ZA1-20-1-1.00-Z-10-2 datasheet, PDF

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ZA1-20-1-1.00-Z-10-2: DescriptionBoard-to-Board and Mezzanine Connectors 1.00 mm Ultra Low Profile Micro Array; CategoryThe connector The connector; File Size2MB，2 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/; Environmental Compliance

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ZA1-20-1-1.00-Z-10-2 Overview

Board-to-Board and Mezzanine Connectors 1.00 mm Ultra Low Profile Micro Array

ZA1-20-1-1.00-Z-10-2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMTEC
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	3 weeks
Samacsys Description	1.00 mm Ultra-Low Profile Compression Interposer
body width	0.433 inch
subject depth	0.044 inch
body length	0.957 inch
Connector type	BOARD STACKING CONNECTOR
Contact to complete cooperation	GOLD OVER NICKEL
Contact completed and terminated	Tin/Silver/Copper (Sn/Ag/Cu)
Contact point gender	MALE
Contact material	BERYLLIUM COPPER
contact mode	RECTANGULAR
DIN compliance	NO
Filter function	NO
IEC compliance	NO
JESD-609 code	e1
MIL compliance	NO
Plug contact pitch	0.039 inch
Match contact row spacing	0.039 inch
Mixed contacts	NO
Installation option 1	LOCKING
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	10
Number of rows loaded	10
Options	GENERAL PURPOSE
PCB contact pattern	RECTANGULAR
PCB contact row spacing	1 mm
Terminal pitch	1 mm
Termination type	SURFACE MOUNT
Total number of contacts	200

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F-219

ZA1–30–2–1.00–Z–10

ZA1–40–2–1.00–Z–10

ZA1–10–2–1.00–Z–10

ZA1–20–1–1.00–Z–10–2

(1.00 mm) .0394"

ZA1 SERIES

ULTRA-LOW PROFILE MICRO ARRAYS

SPECIFICATIONS

For complete specifications and

recommended PCB layouts see

www.samtec.com?ZA1

Insulator Material:

FR4

Contact Material:

BeCu

Plating:

Au over 50 µ" (1.27 µm) Ni

Current Rating:

1 A per pin

(10 pins powered)

Operating Temp Range:

-55 °C to +105 °C

RoHS Compliant:

Yes

APPLICATION

25 g normal force

with (0.20 mm) .008"

contact deflection

Dual compression

or single compression

with solder balls

BeCu

contacts

Up to 1,024

contacts/

square inch

HIGH-SPEED CHANNEL PERFORMANCE

Note:

Solder ball parts will come

with a pick & place pad.

1 mm Stack Height

Rating based on Samtec reference channel.

For full SI performance data visit Samtec.com

or contact SIG@samtec.com

APPLICATION

G b p s

Solder ball

option

(1.00 mm) .040"

height

ZA1

POSITIONS

PER ROW

TERMINATION

HEIGHT

PLATING

ROWS

SOLDER

TYPE

Dual compression or single

compression with solder balls

–10, –20,

–30, –40

= Single Compression

with Solder Balls

(–10 & –20 positions only)

–1

–2

= (1.00 mm)

.040"

Height

–1.00

= 6 µ"

(0.15 µm)

Gold in

contact

area

–Z

–10

= Ten

Rows

(Termination

–1 only)

= Lead

–1

–2

DESIGN FLEXIBILITY

The Z-Ray

platform is

highly-customizable:

PITCH

STACK HEIGHT

DENSITY

RUGGEDIZING

CONSTRUCTION

≥

0.65 mm

0.50 mm to

4.00 mm

Up to 1,024

contacts/square inch

Latches, Thermal

Spreaders,

Quick-release

Spring Constraints

Multi-layer FR4

(e.g., Pitch Spreaders)

(1.07)

.042

DIA

= Dual Compression

(–10, –20, –30

& –40 positions only)

(5.00)

.197

(1.00)

.0394

(1.25)

.049

DIA

(11.00)

.433

= Lead-Free

(1.00)

.039

(2.00) .079 DIA

40 X 10 DUAL COMPRESSION

(0.20) .008 TYP

BOTH SIDES

(11.00)

.433

20 x 10 DUAL COMPRESSION

(1.09)

.043

POSITIONS

PER ROW

–10

–20

–30

(14.30)

.563

(24.30)

.957

(38.30)

1.508

(48.30)

1.902

(11.40)

.449

(21.40)

.843

N/A

(1.00)

.0394

Note:

Some lengths, styles and

options are non-standard,

non-returnable.

20 X 10 COMPRESSION

WITH SOLDER BALLS

10 x 10 COMPRESSION

WITH SOLDER BALLS

–40

Due to technical progress, all designs, specifications and components are subject to change without notice.

All parts within this catalog are built to Samtec’s specifications.

Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.

WWW.SAMTEC.COM

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