S71GL016A40BFW3J3 datasheet, PDF

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S71GL016A40BFW3J3: DescriptionStacked Multi-Chip Product (MCP) Flash Memory and RAM; Categorystorage storage; File Size157KB，9 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S71GL016A40BFW3J3 Overview

Stacked Multi-Chip Product (MCP) Flash Memory and RAM

S71GL016A40BFW3J3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Contacts	56
Reach Compliance Code	unknow
Other features	PSRAM IS ORGANIZED AS 256K X 16
JESD-30 code	R-PBGA-B56
JESD-609 code	e1
length	9 mm
memory density	16777216 bi
Memory IC Type	MEMORY CIRCUIT
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	56
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.1 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	7 mm

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S71GL016A Based MCPs

Stacked Multi-Chip Product (MCP)

Flash Memory and RAM

16 Megabit (1M x 16-bit) CMOS 3.0 Volt-only

Page Mode Flash Memory

4 Megabit (256K x 16-bit) pSRAM

Data Sheet

(Advance Information)

S71GL016A Based MCPs Cover Sheet

Notice to Readers:

This document states the current technical specifications regarding the Spansion

product(s) described herein. Each product described herein may be designated as Advance Information,

Preliminary, or Full Production. See

Notice On Data Sheet Designations

for definitions.

Publication Number

S71GL016A_00

Revision

Amendment

Issue Date

June 20, 2006

Data

Sheet

( A dvan ce

I nfo r ma ti on)

Notice On Data Sheet Designations

Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise readers of

product information or intended specifications throughout the product life cycle, including development,

qualification, initial production, and full production. In all cases, however, readers are encouraged to verify

that they have the latest information before finalizing their design. The following descriptions of Spansion data

sheet designations are presented here to highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion LLC is developing one or more specific

products, but has not committed any design to production. Information presented in a document with this

designation is likely to change, and in some cases, development on the product may discontinue. Spansion

LLC therefore places the following conditions upon Advance Information content:

“This document contains information on one or more products under development at Spansion LLC.

The information is intended to help you evaluate this product. Do not design in this product without

contacting the factory. Spansion LLC reserves the right to change or discontinue work on this

proposed product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a commitment

to production has taken place. This designation covers several aspects of the product life cycle, including

product qualification, initial production, and the subsequent phases in the manufacturing process that occur

before full production is achieved. Changes to the technical specifications presented in a Preliminary

document should be expected while keeping these aspects of production under consideration. Spansion

places the following conditions upon Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. The Preliminary status of this document indicates that product qualification has been

completed, and that initial production has begun. Due to the phases of the manufacturing process that

require maintaining efficiency and quality, this document may be revised by subsequent versions or

modifications due to changes in technical specifications.”

Combination

Some data sheets contain a combination of products with different designations (Advance Information,

Preliminary, or Full Production). This type of document distinguishes these products and their designations

wherever necessary, typically on the first page, the ordering information page, and pages with the DC

Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first

page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal changes

are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include

those affecting the number of ordering part numbers available, such as the addition or deletion of a speed

option, temperature range, package type, or V

range. Changes may also include those needed to clarify a

description or to correct a typographical error or incorrect specification. Spansion LLC applies the following

conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. Spansion LLC deems the products to have been in sufficient production volume

such that subsequent versions of this document are not expected to change. However, typographical

or specification corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office.

S71GL016A Based MCPs

S71GL016A_00_A1 June 20, 2006

S71GL016A40BFW3J3 Related Products

	S71GL016A40BFW3J3	S71GL016A	S71GL016A40BAW3J0	S71GL016A40BAW3J2	S71GL016A40BFW3J0	S71GL016A40BAW3J3	S71GL016A40BFW3J2	S71GL016A40
Description	Stacked Multi-Chip Product (MCP) Flash Memory and RAM	Stacked Multi-Chip Product (MCP) Flash Memory and RAM	Stacked Multi-Chip Product (MCP) Flash Memory and RAM	Stacked Multi-Chip Product (MCP) Flash Memory and RAM	Stacked Multi-Chip Product (MCP) Flash Memory and RAM	Stacked Multi-Chip Product (MCP) Flash Memory and RAM	Stacked Multi-Chip Product (MCP) Flash Memory and RAM	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
Is it Rohs certified?	conform to	-	incompatible	incompatible	conform to	incompatible	conform to	-
Maker	SPANSION	-	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION	-
Parts packaging code	BGA	-	BGA	BGA	BGA	BGA	BGA	-
package instruction	9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	-	TFBGA,	TFBGA,	9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	TFBGA,	9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	-
Contacts	56	-	56	56	56	56	56	-
Reach Compliance Code	unknow	-	compli	compli	unknow	compli	unknow	-
Other features	PSRAM IS ORGANIZED AS 256K X 16	-	PSRAM IS ORGANIZED AS 256K X 16	PSRAM IS ORGANIZED AS 256K X 16	PSRAM IS ORGANIZED AS 256K X 16	PSRAM IS ORGANIZED AS 256K X 16	PSRAM IS ORGANIZED AS 256K X 16	-
JESD-30 code	R-PBGA-B56	-	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	-
JESD-609 code	e1	-	e0	e0	e1	e0	e1	-
length	9 mm	-	9 mm	9 mm	9 mm	9 mm	9 mm	-
memory density	16777216 bi	-	16777216 bi	16777216 bi	16777216 bi	16777216 bi	16777216 bi	-
Memory IC Type	MEMORY CIRCUIT	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	-
memory width	16	-	16	16	16	16	16	-
Number of functions	1	-	1	1	1	1	1	-
Number of terminals	56	-	56	56	56	56	56	-
word count	1048576 words	-	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	-
character code	1000000	-	1000000	1000000	1000000	1000000	1000000	-
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	85 °C	-	85 °C	85 °C	85 °C	85 °C	85 °C	-
Minimum operating temperature	-25 °C	-	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-
organize	1MX16	-	1MX16	1MX16	1MX16	1MX16	1MX16	-
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TFBGA	-	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	-
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	-	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	-
Peak Reflow Temperature (Celsius)	260	-	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED	260	-
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	1.2 mm	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-
Maximum supply voltage (Vsup)	3.1 V	-	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V	-
Minimum supply voltage (Vsup)	2.7 V	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	-
Nominal supply voltage (Vsup)	3 V	-	3 V	3 V	3 V	3 V	3 V	-
surface mount	YES	-	YES	YES	YES	YES	YES	-
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	OTHER	-	OTHER	OTHER	OTHER	OTHER	OTHER	-
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	-
Terminal form	BALL	-	BALL	BALL	BALL	BALL	BALL	-
Terminal pitch	0.8 mm	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	-
Terminal location	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-
Maximum time at peak reflow temperature	40	-	NOT SPECIFIED	NOT SPECIFIED	40	NOT SPECIFIED	40	-
width	7 mm	-	7 mm	7 mm	7 mm	7 mm	7 mm	-

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