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SEAF8-20-05.0-L-04-2-K

Description
Board-to-Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed ​​High-Density Open-Pin-Field Array Socket
CategoryThe connector    Surface plate and sandwich connector   
File Size1MB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric View All

SEAF8-20-05.0-L-04-2-K Overview

Board-to-Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed ​​High-Density Open-Pin-Field Array Socket

SEAF8-20-05.0-L-04-2-K Parametric

Parameter NameAttribute value
MakerSAMTEC
Product CategoryBoard-to-Board and Mezzanine Connectors
Shipping restrictionsMouser does not currently sell this product.
productConnectors
Number of locations80 Position
Pitch0.8 mm
Number of rows4 Row
Termination typeSMD/SMT
Installation angleStraight
Current rating1.3 A
Voltage rating220 VAC
seriesSEAF8
EncapsulationBulk
applicationPower, Signal
Contact platingGold
Shell materialLiquid Crystal Polymer (LCP)
Contact materialCopper Alloy
Installation styleSMD
Maximum operating temperature+ 125 C
Minimum operating temperature- 55 C
Factory packaging quantity1
F-219
SEAF8–50–05.0–S–10–2–K
SEAF8–30–05.0–S–04–2–K
(0.80 mm) .0315"
SEAF8 SERIES
ULTRA-HIGH DENSITY OPEN-PIN-FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAF8
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Current Rating:
1.3 A per pin
(10 adjacent pins powered)
Working Voltage:
220 VAC
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Board Mates:
SEAM8
Cable Mates:
ESCA
Standoffs:
JSO
Signal Integrity optimized
Edge Rate
®
contact
Lead-Free
solder charge
terminations
POWER/SIGNAL
APPLICATION
7 mm and 10 mm
stack heights
4, 6, 8 and
10 rows
Up to 500 I/Os
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
HIGH-SPEED CHANNEL PERFORMANCE
SEAM8/SEAF8 @ 7 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data
visit Samtec.com or contact
SIG@samtec.com
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
SEAF8
NO. PINS
PER ROW
05.0
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
K
= Polyimide
film Pick &
Place Pad
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Other pin counts
–10, – 20, – 30, –40, –50
(Standard sizes)
= 10 µ"
(0.25 µm)
Gold on
contact area,
Matte Tin on
solder tail
–L
=Four Rows
– 04
– 06
– 08
– 10
= Lead-Free
Solder Charge
–2
–K
=Six Rows
MATED HEIGHT*
SEAF8
LEAD
STYLE
SEAM8 LEAD STYLE
–S02.0
–S05.0
(10.00) .394
–05.0
(7.00) .276
= 30 µ"
(0.76 µm)
Gold on
contact area,
Matte Tin on
solder tail
–S
=Eight Rows
=Ten Rows
*Processing conditions will affect
mated height.
NO. OF
ROWS
–04
A
(4.30)
.169
(6.30)
.248
(8.30)
.327
(10.30)
.406
No. of positions x
(0.80) .0315 + (5.84) .230
(0.75)
.029
06
–06
–08
A
01
–10
(1.27)
.050
Notes:
Patent Pending
Tape & Reel packaging
is standard.
Some sizes, styles and
options are non-standard,
non-returnable.
(4.57)
.180
(1.10) (1.32)
(1.32)
.043 x .052
.052 DIA
No. of positions x
(0.80) .0315 + (2.56) .101
(2.87)
.113
(0.80)
.0315
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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