SERVER-CLASS EMBEDDED PERFORMANCE
conga-TS170
-
6
th
Generation Intel
®
Core
™
processor
-
Intel
®
Gen9 HD Graphics with HEVC (H.265) support
up to Intel
®
Iris
™
Pro Graphics P580
-
ECC memory support
-
Up to 32 GByte dual channel DDR4 memory
-
Intel
®
Xeon
®
processors for data center applications
Formfactor
CPU
COM Express
®
Basic, (95 x 125 mm), Type 6 Connector Pinout
Intel
®
Xeon
®
E3-1578LV5
Intel
®
Xeon
®
E3-1558LV5
Intel
®
Xeon
®
E3-1515MV5
Intel
®
Xeon
®
E3-1505MV5
Intel
®
Xeon
®
E3-1505LV5
Intel
®
Core
TM
i7-6820EQ
Intel
®
Core
TM
i7-6822EQ
Intel
®
Core
TM
i5-6440EQ
Intel Core
®
TM
Quad Core
Quad Core
Quad Core
Quad Core
Quad Core
Quad Core
Quad Core
Quad Core
Quad Core
Dual Core
Dual Core
Dual Core
Dual Core
2.0 / 3.4 GHz
1.9 / 3.3 GHz
2.8 / 3.7 GHz
2.8 / 3.7 GHz
2.0 / 2.8 GHz
2.8 / 3.5 GHz
2.0 / 2.8 GHz
2.7 / 3.7 GHz
1.9 / 2.7 GHz
2.7 GHz
1.9 GHz
2.4 GHz
1.6 GHz
8 MB Cache 45W TDP, 35W cTDP Iris
TM
Pro P580 Graphics 0.35-1.0 GHz
8 MB Cache 45W TDP, 35W cTDP Iris
TM
Pro P555 Graphics 0.35-1.0 GHz
8 MB Cache 45W TDP, 35W cTDP Iris
TM
Pro P580 Graphics 0.35-1.0 GHz
8 MB Cache 45W TDP, 35W cTDP HD P530 Graphics 0.35-1.05 GHz
8 MB Cache 25W TDP
8 MB Cache 45W TDP
8 MB Cache 25W TDP
6 MB Cache 45W TDP
6 MB Cache 25W TDP
3 MB Cache 35W TDP
3 MB Cache 25W TDP
2 MB Cache 35 W TDP
2 MB Cache 15W TDP
HD P530 Graphics 0.35-1.0 GHz
HD 530 Graphics 0.35-1.0 GHz
HD 530 Graphics 0.35-1.0 GHz
HD 530 Graphics 0.35-1.0 GHz
HD 530 Graphics 0.35-1.0 GHz
HD 530 Graphics 0.35-0.95 GHz
HD 530 Graphics 0.35-0.95 GHz
HD 530 Graphics 0.542-0.792 GHz
HD 510 Graphics 0.35-0.95 GHz
i5-6442EQ
Intel
®
Core
TM
i3-6100E
Intel
®
Core
TM
i3-6102E
Intel
®
Celeron
®
G3900E
Intel
®
Celeron
®
G3902E
Intel
®
Turbo Boost Technology | Intel
®
Hyper-Threading Technology (Intel
®
HT Technology) | Intel
®
Advanced Vector Extensions 2.0 (Intel
®
AVX2)
Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI) | Integrated dual channel memory controller | up to 34,1 GByte/sec. memory
bandwidth | Integrated Intel
®
Gen9 HD Graphics with frequency up to 1GHz | Intel
®
Clear Video HD Technology | Intel
®
Virtualization Technology
(Intel
®
VT) | Intel
®
Trusted Execution Technology (Intel
®
TXT) | Intel
®
Secure Key
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32GByte dual channel, Intel
®
Xeon
®
and Intel
®
Core
®
i3 with ECC support
Mobile Intel
®
100 Series Chipset
Intel
®
i219-LM GbE LAN Controller with AMT 11 support
8x PCI Express™ gen. 3.0 lanes | 4x Serial ATA
®
Gen 3 |
4x USB
3.0 (XHCI) | 8x USB 2.0 (XHCI) | 1x PEG x16 Gen 3 | LPC bus (no DMA) |
I²C bus (fast mode, 400 kHz, multi-master) | 2x UART
Digital High Definition Audio Interface with support for multiple audio codecs
Intel
®
Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3 and DirectX12 (for Windows 10) support | up to three independent displays: HDMI
1.4a / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support
@ 40 MBit/s | HEVC, VP8, VP9 and VDENC encoding
Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 |
Automatic Panel Detection via EDID/EPI
3x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup |
I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
AMI Aptio
®
UEFI 2.x firmware | 8/16 MByte serial SPI firmware flash
The conga-TS170 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0). It is capable of calculating efficient hash and
RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e
commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 4.0 with battery support
Microsoft
®
Windows 10 | Microsoft
®
Windows 10 IoT Enterprise | Microsoft
®
Windows 7 | Linux | Microsoft
®
Windows embedded Standard
See User’s Guide for full details
Operating: 0 .. +60°C
Storage: -20 .. +80°C
Storage: 5 - 95% r. H. non cond.
LVDS
(eDP optional)
Digital Display Interface (DDI)
congatec Board Controller
Embedded BIOS Features
Security
Power Management
Operating Systems
Power Consumption
Temperature
Humidity
Size
Operating: 10 - 90% r. H. non cond.
95 x 125 mm (3.74” x 4.92”)
www.congatec.com
conga-TS170
| Order Information
Article
conga-TS170/E3-1578LV5
conga-TS170/E3-1558LV5
conga-TS170/E3-1515MV5
conga-TS170/E3-1505MV5
conga-TS170/E3-1505LV5
conga-TS170/i7-6820EQ
conga-TS170/i7-6822EQ
conga-TS170/i5-6440EQ
conga-TS170/i5-6442EQ
conga-TS170/i3-6100E ECC
conga-TS170/i3-6102E ECC
conga-TS170/i3-6100E
conga-TS170/i3-6102E
conga-TS170/G3900E
conga-TS170/G3902E
PN
045913
045914
045912
045906
045907
045900
045901
045902
045903
045908
045909
045904
045905
045910
045911
Description
COM Express Type 6 Basic module with Skylake-H Intel
®
Xeon
®
E3-1578L V5 quad core processor with 2.0GHz up to 3.4GHz, 8MB
L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Skylake-H Intel
®
Xeon
®
E3-1558L V5 quad core processor with 1.9GHz up to 3.3GHz, 8MB
L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Skylake-H Intel
®
Xeon
®
E3-1515M V5 quad core processor with 2.8GHz up to 3.7GHz,
8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Skylake-H Intel
®
Xeon
®
E3-1505M V5 quad core processor with 2.8GHz up to 3.7GHz,
8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Skylake-H Intel
®
Xeon
®
E3-1505L V5 quad core processor with 2.0GHz up to 2.8GHz, 8MB
L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Skylake-H Intel
®
Core™ i7-6820EQ quad core processor with 2.8GHz up to 3.5GHz,
8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170
COM Express Type 6 Basic module with Skylake-H Intel
®
Core™ i7-6822EQ quad core processor with 2.0GHz up to 2.8GHz,
8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170
COM Express Type 6 Basic module with Skylake-H Intel
®
Core™ i5-6440EQ quad core processor with 2.7GHz up to 3.4GHz,
6MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170
COM Express Type 6 Basic module with Skylake-H Intel
®
Core™ i5-6442EQ quad core processor with 1.9GHz up to 2.7GHz,
6MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170
COM Express Type 6 Basic module with Skylake-H Intel
®
Core™ i3-6100E dual core processor with 2.7GHz, 3MB L2 cache,
GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Skylake-H Intel
®
Core™ i3-6102EQ dual core processor with 1.9GHz, 3MB L2 cache,
GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
COM Express Type 6 Basic module with Skylake-H Intel
®
Core™ i3-6100E dual core processor with 2.7GHz, 3MB L2 cache,
GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170
COM Express Type 6 Basic module with Skylake-H Intel
®
Core™ i3-6102EQ dual core processor with 1.9GHz, 3MB L2 cache,
GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170
COM Express Type 6 Basic module with Skylake-H Intel
®
Celeron
®
G3900E dual core processor with 2.4GHz, 2MB L2 cache,
GT1 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170
COM Express Type 6 Basic module with Skylake-H Intel
®
Celeron
®
G3902E dual core processor with 1.6GHz, 2MB L2 cache,
GT1 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170
Article
conga-TS170/HSP-HP-B
conga-TS170/HSP-HP-T
conga-TS170/CSP-HP-B
conga-TS170/CSP-HP-T
conga-TS170/CSA-HP-B
conga-TS170/CSA-HP-T
PN
045934
045935
045932
045933
045930
045931
Description
Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes.
All standoffs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes.
All standoffs are M2.5mm thread.
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes,
15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes,
15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread.
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes,
15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes,
15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
4 GByte DDR4 SODIMM memory module with 2400 MT/s
8 GByte DDR4 SODIMM memory module with 2400 MT/s
16 GByte DDR4 SODIMM memory module with 2400 MT/s
4 GByte DDR4 ECC SODIMM memory module with 2400 MT/s
8 GByte DDR4 ECC SODIMM memory module with 2400 MT/s
16 GByte DDR4 ECC SODIMM memory module with 2400 MT/s
Evaluation carrier board for Type 6 COM-Express-modules
LVDS to DVI converter board for digital flat panels with onboard EEPROM
Connector for COM-Express carrier boards, height 5mm, packing unit 4 pieces
Connector for COM-Express carrier boards, height 8mm, packing unit 4 pieces
DDR4-SODIMM-2400 (4GB)
DDR4-SODIMM-2400 (8GB)
DDR4-SODIMM-2400 (16GB)
DDR4-SODIMM-2400 ECC (4GB)
DDR4-SODIMM-2400 ECC (8GB)
DDR4-SODIMM-2400 ECC (16GB)
conga-TEVAL
conga-LDVI/EPI
COMe-carrier-board-Socket-5
COMe-carrier-board-Socket-8
068790
068791
068792
068795
068796
068797
065800
011115
400007
400004
© 2018 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. Jan 29, 2018 MR
www.congatec.com
京公网安备 11010802033920号
EEWORLD
