EEWORLDEEWORLDEEWORLD

Part Number

Search

XD16AWT-H0-0000-00000HGE3

Description
High Power LED - White, 130lm
CategoryLED optoelectronic/LED    LED lighting    The LED emitter    High power LED - white   
File Size2MB,30 Pages
ManufacturerCree
Websitehttp://www.cree.com/
Environmental Compliance
Download Datasheet Parametric View All

XD16AWT-H0-0000-00000HGE3 Online Shopping

Suppliers Part Number Price MOQ In stock  
XD16AWT-H0-0000-00000HGE3 - - View Buy Now

XD16AWT-H0-0000-00000HGE3 Overview

High Power LED - White, 130lm

XD16AWT-H0-0000-00000HGE3 Parametric

Parameter NameAttribute value
MakerCree
Product CategoryHigh Power LED - White
productWhite LEDs
Installation styleSMD/SMT
Package/boxSMD-2
lighting colorWhite (Cool White)
Wavelength/Color Temperature5000 K
brightness-
Luminous flux/radiant flux130 lm
Color Rendering Index - CRI80
display angle135 deg
Lens color/typeTinted
If - forward current350 mA
Vf - forward voltage2.73 V
length1.6 mm
width1.6 mm
high0.78 mm
Minimum operating temperature-
Maximum operating temperature-
seriesXD16
EncapsulationReel
Factory packaging quantity3000
CLD-DS177 Rev 0C
Product family data sheet
Cree
®
XLamp
®
XD16 LEDs
ProDuCt DEsCriPtion
The XLamp
®
XD16 LeDs are the industry’s
first Extreme Density LEDs, delivering up
to 5½ times higher lumen density than
Cree’s previous generation of high‑power
LeDs. The ceramic-based XD16 LeD
is
built
on
Cree’s
groundbreaking
NX Technology Platform to address
challenges with luminaire manufacturing,
thermal design, optical design and
reliability that have been experienced
with competing LEDs. The XD16 LED
enables
achieve
lighting
dramatic
manufacturers
improvements
to
in
FEAturEs
Available in outdoor white and 70‑, 80‑
and 90‑CRI white
ANSI‑compatible chromaticity bins
3-step and 5-step options
Binned at 85 °C
Maximum drive current: 2000 mA
Low thermal resistance: 6 °C/W
Wide viewing angle: 135°
Unlimited floor life at ≤ 30 ºC/85% RH
Reflow solderable ‑ JEDEC J‑STD‑020C
RoHS and REACh compliant
UL
®
recognized component (E349212)
tAbLE oF ContEnts
Characteristics ............................................2
Flux Characteristics
....................................3
Relative Spectral Power Distribution
......
12
Relative Flux vs. Junction Temperature
..
12
Electrical Characteristics
......................... 13
Relative Flux vs. Current
.......................... 13
Relative Chromaticity vs. Current and
Temperature .............................................
14
Typical Spatial Distribution
...................... 15
Thermal Design
........................................ 15
Performance Groups ‑ Luminous Flux
.... 16
Performance Groups ‑ Chromaticity
....... 16
Cree’s Cool White Kits Plotted on ANSI
Standard Chromaticity Regions
.............. 19
Cree’s Warm and Neutral White Kits
Plotted on ANSI Standard Chromaticity
Regions
.....................................................
20
Cree’s EasyWhite
®
White Kits Plotted on
ANSI Standard Chromaticity Regions
.....
21
Cree’s Standard Chromaticity Kits
..........
22
Bin and Order Code Formats ...................
23
Reflow Soldering Characteristics
............
24
Notes ........................................................
25
Mechanical Dimensions
..........................
27
Tape and Reel
...........................................
28
Packaging
.................................................
29
lumen output and efficacy, without
increasing the size of the LED array, for
a wide spectrum of lighting applications
such as color tuning, directional lighting
and industrial lighting.
WWW.CREE.Com/XLAmp
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo,
XLamp
®
and EasyWhite
®
are registered trademarks of Cree, Inc. UL
®
and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
I'm out in the sun
:Q Come and criticize...
毛承玲 PCB Design
Debugging access to DSP memory using OCSUnk embedded object
By using MATLAB's object-oriented programming technology and CCSLink technology, you can create embedded objects for all C symbols in the target program and operate the C symbols through the objects. ...
fish001 DSP and ARM Processors
[Silicon Labs BG22-EK4108A Bluetooth Development Evaluation] 1. Development Board Unboxing and Environment Setup
[i=s]This post was last edited by lang518899 on 2022-1-10 20:51[/i]1. After receiving the Silicon Labs BG22-EK4108A, I unpacked it and found that in addition to a development board, it also provided a...
lang518899 Development Kits Review Area
Introduction to sensor basics
[b]The role of sensors[/b] The role of sensors is very powerful. They can replace human sensory organs to complete the sensory tasks of human sensory organs, but their capabilities far exceed those of...
allchips Sensor
IPTV Testing Based on DSL
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 20:02[/i] Internet Protocol Television (IPTV) over DSL is an emerging and exciting technology that can provide service providers with new ...
hutgh Mobile and portable
A simple calculator based on 51 single chip microcomputer. Please help me check the error. Please help me.
A simple calculator based on 51 single chip microcomputer. Please help me check the error. Please help me....
wuxiang__ 51mcu

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 28  1175  1689  347  2507  1  24  35  7  51 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号