8
LSH064 — 64 ball Fortified Ball Grid Array,
13 x 11 mm .................................................................... 9
Memory Map
............................................................... 10
Autoselect...................................................................
10
DC Characteristics.....................................................
11
BGA Package Capacitance
....................................... 13
Thermal Resistance
................................................... 13
9.
9.1
9.2
10.
11.
11.1
11.2
11.3
Data Integrity
............................................................... 13
Erase Endurance .......................................................... 13
Data Retention .............................................................. 13
Device ID and Common Flash Interface
(ID-CFI) ASO Map
........................................................ 14
Other Resources
......................................................... 20
Cypress Flash Memory Roadmap ................................ 20
Links to Software .......................................................... 20
Links to Application Notes............................................. 20
12. Revision History..........................................................
21
Document History Page ..................................................... 21
Sales, Solutions, and Legal Information .......................... 22
Worldwide Sales and Design Support ........................... 22
Products ........................................................................ 22
PSoC® Solutions .......................................................... 22
Cypress Developer Community ..................................... 22
Technical Support ......................................................... 22
Document Number: 002-13915 Rev. *E
Page 3 of 22
S70GL02GT
1.
1.1
Ordering Information
Recommended Combinations
Table 1
lists various configurations planned to be available in volume. This table will be updated when new combinations are
released. Check with your local sales representative to confirm availability of specific configurations not listed here or to check on
newly released combinations.
Valid Combinations Standard Grade
Table 1. S29GL-T Valid Combinations
Base OPN
Speed (ns)
Package and
Temperature
Model Number
01
Packing Type
Ordering Part Number (x = Packing Type)
S70GL02GT11FHI01x
S70GL02GT11FHV01x
S70GL02GT11FAI01x
S70GL02GT11FHI02x
110
S70GL02GT
FHI, FHV, FAI
[1]
02
03
04
V1
120
V2
Notes
1. BGA package marking omits leading “S70” and packing type designator from ordering part number.
2. Packing Type “0” is standard option.
S70GL02GT11FAI02x
S70GL02GT11FHV02x
0, 3
[2]
S70GL02GT11FAI03x
S70GL02GT11FAI04x
S70GL02GT12FHIV1x
S70GL02GT12FHVV1x
S70GL02GT12FHIV2x
S70GL02GT12FHVV2x
Valid Combinations — Automotive Grade / AEC-Q100
Table 2
lists configurations that are Automotive Grade/AEC-Q100 qualified and are planned to be available in volume. This table will
be updated when new combinations are released. Consult your local sales representative to confirm availability of specific
combinations and to check on newly released combinations.
Production Part Approval Process (PPAP) support is only provided for AEC-Q100 grade products.
Products to be used in end-use applications that require ISO/TS-16949 compliance must be AEC-Q100 grade products in
combination with PPAP. Non–AEC-Q100 grade products are not manufactured or documented in full compliance with
ISO/TS-16949 requirements. AEC-Q100 grade products are also offered without PPAP support for end-use applications that do not
require ISO/TS-16949 compliance.
Table 2. S29GL-T Valid Combinations
Base OPN
Speed (ns)
Package and
Temperature
Model Number
01
110
02
S70GL02GT
120
V2
FHA, FHB
[3]
V1
0, 3
[4]
Packing Type
Ordering Part Number (x = Packing Type)
S70GL02GT11FHA01x
S70GL02GT11FHB01x
S70GL02GT11FHA02x
S70GL02GT11FHB02x
S70GL02GT12FHAV1x
S70GL02GT12FHBV1x
S70GL02GT12FHAV2x
S70GL02GT12FHBV2x
Notes
3. BGA package marking omits leading “S70” and packing type designator from ordering part number.
4. Packing Type “0” is standard option.
Document Number: 002-13915 Rev. *E
Page 4 of 22
S70GL02GT
The ordering part number is formed by a valid combination of the following:
S70GL02GT
12
F
H
I
01
0
PACKING TYPE
0 = Tray (standard)
3 = 13” Tape and Reel
MODEL NUMBER (CFI Version, VIO, and VCC Range)
CFI Version 1.3
03 = VIO = VCC = 2.7 to 3.6V, highest address sector protected
04 = VIO = VCC = 2.7 to 3.6V, lowest address sector protected
V3 = VIO = 1.65 to VCC, VCC = 2.7 to 3.6V, highest address sector protected
V4 = VIO = 1.65 to VCC, VCC = 2.7 to 3.6V, lowest address sector protected
CFI Version 1.5
01 = VIO = VCC = 2.7 to 3.6V, highest address sector protected
02 = VIO = VCC = 2.7 to 3.6V, lowest address sector protected
V1 = VIO = 1.65 to VCC, VCC = 2.7 to 3.6V, highest address sector protected
V2 = VIO = 1.65 to VCC, VCC = 2.7 to 3.6V, lowest address sector protected
TEMPERATURE RANGE / GRADE
I = Industrial (–40 °C to +85 °C)
V = Industrial Plus (–40 °C to +105 °C)
A = Automotive, AEC-Q100 Grade 3 (–40 °C to +85 °C)
B = Automotive, AEC-Q100 Grade 2 (–40 °C to +105 °C)
PACKAGE MATERIALS SET
A = Standard (Pb)
H = Low Halogen, Pb-free
PACKAGE TYPE
F = Fortified Ball Grid Array, 1.0 mm pitch package (LSH064), 11 mm x 13 mm
SPEED OPTION
11 = 110 ns
12 = 120 ns
DEVICE NUMBER / DESCRIPTION
S70GL02GT
3.0 V-only, 2048 Megabit (128M x 16-Bit/256M x 8-Bit) Page-Mode Flash Memory
Manufactured on 45-nm MirrorBit Eclipse process technology
Document Number: 002-13915 Rev. *E
Page 5 of 22
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