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W9751G6KB-25 TR

Description
Dynamic random access memory 512M DDR2-800, x16 T&R
Categorysemiconductor    Memory IC    Dynamic random access memory   
File Size2MB,88 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Environmental Compliance
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W9751G6KB-25 TR Overview

Dynamic random access memory 512M DDR2-800, x16 T&R

W9751G6KB-25 TR Parametric

Parameter NameAttribute value
MakerWinbond Electronics Corporation
Product Categorydynamic random access memory
typeSDRAM - DDR2
Data bus width16 bit
organize32 M x 16
Package/boxWBGA-84
storage512 Mbit
Supply voltage - max.1.9 V
Supply voltage - min.1.7 V
Supply current—max.100 mA
Minimum operating temperature0 C
Maximum operating temperature+ 85 C
seriesW9751G6KB
EncapsulationCut Tape
EncapsulationReel
Installation styleSMD/SMT
Factory packaging quantity2500
W9751G6KB
8M
4 BANKS
16 BIT DDR2 SDRAM
Table of Contents-
1.
2.
3.
4.
5.
6.
7.
8.
8.1
8.2
GENERAL DESCRIPTION ................................................................................................................... 4
FEATURES ........................................................................................................................................... 4
ORDER INFORMATION ....................................................................................................................... 5
KEY PARAMETERS ............................................................................................................................. 5
BALL CONFIGURATION ...................................................................................................................... 6
BALL DESCRIPTION ............................................................................................................................ 7
BLOCK DIAGRAM ................................................................................................................................ 8
FUNCTIONAL DESCRIPTION .............................................................................................................. 9
Power-up and Initialization Sequence ................................................................................................... 9
Mode Register and Extended Mode Registers Operation ................................................................... 10
8.2.1
Mode Register Set Command (MRS)............................................................................... 10
8.2.2
Extend Mode Register Set Commands (EMRS) .............................................................. 11
8.2.3
Off-Chip Driver (OCD) Impedance Adjustment ................................................................ 15
8.2.4
On-Die Termination (ODT) ............................................................................................... 18
8.2.5
ODT related timings ......................................................................................................... 18
Command Function ............................................................................................................................. 20
8.3.1
Bank Activate Command.................................................................................................. 20
8.3.2
Read Command ............................................................................................................... 20
8.3.3
Write Command ............................................................................................................... 21
8.3.4
Burst Read with Auto-precharge Command..................................................................... 21
8.3.5
Burst Write with Auto-precharge Command ..................................................................... 21
8.3.6
Precharge All Command .................................................................................................. 21
8.3.7
Self Refresh Entry Command .......................................................................................... 21
8.3.8
Self Refresh Exit Command ............................................................................................. 22
8.3.9
Refresh Command ........................................................................................................... 22
8.3.10
No-Operation Command .................................................................................................. 23
8.3.11
Device Deselect Command.............................................................................................. 23
Read and Write access modes ........................................................................................................... 23
8.4.1
Posted
CAS
..................................................................................................................... 23
8.4.2
Burst mode operation ....................................................................................................... 24
8.4.3
Burst read mode operation ............................................................................................... 25
8.4.4
Burst write mode operation .............................................................................................. 25
8.4.5
Write data mask ............................................................................................................... 26
Burst Interrupt ..................................................................................................................................... 26
Precharge operation............................................................................................................................ 27
8.6.1
Burst read operation followed by precharge ..................................................................... 27
8.6.2
Burst write operation followed by precharge .................................................................... 27
Auto-precharge operation ................................................................................................................... 27
8.7.1
Burst read with Auto-precharge ....................................................................................... 28
8.7.2
Burst write with Auto-precharge ....................................................................................... 28
Refresh Operation ............................................................................................................................... 29
Power Down Mode .............................................................................................................................. 29
8.9.1
Power Down Entry ........................................................................................................... 30
8.9.2
Power Down Exit .............................................................................................................. 30
8.3
8.4
8.5
8.6
8.7
8.8
8.9
Publication Release Date: Jan. 23, 2017
Revision: A09
-1-

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Description Dynamic random access memory 512M DDR2-800, x16 T&R Dynamic random access memory 512M DDR2-800, x16 T&R Dynamic random access memory 512M DDR2-1066, x16 T&R Dynamic random access memory 512M DDR2-800, x16 Dynamic random access memory 512M DDR2-800, x16 Ind Temp T&R
Maker Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
Product Category dynamic random access memory dynamic random access memory dynamic random access memory dynamic random access memory dynamic random access memory
type SDRAM - DDR2 SDRAM - DDR2 SDRAM - DDR2 SDRAM - DDR2 SDRAM - DDR2
Data bus width 16 bit 16 bit 16 bit 16 bit 16 bit
organize 32 M x 16 32 M x 16 32 M x 16 32 M x 16 32 M x 16
Package/box WBGA-84 WBGA-84 WBGA-84 WBGA-84 WBGA-84
storage 512 Mbit 512 Mbit 512 Mbit 512 Mbit 512 Mbit
Supply voltage - max. 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
Supply voltage - min. 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Supply current—max. 100 mA 100 mA 115 mA 100 mA 100 mA
Minimum operating temperature 0 C 0 C 0 C 0 C - 40 C
Maximum operating temperature + 85 C + 85 C + 85 C + 85 C + 95 C
series W9751G6KB W9751G6KB W9751G6KB W9751G6KB W9751G6KB
Installation style SMD/SMT SMD/SMT SMD/SMT SMD/SMT SMD/SMT
Factory packaging quantity 2500 2500 2500 209 2500
Encapsulation Reel Reel Reel Tray Reel
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