OCTAL 1000BASE-T TO SGMII CONVERTER
CTC-ENET-OCTAL-1G
PDS-229-2
PDS-249-3
Amphenol Aerospace adds Gigabit Ethernet to SGMII Converter to the
Integrated Electronic Products Line.
This product line is rugged, flexible, and affordable with many options available. This 1000BASE-T to SGMII Converter
couples SerDes technology and protocol conversion with a new level of ruggedization.
1000BASE-T COPPER INTERFACE
•
•
D38999 Shell Size 23
(100) Size 22 contacts
BENEFITS
•
•
•
•
1
18
29
32
SGMII INTERFACE
•
•
Samtec Q Series
®
High Speed Cable Assembly
Consult factory for specific type required
POWER SPECIFICATIONS
•
•
8
1
8 ports of Gigabit Ethernet
Conversion of 1000BASE-T to SGMII
Compliant with IEEE 802.3ab Ethernet Standards and
Specifications
Hermetic option available with a helium leak rate of
10-4 cc/sec
5V power connection in Samtec connector
Low power consumption
- Less than 5 watts
7
9
2
RUGGEDIZATION
•
•
•
•
•
Natural convection cooled
(no fan or cold plate required)
Operational temperature -40°C to +85°C
Storage temperature -50°C to +125°C
EMI/EMC compatible
Refer to page 5 for additional details
3
6
5
4
Jared Sibrava
•
Phone: (607) 643 - 1845
•
Email: jsibrava@amphenol-aao.com
www.amphenol-aao.com
• www.amphenolmao.com
OCTAL 1000BASE-T TO SGMII CONVERTER
CTC-ENET-OCTAL-1G
HOW TO ORDER:
1.
Connector Type
2.
Material
3.
SGMII Interface
4.
Finish
5.
Shell Style
6.
Option
(Hermetic or
Non-Hermetic)
7.
D38999
Connector
Rotation
8.
Main Keyway Rotation
CTC
STEP 1
:
Connector Type
CTC
Copper to Copper Media Conversion Family
STEP 2 :
Material
-5
-6
Aluminum Shell
Composite Shell
Stainless Steel Shell
STEP 3 :
SGMII Interface
-5
Samtec Q Series® Connector
STEP 4:
FinIsh
T
Z
F
M
W
J
L
Y
Aluminum Durmalon
Aluminum Black Zinc Nickel
Aluminum Electroless Nickel
Composite Electroless Nickel
Aluminum OD Cad
Composite OD Cad
Stainless Steel Electrodeposited Nickel
Stainless Steel Passivated
-8
STEP 5 :
Shell Style
0
Wall Mount
STEP 6 :
Option
05
06
Non-Hermetic
Hermetic
STEP 7 :
D38999 Connector Rotation
N
A
B
C
D
N
A
B
C
D
STEP 8 :
Main Keyway Rotation
W
X
Y
Z
0
°
90
°
180
°
270
°
AVAILABLE TEST EQUIPMENT
Part Number
CA-628485-A30
Test Cable
Description
RJ45 Test Cable for D38999 Connector, 5’
RJ45 Test Cable for D38999 Connector, 10’
RJ45 Test Cable for D38999 Connector, 15’
RJ45 Test Cable for D38999 Connector, 20’
SMA Test Board for Samtec Connector
CA-628485-A31
CA-628485-A32
CA-628485-A33
CF-020005-013
Test Board
Jared Sibrava
•
Phone: (607) 643 - 1845
•
Email: jsibrava@amphenol-aao.com
www.amphenol-aao.com
• www.amphenolmao.com
AMPHENOL INTEGRATED ELECTRONIC
PRODUCTS RUGGEDIZATION DESIGN
OVERVIEW
Amphenol integrated electronic products are designed and manufactured to our Ruggedization guidelines listed below. These guidelines
ensure years of reliable operation in harsh environment applications where extreme operating temperatures, shock, vibration and
corrosive atmospheres are regularly experienced
TEMPERATURE
• Operating Temperature - Thermal Cycles between -40°C and
85°C while device is operating
• Temperature is measured at chassis housing or card edge
• Storage Temperature - Thermal Cycles between -55°C and
125°C
ALTITUDE
• -1,500 to 60,000 ft Altitude Testing w/ Rapid Depressurization
ELECTROMAGNETIC COMPATIBILITY
• Designed to comply with MIL-STD-461E
PRINTED CIRCUIT BOARD ASSEMBLIES
•
Conformal Coat
- Amphenol performs Conformal Coating to both sides of
printed circuit board assemblies using HUMISEAL IB31 in
accordance with IPC-610, Class 3.
Printed Circuit Board Rigidity
- Amphenol printed circuit boards are fabricated in
accordance with IPC-6012, Class 3.
Printed Circuit Board Fabrication
- Amphenol printed circuit boards acceptance criteria is in
accordance with IPC-610, Class 3.
HUMIDITY
• Operating Humidity – Humidity cycle between 0-100% non-
condensing humidity while device is operating
• Storage Humidity – Humidity cycle between 0-100%
condensing humidity
•
SEALING
• Sealing can be optionally provided at the MIL-DTL-38999
interface with up to 10-5 cc/sec performance
•
FLUIDS SUSCEPTIBILITY
• MIL-DTL-38999 receptacle interface per EIA-364-10E
RELIABILITY PREDICTIONS (MTBF)
Amphenol can perform Mean Time Between Failure (MTBF)
reliability analysis in full compliance with MIL-HDBK-217F-1
Parts Count Prediction and MIL-HDBK-217F-1 Parts Stress
Analysis Prediction. We can also perform reliability analyses in
full compliance of ANSI/VITA 51.1 if it is required or preferred
over the later method.
VIBRATION & SHOCK
•
Sine Vibration – 10 g Peak, 5-2,000Hz
- Based on a sine sweep duration of 10 minutes per axis
in each of three mutually perpendicular axes. May be
displacement limited from 5 to 44 Hz, depending on specific
test.
Random Vibration - 0.005@5Hz, 0.1@15Hz, 0.1@2,000Hz
-60 minutes per axis, in each of three mutually perpendicular
axes.
40 G Peak Shock Cycle
-Three hits in each axis, both directions, ½ sine and terminal-
peak saw tooth, Total 36 hits.
•
•
Notice: Specifications are subject to change without notice. Contact your nearest Amphenol Corporation Sales Office for the latest specifications. All statements, information and data given
herein are believed to be accurate and reliable but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning possible
use of our products are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should assume
that all safety measures are indicated or that other measures may not be required. Specifications are typical and may not apply to all connectors.
AMPHENOL is a registered trademark of Amphenol Corporation.
©2018 Amphenol Corporation REV:4/12/2018
Jared Sibrava
•
Phone: (607) 643 - 1845
•
Email: jsibrava@amphenol-aao.com
www.amphenol-aao.com
• www.amphenolmao.com
京公网安备 11010802033920号
EEWORLD
