PL
IA
NT
SinglFuse
™
SF-1206SP Series Features
n
Time lag thin film chip fuse for overcurrent
protection
n
3216 (EIA 1206) miniature footprint
n
Surface mount packaging for automated
assembly
n
UL listed (UL 248-14)
n
RoHS compliant* and halogen free**
*R
oH
S
C
OM
LE
AD
F
RE
E
SF-1206SP Series - Time Lag Surface Mount Fuses
Resistance
(mΩ) Typ.***
738.5
215
163.5
100
68.5
48.5
35
27
14
11
Typical
I
2
t (A
2
s) ****
0.027
0.072
0.134
0.233
0.305
0.509
0.777
1.285
2.374
5.510
Electrical Characteristics
Model
SF-1206SP050
SF-1206SP080
SF-1206SP100
SF-1206SP125
SF-1206SP150
SF-1206SP200
SF-1206SP250
SF-1206SP300
SF-1206SP400
SF-1206SP500
Rated Current
(Amps)
0.50
0.80
1.00
1.25
1.50
2.00
2.50
3.00
4.00
5.00
7.00
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Fusing Time
Rated Voltage
Breaking Capacity
DC 63 V
Open within
1~120 sec.
at 200 %
rated current
DC 63 V
50 A
DC 32 V
DC 32 V
50 A
SF-1206SP700
7.5
10.170
*** Resistance value measured with less than 10 % of rated current. Resistance tolerance ±25 %.
****Typical I
2
t value measured at 10x rated current.
Reliability Testing
Parameter
Requirement
Test Method
Carrying Capacity ..................................... No fusing ....................................................Rated current, 4 hours
Fusing Time .............................................. Within 120 seconds....................................200 % of its rated current
Interrupting Ability ..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test ............................................. No mechanical damages ...........................Distance between holding points: 90 mm,
Bending: 3 mm, 1 time, 30 seconds
Resistance to Solder Heat ........................ ±20 % .........................................................260 °C ±5 °C,10 seconds ±1 second
Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second
245 °C ±5 °C, 2 ±0.5 second (lead free)
Temperature Rise ..................................... <75 °C ........................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat............................. ±20 % .........................................................105 °C ±5 °C,1000 hours
Resistance to Solvent ............................... No evident damage on protective ..............23 °C ±5 °C of isopropyl alcohol, 90 seconds
coating and marking
Residual Resistance ................................. 10k ohms or more ......................................Measure DC resistance after fusing
Thermal Shock .........................................
DR
< 10 % ..................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles
UL File Number .........................................E198545
http://www.ul.com/ Follow link to Online Certificates Directory, then enter UL File No. E198545,
or
click here
Environmental Characteristics
Operating Temperature..................................................................................-20 °C to +105 °C
Storage Conditions
Temperature ................................................................................................+5 °C to +35 °C
Humidity...........................................................................................................40 % to 75 %
Shelf Life........................................................................... 2 years from manufacturing date
Moisture Sensitivity Level ........................................................................................................ 1
ESD Classification (HBM)..............................................................................................
Class 6
* RoHS Directive 2015/863, Mar 31, 2015 and Annex.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the
Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Asia-Pacific:
Tel: +886-2 2562-4117
Email: asiacus@bourns.com
Europe:
Tel: +36 88 520 390
Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500
Email: americus@bourns.com
www.bourns.com
SinglFuse
™
SF-1206SP Series Applications
n
Portable memory
n
LCD monitors
n
Disk drives
n
PDAs
n
Digital cameras
n
DVDs
n
Cell phones
n
Rechargeable battery packs
n
Battery chargers
n
Set top boxes
n
Industrial controllers
SF-1206SP Series - Time Lag Surface Mount Fuses
Typical Part Marking
Represents total content. Layout may
vary.
How to Order
SF - 1206 SP 050 - 2
SinglFuse™ Product Designator
SMD Footprint
3216 (EIA 1206) size
RATED CURRENT (A)
T = 2.50
F = 0.50
3 = 3.00
K = 0.80
W = 4.00
L = 1.00
Y = 5.00
M = 1.25
Z = 7.00
P = 1.50
S = 2.00
Fuse Blow Type
SP = Time Lag
Rated Current
050-700 (500 mA - 7.00 A)
Packaging Type
- 2 = Tape & Reel (5,000 pcs./reel)
Solder Reflow Recommendations
250
Construction & Material Content
OVERCOAT
Peak: 250 +0/-5 °C
230 °C or higher
Sn PLATING
TEMPERATURE (°C)
200
180 °C
150
150 °C
PRE-HEATING ZONE
FUSE ELEMENT
CERAMIC SUBSTRATE
Cu / Ni PLATING
90 ± 30 Seconds
100
30 ± 10 Seconds
SOLDERING ZONE
50
HEATING TIME
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
3.1 ± 0.1
(.122 ± .004)
1.27
(.050)
1.55 ± 0.1
(.061 ± .004)
2.03
(.080)
Product Dimensions
3.1 ± 0.1
(.122 ± .004)
0.5 ± 0.3
(.020 ± .012)
3.1 ± 0.1
(.122 ± .004)
0.5 ± 0.3
(.020 ± .012)
1.27
(.050)
Recommended Pad Layout
2.2 ± 0.2
(.087 ± .008)
3.81
(.150)
0.6 ± 0.1
(.024 ± .004)
2.03
(.080)
1.55 ± 0.1
(.061 ± .004)
0.5 ± 0.2
(.020 ± .008)
0.5 ± 0.3
(.020 ± .012)
0.5 ± 0.3
(.020 ± .012)
0.5 ± 0.3
(.020 ± .012)
0.5 ± 0.3
(.020 ± .012)
DIMENSIONS:
1.55 ± 0.1
(.061 ± .004)
0.5 ± 0.2
(.020 ± .008)
1.65 ± 0.15
(.065 ± .006)
0.6
PACKAGING: 5,000 pcs./reel
± 0.1
MM
(INCHES)
3.81
(.150)
4.7 ± 0.3
(.185 ± .012)
(.024 ± .004)
0.6 ± 0.1
(.024 ± .004)
0.5 ± 0.2
(.020 ± .008)
0.5 ± 0.2
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
0.5 ± 0.2
0.5 ± 0.2
(.020 ± .008)
Users should verify actual device performance in their specific applications.
(.020 ± .008)
(.020 ± .008)
Specifications are subject to change without notice.
DSP and ARM Processors
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