ExpressPort
®
SFP+
Amphenol ICC’s ExpressPort
®
SFP+ interconnect system
provides data transfer speeds of up to 16Gb/s. The design
of the ExpressPort
®
SFP+ connector minimizes impedance
discontinuities and reflections at high data rates and
provides a 10 to 20 dB improvement in Near-End Crosstalk.
The ExpressPort
®
SFP+ unique cage construction features
EMI shielding available in the form of metal spring fingers
or elastomeric gaskets. Additional features available
include light pipes, heat sinks and many other custom
features.
TARGET MARKETS
TECHNICAL INFORMATION
MATERIAL
§§
Housing: Black or nature color, Glass-reinforced,
ELECTRICAL PERFORMANCE
§§
Operating Voltage: 30 VDC per contact
§§
Operating Current: 0.5 A per contact
§§
Differential Impedance: 100Ω +/- 10Ω
lead-free solder reflow process compatible
thermoplastic
§§
Contacts Base Material: Phosphor Bronze
§§
Plating Solder Tails: Matte tin or gold flash
ENVIRONMENTAL
§§
Operating and (Storage) Temperature: -55° to +85°C
§§
RoHS & Halogen-Free
options
§§
Plating Mating Area: Gold
§§
Resonance Dampening Feature: Conductive
Polymer
TOOLING INFORMATION
§§
Options, Heat Sink and Clip: Available
EMI
§§
Configurations:
§§
(N = 1,2,3,4,5,6,8)
1xN
§§
2xN (N = 1,2,3,4,5,6,8)
MECHANICAL PERFORMANCE
§§
Durability: 250 mating cycles
§§
Mating Force: 50 N max.
§§
Card Entry Slot: 1.0mm-thick integrated circuit
cards
§§
Contact Normal Force: 100 grams
§§
Thickness Single Side (Cage): 1.57 mm (0.062
PCB
TARGET MARKETS/APPLICATIONS
Cellular Infrastructure
Network Interface Cards
Switch
Hubs
Servers
Storage
Test and Measurement Equipment
in.) min.
§§
Thickness Belly to Belly (Cage): 3.00 mm
PCB
(0.118 in.) min.
§§
Unmating Force (Cage): 11.50 N max.
§§
Insertion Force to PCB (Cage):
§§
1000 N for 2 port
§§
2100 N for 4 port
§§
3000 N for 6 port
www.amphenol-icc.com
Amphenol Information Communications and Commercial Products
ExpressPort
®
SFP+
ExpressPort
®
SFP+ Connector
UE76
Style
A
A
20
X
0
X
0
T
Packaging
T
Tape & Reel (500/Reel)
Option 3
0
Standard
R/A Single Surface Mount Connector
Number of Positions
20 20 Positions
Contact Plating
2 30 μ” (0.76 μm) Gold Plating on Mating Area; Gold Flash on Termination
3 30 μ” (0.76 μm) Gold Plating on Mating Area; Matte Tin on Termination
5 15 μ” (0.38 μm) Gold Plating on Mating Area; Gold Flash on Termination
6 15 μ” (0.38 μm) Gold Plating on Mating Area; Matte Tin on Termination
Option 2
0
Option 1
0
Standard
1
Standard
Resonance Cancellation Features
ExpressPort
®
SFP+ Cage
U77
Style
A
C
E
F
1 Row
1 Row Cage; Light Pipe Combo (Top)
1 Row Cage; Heat Sink Combo (Fin)
1 Row Cage; 1° Angle (1X1 Only)
X
X
X
X
X
X
X
X
X
Packaging
1
T
Tray (ACC Re-Packed)
Tape & Reel (1X1 Only)
Number of Ports in row
1 Single in Row
2 Inline 1X2
3 Inline 1X3
4 Inline 1X4
5 Inline 1X5
6 Inline 1X6
8 Inline 1X8
Chassis Grounding
3 Metal Spring Fingers (No Bottom Latch Cover)
4 Elastomeric Gasket
6 Metal Spring Fingers (1 Piece Design Bottom Latch Cover)
7 Metal Spring Fingers with Insulating Tape
Option 1
0
Standard
Cage with Extra Bottom Spring Fingers, No
7
Bottom Mid G-Pins
8
Cage with Half-Moon Mid G-Pins
Cage with Extra Bottom Spring Fingers & Half
9
Moon Mid G-Pins
Dust Cover Option
0
Without Dust Cover
D
With Dust Cover (Shipped Loose)
Plating
1
Bright Tin (for Wave Solder)
2
Nickel
3
Matte Tin (for Reflow 245°)
PCB Mounting
X
Various Options Available - Consult Factory
Heat Sink/Light Pipe
1 No Heat Sink / Light Pipe
2 Heat Sink
3 Light Pipe (1XN Cage Only)
ExpressPort
®
SFP+ 2XN (Cage/Connector)
UE86
Style
B
D
K
L
S
2XN, No Light Pipe
2XN, Small Light Pipe Openings
2XN, Large Light Pipe Openings
2XN, Low Profile Combo (No Light Pipe)
2XN, Thermally Enhanced
X
X
X
X
X
X
X
X
X
1
Packaging
1
Tray
Plating Option: Cage
1
Bright Tin
2
Nickel
3
Matte Tin
Plating Option: Connector
X
X - Various Options Available - Consult Factory
Dust Cover
0
Without Dust Cover
D
With Dust Cover (Shipped Loose)
Light Pipe Option
0
No Light Pipe
1
4 Light Pipes/2X1
2
2 Inner Light Pipes/2X1
3
2 Outer Light Pipes/2X1
HSIOEXPRESSPORTSFP0118EA4
Number of Ports in row
1 2X1
2 Inline 2X2
3 Inline 2X3
4 Inline 2X4
5 Inline 2X5
6 Inline 2X6
8 Inline 2X8
Chassis Grounding
4 Elastomeric Gasket
5 Elastomeric Gasket, Bottom Insulating Tape
6 Metal Spring Fingers
7 EMI Fingers, Bottom Insulating Tape
Mounting Type: Connector
2 Standard Press-Fit Pins (12Gbps)
5 Small Press-Fit Pins for High Speed Termination (16Gbps)
A Press-Fit Pins (10Gbps)
Mounting Type: Cage
7 Standard 2XN
A Narrow Flange
C Enhanced EMI
www.amphenol-icc.com
Disclaimer
Please note that the above information is subject to change without notice.
Embedded System
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