Data
Sheet
( A dva nce
I nf or ma ti on)
Notice On Data Sheet Designations
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The Advance Information designation indicates that Spansion LLC is developing one or more specific
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“This document contains information on one or more products under development at Spansion LLC.
The information is intended to help you evaluate this product. Do not design in this product without
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Combination
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option, temperature range, package type, or V
IO
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Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office.
ii
S75PL-N MirrorBit
™
ORNAND
™
MCPs
April 21, 2006 S75PL-N_00-01E
S75PL-N MirrorBit
™
ORNAND
™
MCPs
Stacked Multi-Chip Product (MCP)
S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write,
Page-mode Flash Memory (NOR Interface)
S30ML-P: ORNAND Flash (NAND interface)
3V pSRAM
Data Sheet
(Advance Information)
Features
Speed
– PL-N: 70 ns (initial access, 30 ns page access)
– ML-P: 30 ns (page access)
– pSRAM: 70 ns
107-Ball Fine-Pitch Ball Grid Array (FBGA)
– 9 x 12 x 1.4mm for ML512P based MCP's
– 11 x 13 x 1.4mm for ML01GP based MCPs
Operating Temperature Range
– Temperature Range of –25°C to +85°C
General Description
This document contains information for the S75PL-N MirrorBit MCP product. TheS75PL-N product consists of the following
devices:
S29PL-N
S30ML-P
3 V pSRAM
Flash/RAM Combinations Table
pSRAM Density
S29PL127N +
S30ML512P
S30ML01GP
32 Mb
S75PL127NBF
64 Mb
Product Selector Guide
Device
S75PL127NBF
pSRAM Density
32 Mb
pSRAM Type
pSRAM Type 7
For detailed specifications, please refer to the individual data sheets:
Document
S29PL-N
S30ML-P
32M pSRAM Type 7
Publication Identification Number (PID)
S29PL-N_M0
S30ML-GP_00
pSRAM_29
Publication Number
S75PL-N_00
Revision 01E
Issue Date
April 21, 2006
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design
in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
( A dva nce
I nf or ma ti on)
1.
S75PL
Ordering Information
The ordering part number is formed by a valid combination of the following:
127
N
B
F
JF
W
GZ
0
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER
Refer to the Valid Combinations table below
TEMPERATURE RANGE
W = Wireless (–25°C to +85°C)
PACKAGE TYPE AND MATERIAL
JA = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free Compliant package
JF = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free package
ORNAND DATA DENSITY
F = S30ML512P
G = S30ML01GP
pSRAM DENSITY
B = 32 Mb pSRAM
C = 64 Mb pSRAM
D = 128 Mb pSRAM
PROCESS TECHNOLOGY
N = 110 nm MirrorBit™ Technology
FLASH DENSITY
256 = 256 Mb
127 = 128 Mb (Single CE#)
DEVICE FAMILY
S75PL = 3.0 Volt-only Simultaneous Read/Write, Page Mode Flash Memory with Data storage
ORNAND and pSRAM
2
S75PL-N MirrorBit
™
ORNAND
™
MCPs
S75PL-N_00_01E April 21, 2006
Power technology
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