Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (θ
JA
)...........41°C/W
Junction-to-Case Thermal Resistance (θ
JC
)..................9°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
)........38.3°C/W
Junction-to-Case Thermal Resistance (θ
JC
)..................3°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V
SUP
= +14V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C, unless otherwise noted.)
PARAMETER
Supply Voltage Range
SYMBOL
V
SUP
(Note 2)
t < 1s
EN = low
Supply Current
I
SUP
EN = high, no load
3.3V and 5V output
1.8V output
40
2.8
4
25
65
1
3
0.4
5
10
3.2
CONDITIONS
MIN
3.5
TYP
MAX
28
42
8
35
90
mA
V
V
mA
µA
UNITS
V
EN = high, continuous, no switching
UV Lockout
Bias Voltage
Bias Current Limit
V
UVLO
V
BIAS
I
BIAS
Bias rising
+5.5V ≤ V
SUP
≤ +42V
V
UVLO,HYS
Hysteresis
www.maximintegrated.com
Maxim Integrated
│
3
MAX16903
2.1MHz, High-Voltage,
1A Mini-Buck Converter
Electrical Characteristics (continued)
(V
SUP
= +14V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C, unless otherwise noted.)
BUCK CONVERTER
V
OUT,5V
V
OUT,3.3V
V
OUT,1.8V
Voltage Accuracy
V
OUT,5V
V
OUT,3.3V
V
OUT,1.8V
Skip-Mode Peak Current
High-Side DMOS RDS
ON
Low-Side DMOS RDS
ON
DMOS Peak Current-Limit
Threshold
Soft-Start Ramp Time
LX Rise Time
Minimum On-Time
PWM Switching Frequency
SYNC Input Frequency
Range
Spread-Spectrum Range
I
SKIP
R
ON,HS
R
ON,LS
I
MAX
t
SS
t
RISE,LX
t
ON
f
SW
f
SYNC
SS
Spread-spectrum option only
Internally generated
1.925
1.8
+6
1.275
7
V
BIAS
= 5V
V
OUT
= 5V, fixed frequency
V
OUT
= 5V, SKIP mode (Note 3)
6V ≤ V
SUP
≤ 18V,
V
OUT
= 3.3V, fixed frequency
I
LOAD
= 0 to 1A,
V
OUT
= 3.3V, SKIP mode (Note 3)
T
A
= 0°C to
+125°C
V
OUT
= 1.8V, fixed frequency
V
OUT
= 1.8V, SKIP mode (Note 3)
V
OUT
= 5V, fixed frequency
V
OUT
= 5V, SKIP mode (Note 3)
6V ≤ V
SUP
≤ 18V,
V
OUT
= 3.3V, fixed frequency
I
LOAD
= 0 to 1A,
V
OUT
= 3.3V, SKIP mode (Note 3)
T
A
= -40°C to
+125°C
V
OUT
= 1.8V, fixed frequency
V
OUT
= 1.8V, SKIP mode (Note 3)
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-3.0%
-3.0%
-3.0%
-3.0%
-3.0%
-3.0%
5
5
3.3
3.3
1.8
1.8
5
5
3.3
3.3
1.8
1.8
350
400
250
1.5
8
5
80
2.1
2.275
2.6
800
450
1.75
9
+2.5%
+4%
+2.5%
+4%
+2.5%
+4.0%
+2.5%
+4%
+2.5%
+4%
+2.5%
+4%
mA
mΩ
mΩ
A
ms
ns
ns
MHz
MHz
%
V
www.maximintegrated.com
Maxim Integrated
│
4
MAX16903
2.1MHz, High-Voltage,
1A Mini-Buck Converter
Electrical Characteristics (continued)
(V
SUP
= +14V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C, unless otherwise noted.)
PARAMETER
PGOOD
PGOOD Threshold
PGOOD Debounce
PGOOD HIGH Leakage
Current
PGOOD Output Low Level
LOGIC LEVELS
EN Level
EN Input Current
SYNC Switching Threshold
SYNC Internal Pulldown
THERMAL PROTECTION
Thermal Shutdown
Thermal Shutdown
Hysteresis
T
SHDN
T
SHDN,HYS
175
15
°C
°C
V
IH,EN
V
IL,EN
I
IN,EN
V
IH,SYNC
V
IL,SYNC
R
PD,SYNC
200
V
EN
= V
SUP
= +42V, T
A
= +25°C
1.4
0.4
2.4
0.6
1
V
µA
V
kΩ
V
THR,PGD
V
THF,PGD
t
DEB
I
LEAK,PGD
V
OUT,PGD
T
A
= +25°C, V
PGD
≤ V
OUT
Sinking 1mA
V
OUT
rising
V
OUT
falling
88
88
93
91
10
1
0.4
98
94
%
µs
µA
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Note 2:
When the typical minimum on-time of 80ns is violated, the device skips pulses.
I burned the system image and used the busybox file system. But when I tried to mount the USB drive, an error occurred.There is nothing behind sda.
How to fix this? Thank you!...
My GPS has single point drift and linear drift. Does anyone have a good algorithm? [[i] This post was last edited by daicheng on 2010-7-7 12:18 [/i]]...
I want to use a transistor switch circuit to control the on and off of the sensor to reduce power consumption, but the current cannot be amplified. Please recommend a circuit...
The STM32 documentation says that the devices on the APB1 bus can reach up to 36MHz, but when I simulated it, it showed 72MHz. I didn't find any problems with the oscilloscope. Is there something wron...
The rapid development of the Internet has realized high-speed information transmission and resource sharing, greatly facilitating people's lives. Embedded systems are widely used in various electr...[Details]
This program is written to simulate the serial port hardware mechanism. When used, a timed interrupt can be set with a time interval of 1/4 baud rate. The receiving function is called once for ea...[Details]
In
circuit design,
current
measurement
is widely used, and the main fields are divided into three categories: in measurement,
the electric meter
is used to measure the curre...[Details]
1. Introduction
Since the 1980s, with the continuous development of automotive electronic technology, there are more and more electronic control units in automobiles, such as electronic fuel i...[Details]
introduction
Solar cells and LED lighting are typical applications of new energy and energy-saving and efficient technologies. Solar LED lighting uses solar cells to convert solar energy...[Details]
DSP (digital signal processor) is used more and more frequently in today's engineering applications. There are three main reasons for this: first, it has powerful computing power and is capable of ...[Details]
Product series: PB-B-RS232/485 interface (hereinafter sometimes referred to as "interface") is a product in the PROFIBUS bus bridge series.
The main purpose of the bridge series ...[Details]
LED lamps and bulbs are now rapidly replacing incandescent, halogen and CFL (compact fluorescent lamp) light sources in many general lighting applications. Flyback DC/DC converters are the power su...[Details]
This article will introduce a design method for a distributed control system used in a tracking car, which can perform distributed control of motor modules, sensor modules, and lighting control mod...[Details]
At present, how various communication technologies will evolve after 3G is a focus of great concern in the industry. Especially for TD-SCDMA, whether it can achieve smooth evolution to the next gen...[Details]
0 Introduction
There are many types of sensors, and the working principles, measurement targets and measurement environments of different types of sensors vary greatly. The corresponding detection s...[Details]
1 Development of LED Film and Television Lighting
1.1 The significance of developing film and television lighting
Lighting power consumption accounts for a large proportion of the total p...[Details]
The demand for improved healthcare environments is endless, so medical imaging equipment with higher resolution is needed to better observe the human body. High resolution brings problems with sign...[Details]
Battery clamps, commonly known as battery connectors, come in two sizes depending on the thickness of the battery terminals. One is the battery clamp used on thick terminals, with a positive termin...[Details]
The production process of lithium batteries does not mention the previous processes such as material preparation, winding, liquid injection, and packaging, but only talks about the final formation ...[Details]
Linux and Android
京公网安备 11010802033920号
EEWORLD
