Reference Only
Reference
Spec.No.
:
JENF243A-0086C-01
P1/7
Noise Filter BLF02JD□□□GN□□
1.Scope
Reference Specification
This Reference specification applies to
Noise Filter
BLF02JD_GN Series.
2.Part Numbering
(Ex)
BL
(1)
F
(2)
02
(3)
JD
(4)
361
(5)
G
(6)
N
(7)
E
(8)
D
(9)
(1)Product ID
(7)Category
(2)Type
(8)Rated Current No
(3)Dimension (L×W)
(9)Packaging
(4)Characteristics
D: 8mm-wide paper taping
(5)Typical Impedance at 700MHz
B:Bulk
(6)Performance
*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3．Rating
Customer
Part Number
MURATA
Part Number
Impedance ()
(at 700MHz,
Under Standard
Testing Condition)
DC Resistance
( max.)
Values
Initial
at 125°C
at 85°C
After
Values
Testing
380
250
0.45
0.55
330
220
0.60
0.70
■Storage
Temperature : -55°C to +125°C
*1Rated Current
(mA)
360±40
%
BLF02JD361GNED
470±40%
BLF02JD471GNED
■Operating
Temperature : -55°C to +125°C
(Note) As for the Rated current marked with
*
1
,
Rated Current is derated as
right figure
depending on the operating temperature.
4.Style and Dimensions
■
Equivalent Circuit
(
Resistance element becomes
dominant at high frequencies.
)
■
Unit
Mass
(Typical value)
0.125mg
5.Marking
No marking.
6.Standard Testing Conditions
Unless otherwise specified
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
In case of doubt
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
MURATA MFG.CO.,LTD.
Reference Only
Reference
Spec.No.
:
JENF243A-0086C-01
P2/7
7.Specifications
7-1.Electrical Performance
No.
Item
7-1-1 Impedance
Specification
Meet item 3.
Test Method
Measuring Frequency : 700MHz
Measuring Equipment : KEYSIGHT 4991A , 4991B
or the equivalent
Test Fixture : KEYSIGHT 16192A /16197Aor their equivalents
Measuring Equipment : Digital multi meter
* Except resistance of the Substrate and Wire
7-1-2 DC Resistance
7-2.Mechanical Performance
No.
Item
7-2-1 Bonding
Strength
Specification
Products shall not be damaged
after tested as test method.
Test Method
It shall be soldered on the substrate.
Applying Force :
1N
Applying Time : 5s
It shall be soldered on the Glass-epoxy substrate.
Substrate : 100mm40mm0.8mm
Deflection : 2mm
Speed of Applying Force : 1.0mm/s
Keeping Time : 20s
Pressure jig
R230
7-2-2 Bending
Strenght
F
Deflection
45
45
Product
7-2-3 Vibration
Appearance: No damage
7-2-4 Solderability
The electrodes shall be at
least 95% covered with new
solder coating.
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 2000Hz to 10Hz for 20min
Total amplitude 3.0mm or Acceleration
amplitude 196 m / s
2
whichever is smaller.
Testing Time : A period of 2h in each of
3 mutually perpendicular directions.(Total 6h)
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C, 60s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245°C±3°C
Immersion Time : 3s
7-3.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
7-3-1 Heat Life
Meet Table 1.
Table 1
Appearance
Impedance
Change
(at 700MHz)
DC
Resistance
No damage
Within ±30%
Meet item 3.
Test Method
Temperature : 125°C±2°C
Applying Current : Rated Current
(at 125°C)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room
condition for 4 to 48 h.
Temperature : -55°C±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room
condition for 4 to 48 h.
Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room
condition for 4 to 48 h.
1 cycle :
1 step : -55
°C(+0 °C,-3 °C)
/30min(+3min,-0min)
2 step : Ordinary temp. / 3 min max.
3 step : +125
°C(+3 °C,-0 °C)
/ 30min(+3min,-0min)
4 step : Ordinary temp. / 3 min max.
Total of 100 cycles
Then measured after exposure in the room
condition for 4 to 48 h.
7-3-2 Cold
Resistance
7-3-3 Humidity
7-3-4 Temperature
Cycle
MURATA MFG.CO.,LTD.
Reference Only
Reference
Spec.No.
:
JENF243A-0086C-01
P3/7
8.Specification of Packaging
8-1.Appearance and Dimensions
(8mm-wide
/
paper
tape)
(1) Taping
Products shall be packaged in the each embossed cavity of 8mm-wide,
2mm-pitch
continuously
and sealed by cover tape.
(2) Sprocket hole : The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point : The cover tape has no spliced point.
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
8-2.Tape Strength
(1)Pull Strength
Cover tape
(2)Peeling off force of Cover tape
0.1N to 0.6N
(Minimum value is typical.)
*Speed of Peeling off:300mm/min
5N min
165 to 180 degree
Cover tape
F
8-3.Taping Condition
Base tape
(1)Standard quantity per reel
Quantity per 180mm reel :
15000
pcs. / reel
(2)There shall be leader-tape(cover tape only and empty tape ) and trailer- tape(empty tape) as follows.
(3)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc)
□□
OOOO
1)
« Expression of Inspection No. »
(1)
(1)
Factory Code
(2)
Date
(3)
Serial No.
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep.
1 to 9, Oct. to Dec.
O, N, D
Third, Fourth digit : Day
ROHS – Y (△)
(1) (2)
2)
« Expression of RoHS marking »
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(4)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2), Quantity, etc)
MURATA MFG.CO.,LTD.
Reference Only
Reference
Spec.No.
:
JENF243A-0086C-01
(5)Dimensions of reel and taping(leader-tape, trailer-tape)
2.0±0.5
Trailer
160 min.
Leader
P4/7
Label
190 min.
Empty tape
210 min.
Cover tape
13.0±0.2
60
-
0
+1
9.0
+1
-0
13.0±1.4
180
-3
+0
21.0±0.8
Direction of feed
(in mm)
8-4. Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
Standard Reel Quantity
(mm)
in Outer Case (Reel)
W
D
H
186
186
93
5
Above
Outer Case size is typical. It depends on a quantity of an order.
9.
！
Caution
9-1.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Disaster prevention / crime prevention equipment
(7) Traffic signal equipment
(8) Transportation equipment (vehicles, trains, ships, etc.)
(9) Data-processing equipment
(10) Applications of similar complexity and / or reliability
requirements to the applications listed in the above.
10. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
Standard
land dimensions (Reflow soldering)
Chip Ferrite Bead
a
c
b
0.48
c
0.215
( in mm)
0.18
a
b
Solder Resist
Pattern
10-2. Mounting Conditions
・Please
check the mounting condition before using.
・Using
mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products
may lead to pick up errors, misalignment, or damage to the product.
10-3.Soldering Conditions
(1) Flux,Solder
Flux
Solder
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder
(Type6)
Standard thickness of solder paste : 50
µm
to 80
m
MURATA MFG.CO.,LTD.
Reference Only
Reference
Spec.No.
:
JENF243A-0086C-01
P5/7
(2) Soldering conditions
Pre-heating
should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard
soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
30s½60s
Standard Profile
60s max.
90s±30s
Time.
(s)
Pre-heating
Heating
Peak temperature
Cycle of reflow
Atmosphere
Standard Profile
150½180°C
、90s±30s
above 220°C、30s½60s
245±3°C
2 times
N
2
Limit Profile
above 230°C、60s max.
260°C,10s
2 times
N
2
10-4.Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
t
1/3T≦t≦T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
b
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
〈
Poor example
〉
〈
Good example
〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Stress Level
A > D *1
A > B
A > C
MURATA MFG.CO.,LTD.
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