Ceramic Plate Series CP14,71,06
Innovative
Technology
for a
Connected
World
Thermoelectric Modules
The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered
‘the standard’ in the thermoelectric industry.
This broad product line of high-performance and highly reliable TEMs is available
in numerous heat pumping capacities, geometric shapes, and input power ranges.
Assembled with Bismuth Telluride semiconductor material and thermally conductive
Aluminum Oxide ceramics, the CP Series is designed for higher current and large
heat-pumping applications.
FeatureS
• Precise Temperature Control
• Compact Geometric Sizes
• Reliable Solid State Operation
• No Sound or Vibration
• Environmentally Friendly
• DC Operation
• RoHS Compliant
perforMance SpecificaTionS
hot Side Temperature (°c)
Qmax (Watts)
delta Tmax (°c)
imax (amps)
Vmax (Volts)
Module resistance (ohms)
Suffix ThickneSS
(prior To Tinning)
l
l1
l2
Ml
lM
MM
Suffix
rT
ep
0.150”± 0.010”
0.150”± 0.001”
0.150”± 0.0005”
0.154”± 0.010”
0.154”± 0.010”
0.158”± 0.010”
SealanT color
RTV
Epoxy
White
Black
25°C
28.7
68
6.0
8.1
1.26
flaTneSS &
paralleliSM
aPPliCationS
• Medical Lasers
• Lab Science Instrumentation
• Clinical Diagnostic Systems
• Photonics Laser Systems
• Electronic Enclosure Cooling
• Food & Beverage Cooling
• Chillers (Liquid Cooling)
50°C
31.4
75
6.0
9.2
1.42
hoT
face
Lapped
Lapped
Lapped
Metallized
Lapped
Metallized
deScripTion
Non-corrosive, silicone adhesive sealant
Low density syntactic foam epoxy encapsulant
cold
face
Lapped
Lapped
Lapped
Lapped
Metallized
Metallized
lead
length
4.5”
4.5”
4.5”
4.5”
4.5”
4.5”
0.0015” / 0.0015”
0.001” / 0.001”
0.0005” / 0.0005”
0.002” / 0.002”
0.002” / 0.002”
0.002” / 0.002”
TeMp range
-60 to 204 °C
-55 to 150 °C
Sealing oPtion
global
solutions:
local
support
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
clv.customerpos@lairdtech.com
www.lairdtech.com
TM
Ceramic Plate Series CP14,71,06
Innovative
Technology
for a
Connected
World
Thermoelectric Modules
Performance Curves at Th = 25°C
thermo
6.0
4.8
3.6
2.4
1.2
eleCtriC
30.0
27.0
24.0
21.0
8.0
6.0
4.0
2.0
0.0
80
70
60
50
40
30
20
10
0
15.0
12.0
9.0
6.0
3.0
0.0
80
70
60
50
40
30
20
10
0
Qc (W)
18.0
Delta T (°C)
Delta T (°C)
1.17
[29.7]
(+) RED
1.17
[29.7]
(-) BLACK
AWG 18 PVC
(SEE TABLE)
COLD FACE
(SEE OPTIONS)
HEAT SHRINK TUBING
(2 PLACES)
THICKNESS
(SEE OPTIONS)
HOT FACE
(SEE OPTIONS)
oPerating tiPS
• Max Operating Temperature: 80°C
• Do not exceed Imax or Vmax when
operating module
• Reference assembly guidelines for
recommended installation
• Solder tinning also available on
metallized ceramics
CP14,71,06 0309
Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials
rests with the end user since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability,
or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages
of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies terms and conditions of sale in effect from time to time, a copy of which will be furnished
upon request. For further information please visit our website at www.lairdtech.com Alternatively contact: sales@lairdtech.com. Bluetooth
®
is a trademark owned by Bluetooth SIG,
Inc., USA and licensed to Laird Technologies.
® 2008 All Rights Reserved. Laird Technologies is a registered trademark of Laird Technologies, Inc.
Voltage (V)
Microcontroller MCU
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