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DS1245W-100IND+

Description
NVRAM 3.3V 1024K SRAM Nonvolatile
Categorystorage    storage   
File Size209KB,11 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Environmental Compliance
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DS1245W-100IND+ Overview

NVRAM 3.3V 1024K SRAM Nonvolatile

DS1245W-100IND+ Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMaxim
Parts packaging codeMODULE
package instruction0.740 INCH, ROHS COMPLIANT, DIP-32
Contacts32
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Factory Lead Time10 weeks
Maximum access time100 ns
Other features10 YEAR DATA RETENTION
JESD-30 codeR-XDMA-P32
JESD-609 codee3
memory density1048576 bit
Memory IC TypeNON-VOLATILE SRAM MODULE
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Package body materialUNSPECIFIED
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum standby current0.00025 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
19-5640; Rev 11/10
DS1245W
3.3V 1024k Nonvolatile SRAM
www.maxim-ic.com
FEATURES
10 years minimum data retention in the
absence of external power
Data is automatically protected during power
loss
Replaces 128k x 8 volatile static RAM,
EEPROM or Flash memory
Unlimited write cycles
Low-power CMOS
Read and write access times of 100ns
Lithium energy source is electrically
disconnected to retain freshness until power is
applied for the first time
Optional industrial temperature range of
-40°C to +85°C, designated IND
JEDEC standard 32-pin DIP package
PowerCap Module (PCM) package
- Directly surface-mountable module
- Replaceable snap-on PowerCap provides
lithium backup battery
- Standardized pinout for all nonvolatile
SRAM products
- Detachment feature on PowerCap allows
easy removal using a regular screwdriver
PIN ASSIGNMENT
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
A15
NC
WE
A13
A8
A9
A11
OE
A10
CE
DQ7
DQ6
DQ5
DQ4
DQ3
32-PIN Encapsulated Package
740-Mil Extended
NC
A15
A16
NC
V
CC
WE
OE
CE
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
GND V
BAT
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
NC
NC
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
34-Pin PowerCap Module (PCM)
(Uses DS9034PC+ or DS9034PCI+ PowerCap)
PIN DESCRIPTION
A0 - A16
DQ0 - DQ7
CE
WE
OE
V
CC
GND
NC
1 of 10
- Address Inputs
- Data In/Data Out
- Chip Enable
- Write Enable
- Output Enable
- Power (+3.3V)
- Ground
- No Connect

DS1245W-100IND+ Related Products

DS1245W-100IND+ DS1245WP-150+ DS1245WP-100IND+ DS1245W-100+ DS1245WP-100+ DS1245W-150+
Description NVRAM 3.3V 1024K SRAM Nonvolatile NVRAM 3.3V 1024K SRAM Nonvolatile NVRAM 3.3V 1024K SRAM Nonvolatile NVRAM 3.3V 1024K SRAM Nonvolatile NVRAM 3.3V 1024K SRAM Nonvolatile NVRAM 3.3V 1024K SRAM Nonvolatile
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker Maxim Maxim Maxim Maxim Maxim Maxim
Parts packaging code MODULE DMA DMA MODULE DMA MODULE
package instruction 0.740 INCH, ROHS COMPLIANT, DIP-32 , MODULE,34LEAD,1.0 ROHS COMPLIANT, POWERCAP MODULE-34 DIP, DIP32,.6 , MODULE,34LEAD,1.0 DIP, DIP32,.6
Contacts 32 34 34 32 34 32
Reach Compliance Code unknown not_compliant unknown not_compliant not_compliant not_compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Factory Lead Time 10 weeks 8 weeks 8 weeks 10 weeks 6 weeks 6 weeks
Maximum access time 100 ns 150 ns 100 ns 100 ns 100 ns 150 ns
Other features 10 YEAR DATA RETENTION 10 YEAR DATA RETENTION 10 YEAR DATA RETENTION 10 YEAR DATA RETENTION 10 YEAR DATA RETENTION 10 YEAR DATA RETENTION
JESD-30 code R-XDMA-P32 R-XDMA-U34 R-XDMA-U34 R-XDMA-P32 R-XDMA-U34 R-XDMA-P32
JESD-609 code e3 e3 e3 e3 e3 e3
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 32 34 34 32 34 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 70 °C 70 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Encapsulate equivalent code DIP32,.6 MODULE,34LEAD,1.0 MODULE,34LEAD,1.0 DIP32,.6 MODULE,34LEAD,1.0 DIP32,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED 245 245 NOT SPECIFIED 245 NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.00025 A 0.00025 A 0.00025 A 0.00025 A 0.00025 A 0.00025 A
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO YES YES NO YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN
Terminal form PIN/PEG J INVERTED J INVERTED PIN/PEG J INVERTED PIN/PEG
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED 40 40 NOT SPECIFIED 40 NOT SPECIFIED
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