BM70BLE01FC2-0B04AA datasheet, PDF

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BM70BLE01FC2-0B04AA: DescriptionBluetooth BLE Module (802.15.1) Bluetooth BLE Module, Unshielded, No Antenna, 12x15mm, Industrial Temp; CategoryEmbedded solution Wireless rf module with The bluetooth module (802.15.1); File Size3MB，71 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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BM70BLE01FC2-0B04AA Overview

Bluetooth BLE Module (802.15.1) Bluetooth BLE Module, Unshielded, No Antenna, 12x15mm, Industrial Temp

BM70BLE01FC2-0B04AA Parametric

Parameter Name	Attribute value
Maker	Microchip
Product Category	Bluetooth module (802.15.1)
kind	Bluetooth Low Energy (BLE)
data rate	8.6 kb/s
Working power voltage	1.9 V to 3.6 V
Output Power	0 dBm
Minimum operating temperature	- 40 C
Maximum operating temperature	+ 85 C
Sensitivity	- 90 dBm
Interface Type	Serial
series	BM70
Encapsulation	Tube
antenna	External
size	12 mm x 15 mm x 2.4 mm
frequency	2.4 GHz
Frequency Range	2.402 GHz to 2.48 GHz
high	2.4 mm
length	15 mm
storage	24 kB, 32 kB, 256 kB
product	Bluetooth Modules
shield	Unshielded
type	USB Adapter
width	12 mm
Installation style	SMD/SMT
Antenna connector type	RF Pad
Factory packaging quantity	136
Receive supply current	3.2 mA
Transmit supply current	3.3 mA

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BM70/71

Bluetooth

Low Energy (BLE) Module

Features

• Qualified for Bluetooth SIG v5.0 core specification

• Certified to FCC, ISED, MIC, KCC, NCC, and

SRRC radio regulations

• Certified by European RED Assessed Radio

module

• Compliant to RoHS

• Supports UART interface

• Supports transparent UART data service of BLE

• The BM70 module supports 3-channel pulse-

width modulation (PWM) and the BM71 module

supports 1-channel PWM

• Supports Precision Temperature Sensor (PTS)

for ambient temperature detection

• Supports 12-bit ADC (ENOB=10 or 8 bits) for

battery and voltage detection

• Provides 8-channel ADC for the BM70 module

and 5-channel ADC for the BM71 module

• Features 18 general purpose I/O (GPIO) pins for

the BM70 module and 9 GPIO pins for the BM71

module

• Features integrated 32 MH

crystal

• Small and compact surface mount module

• Castellated surface mount pads for easy and

reliable host PCB mounting

FIGURE 1:

BM70 MODULE

FIGURE 2:

BM71 MODULE

RF Features

•

ISM band 2.402 GHz to 2.480 GHz operation

Channels: 0 to 39

Receive Sensitivity: typical -90 dBm (LE)

Transmit Power: 0 dBm (typical)

Received Signal Strength Indication (RSSI)

monitor with 1 dB resolution

Antenna

• Integrated chip antenna (BM7xBLES1FC2)

- Refer to

4.0 “Antenna”,

Table 4-1,

and

Table 4-2

for antenna performance

specifications

• External antenna connection through RF pad

(BM7xBLE01FC2)

MAC/Baseband/Higher Layer Features

• Secure AES128 encryption

• Bluetooth 4.2 specification optional features: GAP,

GATT, SMP, L2CAP and integrated public profile

• To create custom GATT services, refer to the

“BM70/71

Bluetooth® Low Energy Module User’s

Guide”

(DS50002542) for details.

• Configurable role as peripheral/central, client/

server

Power Management

• Two low power modes supported, with wake-up

through GPIO or internal timer

• Average current: Tx=3.3 mA and Rx=3.2 mA with

buck at 3.0V V

BAT

input and 18.75 ms connection

interval, when transmitting full data packets to

achieve a data rate of approximately 8.6 kbps



2015-2018 Microchip Technology Inc.

DS60001372H-Page 1

BM70/71

Table of Contents

1.0 Device Overview .............................................................................................................................................................................. 5

2.0 Application Information .................................................................................................................................................................. 13

3.0 Module Configuration ..................................................................................................................................................................... 25

4.0 Antenna.......................................................................................................................................................................................... 27

5.0 Electrical Characteristics................................................................................................................................................................ 37

6.0 Physical Dimensions ...................................................................................................................................................................... 43

7.0 Soldering Recommendations ......................................................................................................................................................... 51

8.0 Ordering Guide .............................................................................................................................................................................. 53

Appendix A: Certification Notices......................................................................................................................................................... 55

Appendix B: Revision History............................................................................................................................................................... 63

TO OUR VALUED CUSTOMERS

It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip

products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and

enhanced as new volumes and updates are introduced.

If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via

E-mail at

docerrors@microchip.com

or fax the

Reader Response Form

in the back of this data sheet to (480) 792-4150. We

welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.

The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current

devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision

of silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:

• Microchip’s Worldwide Web site;

http://www.microchip.com

• Your local Microchip sales office (see last page)

When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are

using.

Customer Notification System

www.microchip.com

to receive the most current information on all of our products.



2015-2018 Microchip Technology Inc.

DS60001372H-Page 3

BM70BLE01FC2-0B04AA Related Products

	BM70BLE01FC2-0B04AA	BM71BLE01FC2-0B04AA	BM70BLES1FC2-0B04AA	BM71BLES1FC2-0B04AA
Description	Bluetooth BLE Module (802.15.1) Bluetooth BLE Module, Unshielded, No Antenna, 12x15mm, Industrial Temp	Bluetooth BLE Module (802.15.1) Bluetooth BLE Module, Unshielded, No Antenna, 6x8mm, Industrial Temp	Bluetooth BLE Module (802.15.1) Bluetooth BLE Module, Shielded, Antenna, 12x22mm, Industrial Temp	Bluetooth BLE Module (802.15.1) Bluetooth BLE Module, Shielded, Antenna, 9x11.5mm, Industrial Temp
Maker	Microchip	Microchip	Microchip	Microchip
data rate	8.6 kb/s	8.6 kb/s	8.6 Mbps	8.6 Mbps
Minimum operating temperature	- 40 C	- 40 C	-40 °C	-40 °C
Maximum operating temperature	+ 85 C	+ 85 C	85 °C	85 °C
length	15 mm	15 mm	22 mm	11.5 mm
width	12 mm	12 mm	12 mm	9 mm

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