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CYUSB3302-BVXAT

Description
USB interface integrated circuit
Categorysemiconductor    The interface of IC    USB interface integrated circuit   
File Size1013KB,44 Pages
ManufacturerCypress Semiconductor
Environmental Compliance
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CYUSB3302-BVXAT Overview

USB interface integrated circuit

CYUSB3302-BVXAT Parametric

Parameter NameAttribute value
MakerCypress Semiconductor
Product CategoryUSB interface integrated circuit
Installation styleSMD/SMT
Package/boxBGA-100
seriesCYUSB3302
productHub Controllers
typeUSB
standardUSB 3.0
speedSuper Speed
data rate5 Gb/s
Minimum operating temperature- 40 C
Maximum operating temperature+ 125 C
EncapsulationReel
Interface TypeSerial
Number of ports2 Port
coreARM Cortex M0
Working power voltage1.2 V
Factory packaging quantity2000
CYUSB330x/CYUSB331x
CYUSB332x/CYUSB230x
HX3 USB 3.0 Hub
HX3 USB 3.0 Hub
General Description
HX3 is a family of USB 3.0 hub controllers compliant with the USB 3.0 specification revision 1.0. HX3 supports SuperSpeed (SS),
Hi-Speed (HS), Full-Speed (FS), and Low-Speed (LS) on all the ports. It has integrated termination, pull-up, and pull-down resistors,
and supports configuration options through pin-straps to reduce the overall BOM of the system.
HX3 includes the following Cypress-proprietary features:
Shared Link™:
Enables extra downstream (DS) ports for on-board connections in embedded applications
Ghost Charge™:
Enables charging of devices connected to the DS ports when no host is connected on the upstream (US) port
HX3 USB 3.0 Hub
Features
USB-IF Certified Hub, TID# 330000060, 30000074
Supports up to Four USB 3.0-Compliant DS ports
All ports support SS (5 Gbps), and are backward-compatible
with HS (480 Mbps), FS (12 Mbps), and LS (1.5 Mbps)
SS and USB 2.0 Link Power Management (LPM)
Dedicated Hi-Speed Transaction Translators (Multi-TT)
LED status indicators – suspend, SS, and USB 2.0 operation
Shared Link™ for Embedded Applications
Each DS port can simultaneously connect to an embedded
SS device and a removable USB 2.0 device
Enables up to eight device connections
Enhanced Battery Charging
Each DS port complies with the USB Battery Charging v1.2
(BC v1.2) specification
Ghost Charge™: Each DS port can emulate a Dedicated
Charging Port (DCP) when the host is not connected to the
US port
Accessory Charger Adapter Dock (ACA-Dock): Enables
charging and simultaneous data transfer for a smart phone
or a tablet acting as a host compliant to BC v1.2
Apple charging supported on all DS ports
Integrated ARM
®
Cortex™-M0 CPU
16 KB RAM, 32 KB ROM
Configure GPIOs for overcurrent protection, power enable,
and LEDs
2
Upgrade firmware using (a) I C EEPROM or (b) an external
2
I C master
Vendor-Command Support to Implement a USB-to-I
2
C Bridge
Firmware upgrade of an external ASSP connected to HX3
through USB
In-System Programming (ISP) of the EEPROM connected to
HX3 through USB
Extensive Configuration Support
Pin-strap configuration for the following functions:
• Vendor ID (VID)
• Charging support for each DS port
• Number of active ports
• Number of non-removable devices
• Ganged or individual power switch enables for DS ports
• Power switch polarity selection
2
Custom configuration modes supported with eFuse, I C
2
C slave
EEPROM, or I
• SS and USB 2.0 PHY parameters
• Product ID (PID)/VID, manufacturer, and product string
descriptors
• Swap DP/DM signals for flexible PCB routing
Software Features
Microsoft WHQL-certified for Windows XP/Vista/7/8/8.1
Compatible with Mac OS 10.9 and Linux kernel version 3.11
Customize configuration parameters with the easy-to-use
Cypress’s “Blaster Plus” software tool
Flexible Packaging Options
68-pin QFN (8 × 8 × 1.0 mm)
88-pin QFN (10 × 10 × 1.0 mm)
100-ball BGA (6 × 6 × 1.0 mm)
Industrial temperature range (–40 °C to +85 °C)
Cypress Semiconductor Corporation
Document Number: 001-73643 Rev. *R
198 Champion Court
San Jose
,
CA 95134-1709
• +1-408-943-2600
Revised January 25, 2018

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