S29GL01GP12TFI013 datasheet, PDF

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S29GL01GP12TFI013: Description1G X 1 FLASH 3V PROM, 110 ns, PDSO56; Categorystorage storage; File Size981KB，71 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S29GL01GP12TFI013 Overview

1G X 1 FLASH 3V PROM, 110 ns, PDSO56

S29GL01GP12TFI013 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	TSOP1
package instruction	HTSSOP, TSSOP56,.8,20
Contacts	56
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Maximum access time	120 ns
Spare memory width	8
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PDSO-G56
JESD-609 code	e3
length	18.4 mm
memory density	1073741824 bi
Memory IC Type	FLASH
memory width	1
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	1K
Number of terminals	56
word count	1073741824 words
character code	1000000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1GX1
Package body material	PLASTIC/EPOXY
encapsulated code	HTSSOP
Encapsulate equivalent code	TSSOP56,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
page size	8/16 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	128K
Maximum standby current	0.000005 A
Maximum slew rate	0.11 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	14 mm
Base Number Matches	1

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S29GL-P MirrorBit

Flash Family

S29GL01GP, S29GL512P, S29GL256P, S29GL128P

1 Gigabit, 512 Megabit , 256 Megabit and 128 Megabit

3.0 Volt-only Page Mode Flash Memory featuring

90 nm MirrorBit Process Technology

S29GL-P MirrorBit

Flash Family Cover Sheet

Data Sheet

(Advance Information)

Notice to Readers:

This document contains information on one or more products under development at

Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product

without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this

proposed product without notice.

Publication Number

S29GL-P_00

Revision

Amendment

Issue Date

November 21, 2006

Data

Sheet

(Advan ce

Infor m a tio n)

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of

product information or intended specifications throughout the product life cycle, including development,

qualification, initial production, and full production. In all cases, however, readers are encouraged to verify

that they have the latest information before finalizing their design. The following descriptions of Spansion data

sheet designations are presented here to highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more specific

products, but has not committed any design to production. Information presented in a document with this

designation is likely to change, and in some cases, development on the product may discontinue. Spansion

Inc. therefore places the following conditions upon Advance Information content:

“This document contains information on one or more products under development at Spansion Inc.

The information is intended to help you evaluate this product. Do not design in this product without

contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a commitment

to production has taken place. This designation covers several aspects of the product life cycle, including

product qualification, initial production, and the subsequent phases in the manufacturing process that occur

before full production is achieved. Changes to the technical specifications presented in a Preliminary

document should be expected while keeping these aspects of production under consideration. Spansion

places the following conditions upon Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. The Preliminary status of this document indicates that product qualification has been

completed, and that initial production has begun. Due to the phases of the manufacturing process that

require maintaining efficiency and quality, this document may be revised by subsequent versions or

modifications due to changes in technical specifications.”

Combination

Some data sheets contain a combination of products with different designations (Advance Information,

Preliminary, or Full Production). This type of document distinguishes these products and their designations

wherever necessary, typically on the first page, the ordering information page, and pages with the DC

Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first

page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal changes

are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include

those affecting the number of ordering part numbers available, such as the addition or deletion of a speed

option, temperature range, package type, or V

range. Changes may also include those needed to clarify a

description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following

conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. Spansion Inc. deems the products to have been in sufficient production volume such

that subsequent versions of this document are not expected to change. However, typographical or

specification corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local sales office.

S29GL-P MirrorBit

Flash Family

S29GL-P_00_A3 November 21, 2006

Data

Sheet

(Advan ce

Infor m a tio n)

Table of Contents

General Description

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Distinctive Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Performance Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table of Contents

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

List of Figures

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

List of Tables

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Ordering Information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1

Recommended Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Input/Output Descriptions & Logic Symbol

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Block Diagram

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Physical Dimensions/Connection Diagrams

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.1

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.2

Special Handling Instructions for BGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.3

LAA064—64 ball Fortified Ball Grid Array, 11 x 13 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4.4

TS056—56-Pin Standard Thin Small Outline Package (TSOP) . . . . . . . . . . . . . . . . . . . . . . 11

Additional Resources.

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.1

Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.2

Specification Bulletins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.3

Hardware and Software Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.4

Contacting Spansion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Product Overview

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

6.1

Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Device Operations

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.1

Device Operation Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.2

Word/Byte Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.3

VersatileIO

) Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.4

Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.5

Page Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.6

Autoselect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.7

Program/Erase Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.8

Write Operation Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.9

Writing Commands/Command Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Advanced Sector Protection/Unprotection

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.1

Lock Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.2

Persistent Protection Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.3

Persistent Protection Bit Lock Bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.4

Password Protection Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.5

Advanced Sector Protection Software Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8.6

Hardware Data Protection Methods. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Conservation Modes

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.1

Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.2

Automatic Sleep Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.3

Hardware RESET# Input Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9.4

Output Disable (OE#). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Secured Silicon Sector Flash Memory Region

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.1 Factory Locked Secured SiliconSector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.2 Customer Lockable Secured Silicon Sector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.3 Secured Silicon Sector Entry/Exit Command Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . .

10.

11.

Electrical Specifications

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

11.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

S29GL-P MirrorBit

Flash Family

S29GL-P_00_A3 November 21, 2006

D at a

S hee t

(Adva nce

In for m ation)

11.2

11.3

11.4

11.5

11.6

11.7

12.

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Key to Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Appendix

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

12.1 Command Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

12.2 Common Flash Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Revision Summary

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

13.

List of Figures

Figure 3.1

Figure 4.1

Figure 4.2

Figure 4.3

Figure 6.1

Figure 7.1

Figure 7.2

Figure 7.3

Figure 7.4

Figure 8.1

Figure 8.2

Figure 8.3

Figure 11.1

Figure 11.2

Figure 11.3

Figure 11.4

Figure 11.5

Figure 11.6

Figure 11.7

Figure 11.8

Figure 11.9

Figure 11.10

Figure 11.11

Figure 11.12

Figure 11.13

Figure 11.14

Figure 11.15

S29GL-P Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

64-ball Fortified Ball Grid Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

LAA064—64ball Fortified Ball Grid Array (FBGA), 11 x 13 mm . . . . . . . . . . . . . . . . . . . . . . . .9

56-Pin Thin Small Outline Package (TSOP), 14 x 20 mm . . . . . . . . . . . . . . . . . . . . . . . . . . .11

S29GL01GP Sector & Memory Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Single Word Program. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Write Buffer Programming Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

Sector Erase Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Write Operation Status Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

Advanced Sector Protection/Unprotection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

PPB Program/Erase Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

Lock Register Program Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

Maximum Negative Overshoot Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Maximum Positive Overshoot Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Test Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Input Waveforms and Measurement Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Read Operation Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Page Read Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52

Reset Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Power-up Sequence Timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Program Operation Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55

Accelerated Program Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55

Chip/Sector Erase Operation Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56

Data# Polling Timings (During Embedded Algorithms) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56

Toggle Bit Timings (During Embedded Algorithms) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57

DQ2 vs. DQ6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Alternate CE# Controlled Write (Erase/Program) Operation Timings . . . . . . . . . . . . . . . . . . 59

List of Tables

Table 2.1

Table 6.1

Table 6.2

Table 6.3

Table 7.1

Table 7.2

Table 7.3

Table 7.4

Table 7.5

Input/Output Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

S29GL512P Sector & Memory Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

S29GL256P Sector & Memory Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

S29GL128P Sector & Memory Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Device Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Autoselect Codes, (High Voltage Method) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Autoselect Addresses in System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Autoselect Entry in System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

Autoselect Exit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

November 21, 2006 S29GL-P_00_A3

S29GL-P MirrorBit

Flash Family

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Isolated amplifier circuit using photodiode and ISOl00

Android 2.2 test run was successful, here are some effect pictures: On June 24, Google released version 2.2 of the Android operating system , code-named Froyo. Shenzhen Youjian Hengtian Technology Co., Ltd. also quickly and successfully transplanted this version to th...; urbetter Embedded System

Undertake PCB design part-time: Many years of full-time PCB design experience, the main software used are Cadence (Allegro), PADS (PowerPCB), Altium Designer (PROTEL), CAM350, can design 2-20 layers of boards, and have mature experi...; cjm2006 PCB Design

Explanation and correction of MSP430 MCU __delay_cycles precise delay: Here, I want to discuss the issue of using __delay_cycles delay in MSP430 microcontroller. IAR for MSP430 compiler provides a compiler inline precise delay function (not a real function) to provide us...; fish001 Microcontroller MCU

EEWORLD University Hall----TI Smart Speaker and Sound Bar- Audio Session: TI Smart Speaker and Sound Bar - Audio Course : https://training.eeworld.com.cn/course/5539...; hi5 Talking

DS18B20 Temperature Sensor Usage: DS18B20 has a better thermal resistance coefficient than ordinary thermistors. It outputs a variable voltage signal, which is stable....; 15075039ZQ MCU

[Xiao Meige FPGA Advanced Tutorial] Chapter 6 PS2 Keyboard Driver Design and Verification: [align=center][color=#000][size=15px][font=等线][size=6]Chapter 6 PS2 Keyboard Driver Design and Verification[/size][/font][/size][/color][/align][align=center][color=#000][size=15px][font=等线][size=6] [...; 芯航线跑堂 FPGA/CPLD

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