λ Bridge Thermal Conductor
A\/X’s new λ-Bridge Thermal Conductor is manufactured with the highest
quality materials for reliable and repeatable performance providing a cost
effective thermal management solution. These devices are constructed
with Aluminum Nitride (AlN) or Beryllium Oxide (BeO) and are available in
standard EIA form factors.
λ-Bridge provides the designer with the ability to manage thermal conditions
by directing heat to a thermal ground plane, heat sink or any other specific
thermal point of interest. The inherently low capacitance makes this device
virtually transparent at RF/microwave frequencies. This device has the added
benefit of offering additional layers of protection to adjacent components from
hot spot thermal loads.
λ-Bridge provides the benefit of increased overall circuit reliability. A\/X’s λ-Bridge is manufactured using one-piece
construction, providing a RoHS compliant SMT package that is fully compatible with high speed automated pick-and-
place processing. It is available in 0302, 0402, 0603 and 0805 EIA case sizes. Custom configurations are also available.
FEATURES
• High Thermal Conductivity
• Low Thermal Resistance
• Low Capacitance
• Increases Circuit Reliability
• RoHS Compliant
• More efficient thermal
management
LB
03
A
APPLICATIONS
• GaN Power Amplifiers
• High RF Power Amplifiers
• Filters
• Synthesizers
• Industrial Computers
• Switch Mode Power
Supplies
• Pin & Laser Diodes
25
Thickness
(mils)
• Between active device and adjacent ground planes
• Specific contact pad to case
• Contact pad to contact pad
• Direct component contact to via pad or trace
• Edges fully metalized
FUNCTIONAL APPLICATIONS
HOW TO ORDER
λ-Bridge
Case Size
OS = 0302
02 = 0402
03 = 0603
05 = 0805
W
Style
H
Termination
T
Packaging
Substrate
A = AIN
B = BeO
W = Edge Wrap
E = No Wrap
Y = Silver Platinum,
non-magnetic Termination
S = Silver over Magnetic
Termination
Consult factory for other termination options
e.g., tin plate and solder plate
T = 1000pcs., 7" reel
T\500 = 500pcs., 7" reel
C = Matrix Tray
Size
(EIA)
0302
0402
0603
0805
Length
(L)
0.77 ± 0.051
(0.030 ± 0.002)
1.02 ± 0.051
(0.040 ± 0.002)
0.52 ± 0.051
(0.060 ± 0.002)
2.03 ± 0.051
(0.080 ±.002)
Width
(W)
0.51 ± 0.051
(0.020 ± 0.002)
0.51 ± 0.051
(0.020 ± 0.002)
0.76 ± 0.051
(0.030 ± 0.002)
1.27 ± 0.051
(0.050 ± 0.002)
Standard Thickness
(T, mils)
T1
T2
20
20
25
40
15
15
20
25
Termination
(t)
0.25 ± 0.051
(0.010 ± 0.002)
0.25 ± 0.051
(0.010 ± 0.002)
0.38 ± 0.051
(0.015 ± 0.002)
0.51 ± 0.051
(0.020 ± 0.002)
Capacitance Value (pF)*
Thickness T1 Thickness T2
0.08
0.07
0.06
0.05
0.08
0.06
0.13
0.08
Capacitance Value (pF)*
Thickness T1 Thickness T2
0.07
0.06
0.05
0.04
0.06
0.05
0.10
0.07
Thermal Resistance (
°
C/W)
AlN
Case Size
Thickness T1 Thickness T2
0302
19
24
0402
25
32
0603
20
25
0805
10
16
Thermal Resistance (
°
C/W)
BeO
Case Size
Thickness T1 Thickness T2
0302
12
15
0402
16
21
0603
13
16
0805
7
11
Thermal Conductivity (mW/
°
C)
Thickness T1 Thickness T2
53
41
40
30
50
40
100
60
Thermal Conductivity (mW/
°
C)
Thickness T1 Thickness T2
81
63
61
46
76
61
153
92
101718
91
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
AVX
:
LB03B20WHT\500 LB05A40WHT LBOSA20WHT\500 LB05A40WHT\500 LB05B25WHC LB02A32WHC
LB03A25WHT\500 LBOSB15WHT LBOSB15WHT\500 LB02B25WHT\500 LB03A25WHC LB03A25WHT
LBOSB15WHC LB02A32WHT\500 LB03B20WHC LB05B25WHT LB02A32WHT LB05A40WHC LB02B25WHC
LB03B20WHT LB05B25WHT\500 LB02B25WHT LBOSA20WHC LBOSA20WHT LB03A25WYT\500
LB03B20WYT\500 LB02B25WYT\500 LB05A40WYT\500 LB03B20WYT LB03A25WYT LB05B25WYT
LB05B25WYT\500 LBOSA20WYT LB05A40WYT LBOSA20WYT\500 LBOSB15WYT\500 LB02B25WYT
LBOSB15WYT LB02A32WYT LB02A32WYT\500 LB0SB20WYT\500 LB03B25WYT\500 LB02B20WYT\500
LB05B40WYT\500 LB02A20WYT\500
PCB Design
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