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QTH-150-09-L-D-A-K

Description
Board-to-Board and Mezzanine Connectors 0.50 mm Q Strip High-Speed ​​Ground Plane Terminal Strip
CategoryThe connector    The connector   
File Size1000KB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
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QTH-150-09-L-D-A-K Overview

Board-to-Board and Mezzanine Connectors 0.50 mm Q Strip High-Speed ​​Ground Plane Terminal Strip

QTH-150-09-L-D-A-K Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSAMTEC
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time2 weeks
Board mount optionsPEG
body width0.235 inch
subject depth0.522 inch
body length3.937 inch
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationGOLD
Contact completed and terminatedMatte Tin (Sn)
Contact point genderMALE
Contact materialPHOSPHOR BRONZE
contact modeRECTANGULAR
Contact styleCENTRONIC
DIN complianceNO
Filter functionNO
IEC complianceNO
Insulator colorBLACK
JESD-609 codee3
MIL complianceNO
Plug contact pitch0.02 inch
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number2
Number of rows loaded2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
PCB contact patternRECTANGULAR
PCB contact row spacing6.1722 mm
Rated current (signal)2 A
reliabilityCOMMERCIAL
Terminal pitch0.5 mm
Termination typeSURFACE MOUNT
Total number of contacts300
UL Flammability Code94V-0
F-219
QTH–090–01–C–D–A
®
(0.50 mm) .0197"
QTH–060–07–F–D–A
QTH–030–01–L–D–A
QTH SERIES
HIGH-SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(2 pins powered)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
175 VAC (5 mm Stack Height)
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSH
Cable Mates:
HQCD, HQDP
(See Also Available Note)
Standoffs:
SO
10 YEAR MFG
WITH 50 µ" GOLD
Integral metal plane for
power or ground
Standard Stack Heights
from 5 mm to 25 mm
POWER/SIGNAL
APPLICATION
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
HIGH-SPEED CHANNEL PERFORMANCE
QTH/QSH @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (030-060)
(0.15 mm) .006" max (090)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
25
G b p s
Compatible with
UMPT/UMPS for
flexible two-piece
power/signal solutions
QTH
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
TYPE
A
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
(60 total pins per bank = –D)
–030, –060, –090
–020, –040, –060
(20 pairs per bank = –D–DP)
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–F
= Single-Ended
–D
–L
= Differential Pair
(–01 only)
–D–DP
= (7.00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
(N/A with -05 &
-07 lead style)
–K
–D = (No. of Pins per Row/30) x (20.00) .7875
–DP = (No. of Pairs per Row/20) x (20.00) .7875
(20.00) .7875
01
STANDARDS
• PISMO
1
Visit www.samtec.com/standards
for more information.
(7.11)
.280
02
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80 (-DP), 120, 150
positions per row
• Retention Option
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(0.50)
.0197
(0.20)
.008
A
–01 & –02
–03 thru –09
= Electro-Polished
Selective
50 µ" (1.27 µm) min
Au over 150 µ" (3.81 µm)
Ni on Signal Pins in
contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
A
Ni on Ground Plane
in contact area,
Matte Tin over
50 µ" (1.27 µm) min
Ni on all solder tails
*Note:
–C Plating passes
10 year MFG testing
–C*
= Tape & Reel
(–090 positions
maximum)
–TR
–L
QTH
LEAD
STYLE
A
(4.27)
.168
(7.26)
.286
(10.27)
.404
(15.25)
.600
(18.26)
.718
(24.24)
.954
(13.26)
.522
HEIGHT
WITH
QSH*
(5.00)
.197
(8.00)
.315
(11.00)
.433
(16.00)
.630
(19.00)
.748
(25.00)
.984
(14.00)
.551
–01
–02
–03
–04
–05
–07
–09
= Latching
Option
(–01 lead
style only)
(N/A on
–060 (–D–DP)
& –090)
(0.76)
.030
(0.89)
.035
DIA
(0.64)
.025
–L
*Processing conditions
will affect mated height.
See SO Series for
board space tolerances
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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