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CP2,127,06,L1,W4.5

Description
Thermoelectric module CP2,127,06,L1,W4.5 62x62x4.6mm
CategoryThermal management products    The thermoelectric    The thermoelectric module   
File Size454KB,2 Pages
ManufacturerLaird
Environmental Compliance
Download Datasheet Parametric View All

CP2,127,06,L1,W4.5 Overview

Thermoelectric module CP2,127,06,L1,W4.5 62x62x4.6mm

CP2,127,06,L1,W4.5 Parametric

Parameter NameAttribute value
MakerLaird
Product CategoryThermoelectric module
typeCeramic Plate
Qmax120 W
ΔTmax+ 67 C
Maximum current14 A
maximum voltage15.4 V
seriesCP Series
Factory packaging quantity20
Ceramic Plate Series CP10,31,05
Innovative
Technology
for a
Connected
World
Thermoelectric Modules
The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered
‘the standard’ in the thermoelectric industry.
This broad product line of high-performance and highly reliable TEMs is available
in numerous heat pumping capacities, geometric shapes, and input power ranges.
Assembled with Bismuth Telluride semiconductor material and thermally conductive
Aluminum Oxide ceramics, the CP Series is designed for higher current and large
heat-pumping applications.
FeatureS
• Precise Temperature Control
• Compact Geometric Sizes
• Reliable Solid State Operation
• No Sound or Vibration
• Environmentally Friendly
• DC Operation
• RoHS Compliant
perforMance SpecificaTionS
hot Side Temperature (°c)
Qmax (Watts)
delta Tmax (°c)
imax (amps)
Vmax (Volts)
Module resistance (ohms)
Suffix ThickneSS
(prior To Tinning)
l
l1
l2
Ml
lM
MM
Suffix
rT
ep
0.126”± 0.010”
0.126”± 0.001”
0.126”± 0.0005”
0.130”± 0.010”
0.130”± 0.010”
0.134”± 0.010”
SealanT color
RTV
Epoxy
White
Black
25°C
8.2
67
3.9
3.8
0.82
flaTneSS &
paralleliSM
aPPliCationS
• Medical Lasers
• Lab Science Instrumentation
• Clinical Diagnostic Systems
• Photonics Laser Systems
• Electronic Enclosure Cooling
• Food & Beverage Cooling
• Chillers (Liquid Cooling)
50°C
9.2
75
3.9
4.0
0.92
hoT
face
Lapped
Lapped
Lapped
Metallized
Lapped
Metallized
deScripTion
Non-corrosive, silicone adhesive sealant
Low desity syntactic foam epoxy encapsulant
cold
face
Lapped
Lapped
Lapped
Lapped
Metallized
Metallized
lead
length
4.5”
4.5”
4.5”
4.5”
4.5”
4.5”
0.0015” / 0.0015”
0.001” / 0.001”
0.0005” / 0.0005”
0.002” / 0.002”
0.002” / 0.002”
0.002” / 0.002”
TeMp range
-60 to 204 °C
-55 to 150 °C
Sealing oPtion
global
solutions:
local
support
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
clv.customerpos@lairdtech.com
www.lairdtech.com
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